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LTP-2157AKA LED Dot Matrix Display Datasheet - 2.0-inch (50.8mm) Height - Super Orange Color - 5x7 Array - English Technical Document

Technical datasheet for the LTP-2157AKA, a 2.0-inch 5x7 dot matrix LED display utilizing AlInGaP Super Orange LED chips. Includes specifications, pinout, ratings, and characteristics.
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PDF Document Cover - LTP-2157AKA LED Dot Matrix Display Datasheet - 2.0-inch (50.8mm) Height - Super Orange Color - 5x7 Array - English Technical Document

1. Product Overview

The LTP-2157AKA is a single-plane, 5x7 dot matrix LED display module designed for alphanumeric character presentation. Its primary function is to display characters from standard code sets such as USASCII and EBCDIC. The core advantage of this device lies in its utilization of AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology for the LED chips, which provides the Super Orange emission. The display features a gray face and white dot color, enhancing contrast for improved readability. The device is categorized for luminous intensity, ensuring consistency in brightness across units. Its solid-state construction offers high reliability, and the low power requirement makes it suitable for various electronic applications.

1.1 Core Features and Target Applications

The key features defining this product include a 2.0-inch (50.8 mm) matrix character height, which offers good visibility from a distance. It operates with a single plane and provides a wide viewing angle, making the displayed information accessible from various positions. The 5x7 array with X-Y select architecture allows for efficient multiplexing control. A significant feature is its horizontal stackability, enabling the creation of multi-character displays by aligning multiple units side-by-side. The device is directly compatible with standard character codes. These characteristics make the LTP-2157AKA ideal for applications such as industrial instrument panels, point-of-sale terminals, basic information displays, test equipment readouts, and other embedded systems requiring reliable, low-to-medium complexity alphanumeric output.

2. Technical Specifications and Objective Interpretation

This section provides a detailed, objective analysis of the device's electrical, optical, and physical parameters as defined in the datasheet.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

2.2 Electrical & Optical Characteristics

These parameters are measured under specified test conditions (typically Ta=25°C) and represent typical performance.

3. Binning System Explanation

The datasheet indicates the device is \"Categorized for Luminous Intensity.\" This implies a binning or sorting process post-manufacturing. While specific bin codes are not listed, typical categorization for such displays involves grouping units based on measured luminous intensity under standard test conditions. This ensures that when multiple displays are used together, the brightness variation between them is minimized, providing a consistent visual output. Designers should verify the available intensity bins from the supplier for critical applications requiring matched brightness.

4. Performance Curve Analysis

The datasheet references \"Typical Electrical / Optical Characteristic Curves.\" Although the specific graphs are not provided in the text, standard curves for such devices typically include:

These curves allow designers to predict performance under non-standard conditions and optimize their driver circuitry.

5. Mechanical and Package Information

The device's package dimensions are provided in millimeters with a general tolerance of ±0.25 mm. The specific drawing is referenced but not detailed in the text. Key mechanical aspects include the overall footprint, height, and the spacing of the 14 pins. The pin arrangement is designed for through-hole mounting on a printed circuit board (PCB). The gray face and white dot color are part of the package design to improve contrast.

5.1 Pin Connection and Internal Circuit

The display has 14 pins. The internal circuit diagram shows a matrix configuration where the anodes of the LEDs are connected by rows and the cathodes by columns (or vice-versa, as per the pinout table). This is a common common-anode or common-cathode matrix architecture that minimizes the number of control pins required (5 rows + 7 columns = 12 control lines instead of 5*7=35). The pinout table specifies the function of each pin:

6. Soldering and Assembly Guidelines

The primary guideline provided is for the soldering process: the device can withstand a maximum solder temperature of 260°C for a maximum of 3 seconds, measured 1.6mm (1/16 inch) below the seating plane. This is a standard reflow profile constraint. For wave soldering, standard practices for through-hole components should be followed. General handling precautions for static-sensitive devices (ESD) should be observed, although not explicitly stated for this LED product. Storage should be within the specified temperature range of -35°C to +85°C in a dry environment.

