1206 Chip LED Pure White Diffused Technical Datasheet - Size 1.6x0.8x1.0mm - Voltage 2.6-3.0V - Power 110mW - English

1. Product Overview

This document details the specifications for a 1206 package surface mount chip LED. This component is designed for high-density printed circuit board (PCB) applications where space is at a premium. The device features a compact footprint, a low profile of 1.0mm, and is supplied on tape and reel for compatibility with automated pick-and-place assembly equipment.

The core advantages of this LED include its compatibility with standard infrared and vapor phase reflow soldering processes, making it suitable for high-volume manufacturing. It is a mono-color type, emitting pure white light through a yellow diffused resin lens. The product is constructed using lead-free materials and complies with relevant environmental regulations.

The primary target markets for this component are consumer electronics, automotive interiors (non-critical lighting), telecommunications equipment, and general indicator applications. Its small size and light weight make it ideal for backlighting switches, symbols, and LCD panels in miniature devices.

2. Technical Parameter Deep-Dive

2.1 Electro-Optical Characteristics

The key performance metrics are defined at an ambient temperature (Ta) of 25°C. The luminous intensity (Iv) ranges from a minimum of 45.0 millicandelas (mcd) to a maximum of 112 mcd when driven at a forward current (IF) of 5mA. The typical viewing angle (2θ1/2) is 140 degrees, providing a wide field of illumination suitable for backlighting and indicator purposes.

The forward voltage (VF) specification is critical for circuit design. It ranges from 2.60V to 3.00V at 5mA. Designers must ensure the driving circuit can accommodate this voltage range to achieve consistent brightness. The reverse current (IR) is specified at a maximum of 50 microamperes when a reverse voltage (VR) of 5V is applied, indicating the diode's leakage characteristics.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. The device can withstand a reverse voltage (VR) of up to 5V. The maximum continuous forward current (IF) is 25mA. For pulsed operation, a peak forward current (IFP) of 100mA is allowed under a duty cycle of 1/10 at 1kHz. The maximum power dissipation (Pd) is 110mW. The electrostatic discharge (ESD) withstand voltage is 150V (Human Body Model), necessitating proper ESD handling precautions during assembly.

The operating temperature range (Topr) is from -40°C to +85°C, and the storage temperature range (Tstg) is from -40°C to +90°C. The soldering temperature profile is crucial: for reflow soldering, the peak temperature should not exceed 260°C for more than 10 seconds; for hand soldering, the iron tip temperature should not exceed 350°C for more than 3 seconds.

3. Binning System Explanation

To ensure consistency in production, the LEDs are sorted into bins based on key parameters.

3.1 Luminous Intensity Binning

The luminous output is categorized into four bins (P1, P2, Q1, Q2) when measured at IF=5mA. The bins define specific ranges: P1 (45.0-57.0 mcd), P2 (57.0-72.0 mcd), Q1 (72.0-90.0 mcd), and Q2 (90.0-112 mcd). A tolerance of ±11% applies within each bin. This allows designers to select a brightness grade appropriate for their application, balancing cost and performance.

3.2 Forward Voltage Binning

The forward voltage is grouped under code "T" and further divided into sub-bins: 28 (2.60-2.70V), 29 (2.70-2.80V), 30 (2.80-2.90V), and 31 (2.90-3.00V). A tolerance of ±0.05V is specified. Selecting LEDs from a tight voltage bin can help achieve more uniform current distribution when multiple LEDs are connected in parallel.

3.3 Chromaticity Coordinate Binning

The color of the white light is defined by its chromaticity coordinates on the CIE 1931 diagram. The provided data shows bins within group "C," each defined by a quadrilateral area of x and y coordinates (e.g., Bin 1: x=0.274-0.294, y=0.226-0.286). The tolerance for these coordinates is ±0.01. This binning ensures color consistency across different production batches, which is vital for applications requiring uniform appearance.

4. Performance Curve Analysis

The datasheet references typical electro-optical characteristic curves. While the specific graphs are not detailed in the provided text, such curves typically illustrate the relationship between forward current and luminous intensity, forward voltage versus temperature, and the spectral power distribution. Analyzing these curves is essential for understanding performance under non-standard conditions, such as different drive currents or ambient temperatures. Designers can use this data to optimize drive circuitry for efficiency and longevity.

5. Mechanical and Package Information

5.1 Package Outline Dimensions

The 1206 package has nominal dimensions of 1.6mm in length, 0.8mm in width, and a height of 1.0mm. The dimensional drawing provides detailed measurements for the LED body, the cathode indicator, and the solder pad recommendations. All unspecified tolerances are ±0.1mm. The cathode is typically marked by a green dot or a notch on the package.

5.2 Polarity Identification

Correct polarity is crucial for operation. The component has an anode and a cathode. The package includes a visual marker (such as a green dot or a chamfered corner) to identify the cathode terminal. The PCB footprint design must align with this marking to prevent reverse installation during automated assembly.

6. Soldering and Assembly Guidelines

The device is fully compatible with infrared (IR) and vapor phase reflow soldering processes. The critical parameter is the peak body temperature during reflow, which must not exceed 260°C for more than 10 seconds. A standard lead-free reflow profile is recommended. For manual repair, hand soldering should be performed quickly, with the iron tip temperature not exceeding 350°C for a maximum of 3 seconds per pad to prevent thermal damage to the epoxy resin and the semiconductor die.

