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LTP-1557AKA LED Dot Matrix Display Datasheet - 1.2 inch (30.42mm) Height - AlInGaP Red Orange - 5x7 Array - English Technical Document

Technical datasheet for the LTP-1557AKA, a 1.2-inch 5x7 dot matrix LED display utilizing AlInGaP Red Orange chips. Includes specifications, pinout, ratings, and characteristics.
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PDF Document Cover - LTP-1557AKA LED Dot Matrix Display Datasheet - 1.2 inch (30.42mm) Height - AlInGaP Red Orange - 5x7 Array - English Technical Document

1. Product Overview

The LTP-1557AKA is a single-digit, alphanumeric display module designed for applications requiring clear, reliable character output. Its core function is to visually represent information through a grid of individually controllable light-emitting diodes (LEDs).

1.1 Core Advantages and Target Market

This device offers several key advantages that make it suitable for a range of industrial and commercial applications. Its primary benefits include a low power requirement, which is essential for battery-operated or energy-sensitive systems. The solid-state reliability of LED technology ensures long operational life and resistance to shock and vibration compared to filament-based or other mechanical displays. The single-plane, wide viewing angle design provides good visibility from various positions, which is crucial for user interfaces. Finally, its compatibility with standard character codes (USASCII and EBCDIC) and horizontal stackability simplifies integration into systems requiring multi-digit displays. Typical target markets include instrumentation panels, point-of-sale terminals, industrial control systems, and test equipment where durable, legible character output is needed.

2. Technical Specifications Deep Dive

This section provides a detailed, objective analysis of the device's electrical, optical, and physical parameters.

2.1 Photometric and Optical Characteristics

The optical performance is defined at an ambient temperature (Ta) of 25°C. The device utilizes AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material for its LED chips, which are fabricated on a non-transparent GaAs substrate. This material choice is known for high efficiency in the red-orange spectrum. The display has a gray face with white dot color for contrast.

2.2 Electrical Parameters

All electrical characteristics are also specified at Ta=25°C.

2.3 Absolute Maximum Ratings and Thermal Considerations

These ratings define the stress limits beyond which permanent damage may occur. They are not for continuous operation.

3. Binning System Explanation

The datasheet indicates the device is categorized for luminous intensity. This refers to a manufacturing binning process. During production, LEDs exhibit natural variations in performance. Devices are tested and sorted (binned) based on their measured luminous intensity. This allows customers to select parts within a specific brightness range (e.g., the 2100-3800 μcd range specified), ensuring consistency in the brightness of the final product. The datasheet does not specify separate bins for wavelength or forward voltage, suggesting primary sorting is based on light output.

4. Performance Curve Analysis

The datasheet references Typical Electrical/Optical Characteristic Curves. While the specific graphs are not detailed in the provided text, such curves typically included in full datasheets are essential for design. Engineers would expect to see:

These curves allow designers to predict performance under real-world, non-ideal conditions beyond the single-point data given in the tables.

5. Mechanical and Package Information

5.1 Physical Dimensions

The device is described as having a 1.2 inch (30.42 mm) matrix height. This refers to the height of the 5x7 dot array itself. A detailed package dimension drawing is referenced, with all dimensions in millimeters and standard tolerances of ±0.25 mm unless otherwise noted. This drawing is crucial for PCB (Printed Circuit Board) footprint design and mechanical integration.

5.2 Pin Connection and Internal Circuit

The device uses a 14-pin configuration. The pinout table clearly defines the function of each pin, specifying connections to specific anode rows (1-7) and cathode columns (1-5). This common-cathode per column architecture (where multiple LED anodes in a column share a common cathode pin) is standard for multiplexed matrix displays. An internal circuit diagram is referenced, which would visually show this row-anode, column-cathode matrix arrangement, confirming the multiplexing scheme. Correct interpretation of this pinout is essential for designing the driving circuitry.

6. Soldering and Assembly Guidelines

The key assembly specification provided is the reflow soldering profile limit: a maximum temperature of 260°C for a maximum duration of 3 seconds, measured at a point 1.6mm below the package body. This information is vital for process engineers to set up soldering ovens to prevent thermal damage to the LED chips or the package. For storage, the specified range of -35°C to +85°C should be maintained to preserve device integrity before use.

7. Application Recommendations

7.1 Typical Application Scenarios

This display is ideal for applications requiring a single, highly legible character or symbol. Examples include status indicators on industrial machinery (showing codes like 'A', 'C', 'F'), digit positions in larger multi-digit displays (when stacked), simple readouts on test equipment, or as part of a user interface on specialized devices.