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

The LTP-2157AKA requires an external driver circuit. Due to its matrix structure, multiplexing is the standard driving method. This involves sequentially activating one row (or column) at a time while providing the appropriate data signals to the columns (or rows). A microcontroller with sufficient I/O pins or a dedicated LED display driver IC (like the MAX7219 or similar) is typically used. The driver must supply the correct current, respecting the peak and average current ratings. Current-limiting resistors are mandatory for each column or row line to set the forward current (IF). The value is calculated using the formula: R = (Vsupply - VF - Vdriver_sat) / IF.

7.2 Design Considerations

8. Technical Comparison and Differentiation

Compared to older technology like standard GaAsP or GaP LEDs, the AlInGaP technology in the LTP-2157AKA offers significantly higher luminous efficiency, resulting in brighter output for the same current, and better color purity. Compared to simple 7-segment displays, the 5x7 dot matrix format provides true alphanumeric capability, allowing for the display of letters, numbers, and simple symbols. The 2.0-inch height is larger than many common character displays, offering superior visibility. The horizontal stackability is a key differentiator from displays with fixed multi-character modules, providing design flexibility.

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this display with a constant DC current on all dots simultaneously?
A: Theoretically possible but impractical. It would require 35 independent current-limited channels. Multiplexing is the standard and efficient method.

Q2: What is the difference between Peak Emission Wavelength and Dominant Wavelength?
A: Peak wavelength is where the most optical power is emitted. Dominant wavelength is the single-wavelength equivalent perceived by the human eye. They are often close but not identical, especially for broader spectra.

Q3: How do I interpret the 1/16 duty cycle in the luminous intensity test condition?
A: The intensity is measured when the LED is pulsed with a 32mA current in a waveform with a 1/16 duty cycle. This simulates a multiplexed driving scheme where each row is active for 1/16th of the total cycle time. The reported intensity value is the average over time.

Q4: Why are pins 4 & 11 and 5 & 12 internally connected?
A> This is likely due to the internal layout of the matrix to simplify the chip bonding or substrate routing. Electrically, it means these pin pairs are shorted together. In your circuit, you must connect them to the same node.

10. Practical Use Case Example

Scenario: Designing a simple 4-digit temperature readout for an industrial oven.
The system uses a microcontroller with a temperature sensor. Four LTP-2157AKA displays are stacked horizontally. The microcontroller's firmware contains a font map for digits 0-9, the degree symbol, and 'C'. Using a multiplexing routine, it cycles through the four displays (acting as four sets of rows/columns), calculating the appropriate column data for each row based on the current digit to be shown. Current-limiting resistors are placed on the column lines. The refresh rate is set to 100 Hz to eliminate flicker. The high brightness and wide viewing angle ensure the temperature is readable from various positions on the factory floor. The industrial temperature rating of the display ensures reliable operation in the hot environment near the oven.

11. Operating Principle Introduction

The LTP-2157AKA is based on semiconductor electroluminescence. The AlInGaP chip structure forms a p-n junction. When a forward voltage exceeding the junction's threshold is applied, electrons and holes recombine in the active region, releasing energy in the form of photons. The specific alloy composition of AlInGaP determines the bandgap energy, which directly corresponds to the orange wavelength of light emitted (~621 nm). The 5x7 matrix is formed by individually addressable LED dice placed at the intersections of row and column conductors on a substrate. By selectively applying voltage to a specific row and column, only the LED at that intersection is forward-biased and lights up.

12. Technology Trends and Context

AlInGaP technology represents a significant advancement in visible LED efficiency for red, orange, and yellow colors. It has largely superseded older technologies like GaAsP. Current trends in display technology are moving towards higher-density matrices (e.g., 8x8, 16x16) and full-color RGB matrices. However, single-color, low-resolution dot matrix displays like the 5x7 remain highly relevant for cost-sensitive, reliability-critical applications where simple alphanumeric information is sufficient. Their advantages include simplicity, robustness, low power consumption, and excellent longevity. The principle of matrix addressing remains fundamental to larger and more complex display technologies, including OLED and microLED displays.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.