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LTP-747KA LED Dot Matrix Display Datasheet - 0.7-inch (17.22mm) Digit Height - Red-Orange Color - AlInGaP Technology - English Technical Document

Technical datasheet for the LTP-747KA, a 0.7-inch (17.22mm) height, 5x7 dot matrix LED display utilizing AlInGaP red-orange chips. Includes specifications, pinout, dimensions, and electrical/optical characteristics.
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PDF Document Cover - LTP-747KA LED Dot Matrix Display Datasheet - 0.7-inch (17.22mm) Digit Height - Red-Orange Color - AlInGaP Technology - English Technical Document

1. Product Overview

The LTP-747KA is a single-digit, 5 x 7 dot matrix alphanumeric display module. Its primary function is to provide a clear, bright visual output for characters and symbols in various electronic applications. The core component of this display is the use of advanced Aluminium Indium Gallium Phosphide (AlInGaP) semiconductor material for the light-emitting diode (LED) chips, which are responsible for generating the characteristic red-orange light output. This material technology is known for its high efficiency and good performance characteristics.

The device is constructed with a gray-colored faceplate and features white-colored dots or segments, which enhances the contrast and readability of the illuminated elements against the background. The display is categorized based on its luminous intensity, meaning units are binned or sorted according to their measured light output to ensure consistency within specified ranges for applications requiring uniform brightness.

2. Technical Specifications Deep Dive

This section provides a detailed, objective analysis of the key technical parameters specified in the datasheet.

2.1 Optical Characteristics

The optical performance is central to the display's function. Key parameters are measured under specific test conditions, typically at an ambient temperature (TA) of 25°C.

2.2 Electrical Characteristics

Understanding the electrical behavior is crucial for proper circuit design and ensuring long-term reliability.

2.3 Absolute Maximum Ratings and Thermal Considerations

These ratings define the limits beyond which permanent damage to the device may occur. They are not conditions for normal operation.

3. Binning and Categorization System

The datasheet explicitly states that the device is "categorized for luminous intensity." This implies a binning process.

4. Performance Curve Analysis

The datasheet references "Typical Electrical / Optical Characteristic Curves." While the specific graphs are not provided in the text, we can infer their standard content and significance.

5. Mechanical and Packaging Information

5.1 Physical Dimensions

The display has a digit height of 0.7 inches, which is equivalent to 17.22 millimeters. The package dimensions drawing (referenced but not shown in text) would detail the overall length, width, height, lead spacing, and segment arrangement. Tolerances for all dimensions are specified as ±0.25 mm (0.01 inches) unless otherwise noted. This level of precision is important for mechanical fitting on a printed circuit board (PCB).

5.2 Pin Connection and Internal Circuit

The device has 12 pins. The pinout is clearly defined: Pin 1: Anode for Column 1, Pin 2: Cathode for Row 3, Pin 3: Anode for Column 2, and so on. The internal circuit diagram shows a common-cathode configuration for the rows. This means each of the 7 row lines is connected to the cathodes of all 5 LEDs in that row. The 5 column lines are connected to the anodes of the LEDs in each column. This matrix arrangement allows control of 35 individual dots (5x7) with only 12 pins (5+7), using multiplexing techniques.

5.3 Polarity Identification

While not explicitly shown in the text, the pin numbering and the internal circuit diagram provide the necessary information for polarity. The pinout table is the definitive guide for connecting anodes and cathodes correctly. Incorrect polarity connection (applying forward bias to the cathode) will prevent the LED from illuminating and, if the voltage exceeds the reverse voltage rating (5V), may damage it.

6. Soldering and Assembly Guidelines

The key guideline provided is the soldering temperature profile: the temperature measured 1.6mm below the package body must not exceed 260°C for more than 3 seconds. This is a standard guideline for wave soldering or reflow soldering processes. For manual soldering, a temperature-controlled iron should be used, and contact time with the leads should be minimized to prevent heat from traveling up the lead and damaging the internal chip. Proper ESD (Electrostatic Discharge) precautions should be observed during handling and assembly to prevent damage to the semiconductor junctions.

7. Application Suggestions

7.1 Typical Application Scenarios

Due to its 5x7 dot matrix format, which is ideal for generating alphanumeric characters, the LTP-747KA is well-suited for applications requiring clear, single-digit readouts. Examples include:

7.2 Design Considerations

8. Technical Comparison and Differentiation

While a direct comparison with other part numbers is not provided, the LTP-747KA's key differentiators based on its datasheet are:

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the difference between peak forward current (90mA) and the test condition current (32mA)?