Due to its sensitivity to electrostatic discharge (ESD rating: 150V HBM), proper ESD controls (e.g., grounded workstations, wrist straps) must be employed during handling and assembly.

7. Packaging and Ordering Information

The LEDs are supplied on 8mm wide embossed carrier tape wound onto 7-inch diameter reels. Each reel contains 2000 pieces. The reel dimensions and carrier tape pocket specifications are provided to ensure compatibility with automated feeders. For moisture sensitivity, the reels are packaged in aluminum moisture-proof bags with desiccant and a humidity indicator card to protect the components during storage and transit.

The part number follows a specific coding system that encapsulates key attributes. For example, elements within the part number indicate the luminous intensity rank (CAT), chromaticity coordinates (HUE), and forward voltage rank (REF), allowing for precise selection of binned components.

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Ideal for backlighting membrane switches, icons, and symbols on control panels, dashboards, and consumer appliances.
• Status Indicators: Suitable as power, connectivity, or function status indicators in telecommunications equipment, networking devices, and industrial controls.
• LCD Backlighting: Can be used in arrays for edge-lit or direct-lit flat backlighting of small monochrome or color LCD displays.
• General Purpose Illumination: Useful in low-power decorative lighting, accent lighting, and task lighting where miniaturization is key.

8.2 Design Considerations

• Current Limiting: Always use a series current-limiting resistor or a constant-current driver. The forward voltage has a range, so design for the maximum VF to ensure the LED does not exceed its maximum current rating.
• Thermal Management: While power dissipation is low, ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or near the maximum current to maintain longevity.
• Optical Design: The diffused lens provides a wide viewing angle but reduces peak axial intensity. Consider this for applications requiring directed light.
• Binning Selection: For applications requiring uniform brightness or color, specify the required intensity and chromaticity bins to the supplier.

9. Technical Comparison

Compared to larger through-hole LEDs or even other SMD packages like 0805 or 0603, the 1206 package offers a balance between ease of handling (for manual and automated assembly) and a slightly larger surface area for heat dissipation than smaller footprints. Its 1.0mm height is standard for many backlighting applications. The key differentiator for this specific part is its pure white color point and diffused lens, which may offer a different aesthetic or optical performance compared to clear-lens or colored LEDs in the same package.

10. Frequently Asked Questions (FAQs)

Q: What is the recommended drive current for this LED?
A: The electro-optical characteristics are specified at 5mA. While the maximum continuous current is 25mA, operating at or below 20mA is typical for a balance of brightness, efficiency, and long-term reliability. Always refer to the derating curves if available.

Q: Can I use this LED in an automotive exterior application?
A: The operating temperature range (-40°C to +85°C) covers many automotive environments. However, this datasheet does not specify AEC-Q101 qualification or other automotive-grade reliability tests. For exterior or safety-critical applications, a component specifically qualified for automotive use should be selected.

Q: How do I interpret the part number for ordering?
A: The part number encodes the binning information. To ensure you receive LEDs with the specific luminous intensity, color, and forward voltage you require, you must provide the complete part number, which includes codes for CAT (intensity), HUE (color), and REF (voltage) ranks.

Q: Is a current-limiting resistor necessary?
A> Yes, absolutely. LEDs are current-driven devices. Connecting them directly to a voltage source exceeding their forward voltage will cause excessive current to flow, leading to immediate failure. A series resistor or active constant-current circuit is mandatory.

11. Practical Design Case

Scenario: Designing a backlight for a set of four membrane switches on a medical device panel. Uniform brightness is required.

Design Steps:

1. Selection: Choose this 1206 white diffused LED for its wide viewing angle and small size.
2. Binning: Specify the Q1 luminous intensity bin (72-90 mcd) and a specific chromaticity bin (e.g., C1) to ensure color and brightness matching across all four switches.
3. Circuit Design: Plan to drive all four LEDs in parallel from a 5V rail. Calculate the current-limiting resistor value based on the maximum forward voltage (3.00V) from the T31 voltage bin to guarantee safe operation: R = (V_supply - VF_max) / I_F = (5V - 3.0V) / 0.02A = 100 Ohms. Use a 100-ohm, 1/10W resistor per LED.
4. Layout: Place the LEDs centrally under each switch diffuser. Follow the recommended solder pad layout from the datasheet to ensure good solder joint reliability. Include a small copper pour connected to the cathode pads for slight thermal improvement.
5. Assembly: Use the specified reflow profile. Inspect the polarity after assembly.

12. Operating Principle

This is a semiconductor light-emitting diode. When a forward voltage exceeding its bandgap energy is applied across the anode and cathode, electrons and holes recombine in the active region (composed of InGaN for white light generation). This recombination process releases energy in the form of photons (light). The specific material composition and phosphor coating (in the case of white LEDs) determine the wavelength and color of the emitted light. The yellow diffused resin lens encapsulates the chip, providing mechanical protection, shaping the light output beam, and scattering the light to create a wider, more uniform viewing angle.

13. Technology Trends

The surface-mount device (SMD) LED market continues to trend towards higher efficiency (more lumens per watt), smaller package sizes (e.g., 0402, 0201), and improved color rendering indices (CRI) for white LEDs. There is also a focus on increasing reliability and thermal performance to enable higher drive currents in compact spaces. Furthermore, integration of control electronics directly with the LED die (e.g., smart LEDs with embedded ICs) is an emerging trend for advanced lighting applications. The component described in this datasheet represents a mature, widely adopted package style that remains highly relevant for cost-effective, reliable indicator and backlighting solutions.