7.2 Design Considerations

8. Technical Comparison and Differentiation

Compared to older technologies like incandescent or vacuum fluorescent displays (VFDs), the LTP-1557AKA offers superior shock/vibration resistance, lower power consumption, and longer lifetime. Compared to other LED matrix displays, its use of AlInGaP technology for red-orange offers higher efficiency and potentially better color stability over time and temperature compared to older GaAsP (Gallium Arsenide Phosphide) red LEDs. The specific combination of a 1.2" character height, 5x7 resolution, and the defined brightness/intensity binning are its key differentiating physical and performance specs within the LED matrix display category.

9. Frequently Asked Questions (Based on Technical Parameters)

  1. Q: Can I drive this display with a constant DC current on each dot? A: Technically yes, but it is highly inefficient for a matrix. It would require 35 individual current-limiting circuits (5x7). Multiplexing is the standard and intended method, significantly reducing the required driver pins and components.
  2. Q: The max average current is 13mA, but my multiplexing scheme uses a 1/16 duty cycle. What peak current can I use? A: You can calculate the allowable peak current: I_peak = I_avg / Duty Cycle. For 1/16 duty, I_peak = 13mA / 0.0625 = 208mA. However, you must also ensure this peak current does not exceed the absolute maximum peak current rating of 90mA. Therefore, the 90mA limit is the governing constraint in this case.
  3. Q: What is the difference between peak wavelength and dominant wavelength? A: Peak wavelength is the physical wavelength where the LED emits the most optical power. Dominant wavelength is the perceptual single wavelength that matches the color the human eye sees. They often differ slightly due to the shape of the LED's emission spectrum.
  4. Q: The storage temperature is the same as operating temperature. Does this mean I can leave it powered on at -35°C? A: The operating range indicates the device will function within specifications across that range. However, performance (like luminous intensity) will vary with temperature. The storage range simply indicates the conditions under which the unpowered device will not be damaged. Reliable operation at extreme ends of the range should be verified in the application.

10. Design and Usage Case Study

Scenario: Designing a single-digit error code display for an industrial sensor. The sensor has a microcontroller that detects various fault conditions (e.g., Overload, Sensor Fail, Calibration Error). Each fault is assigned an alphanumeric code ('O', 'F', 'C'). The LTP-1557AKA is chosen for its durability in an industrial setting. The microcontroller's I/O pins, insufficient to drive 35 dots directly, are connected to a dedicated LED driver IC. The driver handles the multiplexing, retrieving the correct 5x7 font pattern from a lookup table in memory based on the error code. A current-limiting resistor network is calculated based on the desired brightness, the forward voltage, the supply voltage, and the multiplexing duty cycle, carefully ensuring the peak and average current limits are not exceeded. The display provides an immediate, clear visual indication of the fault type to maintenance personnel.

11. Operating Principle Introduction

The LTP-1557AKA is a passive matrix LED display. It contains 35 independent AlInGaP LED chips arranged in a grid of 5 columns and 7 rows. Each LED is connected between one row anode and one column cathode. To illuminate a specific dot, a positive voltage is applied to its corresponding row anode pin, while its corresponding column cathode pin is connected to ground (or a lower voltage). The internal semiconductor structure of each LED chip consists of P-type and N-type AlInGaP layers forming a PN junction. When forward-biased (anode positive relative to cathode), electrons and holes recombine in the junction, releasing energy in the form of photons (light) at a wavelength determined by the bandgap energy of the AlInGaP material. The display is multiplexed: instead of lighting all desired dots simultaneously, the controller rapidly cycles through the rows (or columns), lighting only the dots in the active row that are part of the character. This happens faster than the human eye can perceive, creating the illusion of a stable, fully lit character while drastically reducing the number of required driver pins from 35 to 12 (7 rows + 5 columns).

12. Technology Trends and Context

Displays like the LTP-1557AKA represent a mature, well-established technology. The trend in information display has largely moved towards higher-density, multi-color, and graphical solutions like OLEDs, TFT LCDs, and finer-pitch LED matrices. However, single-character or small digit displays like this remain highly relevant in specific niches due to their simplicity, robustness, high brightness, wide operating temperature range, and low cost for applications that do not require complex graphics. The underlying AlInGaP material technology itself was a significant advancement over older GaAsP, offering improved efficiency and color purity for red, orange, and amber LEDs. Future developments in this segment focus on further increasing efficiency (lumens per watt), improving uniformity, and potentially integrating the driver electronics more closely with the display package to simplify end-user design. For ultra-low-power or sunlight-readable applications, these types of discrete LED arrays continue to be a preferred choice over more complex display technologies.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.