The peak forward current (90mA) is an Absolute Maximum Rating—the highest instantaneous current the LED can withstand without immediate damage. The 32mA used in the luminous intensity test is a typical operating condition for measurement in a multiplexed (1/16 duty cycle) system. The average current in that case is much lower (32mA / 16 = 2mA). The design must ensure instantaneous currents stay below 90mA and average currents per dot stay below 13mA (derated for temperature).

9.2 How do I interpret the 1/16 duty cycle specification?

This indicates the standard multiplexing drive method. To control 7 rows with 5 columns, a common technique is to activate one row at a time, cycling through all 7 rows rapidly. If each row is on for an equal time, it is active for 1/7 of the time. The 1/16 duty is a conservative, standardized test condition that allows for comparison between different displays, even if the actual multiplexing scheme in your application is 1/7 or 1/8 duty.

9.3 Why is the forward voltage given as a range (2.05V min, 2.6V typ/max)?

Forward voltage (VF) has a natural variation due to manufacturing tolerances in the semiconductor material. The circuit design must accommodate this range. The current-limiting resistor should be calculated using the maximum VF (2.6V) to guarantee that even a device with high VF receives sufficient voltage to turn on and achieve the desired current. Using the typical value for calculation risks under-driving some units.

10. Design and Usage Case Example

Scenario: Designing a single-digit temperature readout for an industrial controller operating in an environment up to 50°C.

  1. Character Set: The 5x7 matrix can display numbers 0-9 and letters like "C" for Celsius.
  2. Driver Selection: A microcontroller with at least 12 I/O pins or a dedicated display driver IC (like the MAX7219) would be used to handle the multiplexing timing.
  3. Current Calculation: Target an average dot current for good brightness. Suppose we choose 8mA average. At 50°C, derating applies: Derating = (50°C - 25°C) * 0.17 mA/°C = 4.25 mA. Maximum allowed average current at 50°C = 13 mA - 4.25 mA = 8.75 mA. Our target of 8mA is safe.
  4. Resistor Calculation: For a 1/7 multiplex (7 rows), the peak current per dot needs to be 8mA * 7 = 56mA to achieve an 8mA average. This is below the 90mA peak rating. Using a 5V supply and VF(max)=2.6V, the current-limiting resistor is R = (5V - 2.6V) / 0.056A ≈ 42.9Ω. A standard 43Ω resistor would be used.
  5. PCB Layout: The display footprint would match the dimension drawing. Adequate space around the package would be left for airflow.

11. Operating Principle

The LTP-747KA operates on the principle of electroluminescence in a semiconductor p-n junction. When a forward voltage exceeding the diode's built-in potential is applied (anode positive relative to cathode), electrons from the n-type AlInGaP layer recombine with holes from the p-type layer. This recombination event releases energy in the form of photons (light). The specific composition of the AlInGaP alloy (Aluminium, Indium, Gallium, Phosphorus) determines the bandgap energy of the semiconductor, which directly dictates the wavelength (color) of the emitted light—in this case, red-orange at ~621 nm. The chips are mounted on a non-transparent Gallium Arsenide (GaAs) substrate, which helps reflect light upward, improving overall light extraction efficiency from the top surface of the device. The 5x7 matrix is formed by individually addressable LEDs arranged in this grid pattern, controlled via external multiplexing circuitry that rapidly sequences power through the rows and columns to create the illusion of a stable, fully lit character.

12. Technology Trends and Context

AlInGaP LED technology, as used in the LTP-747KA, represented a significant advancement over earlier LED materials like GaAsP. It enabled higher brightness, improved efficiency, and better temperature stability, making LEDs viable for a wider range of indicator and display applications. The trend in display technology has since moved towards higher-density dot matrices, full-color RGB matrices, and the widespread adoption of organic LED (OLED) and micro-LED displays for high-resolution screens. However, single and multi-digit alphanumeric dot matrix displays like the 5x7 format remain highly relevant for cost-effective, reliable, and easily readable interfaces in industrial, appliance, and instrumentation contexts where full graphical capability is not required. The underlying drive principles—multiplexing and current control—remain fundamental to LED display design regardless of the scale or technology.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.