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LED Lamp 339-1SURSYGC/S530-A3 Datasheet - Bicolor/Bipolar - 25mA - Brilliant Red/Yellow Green - English Technical Document

Technical datasheet for the 339-1SURSYGC/S530-A3 bicolor/bipolar LED lamp. Contains detailed specifications, electro-optical characteristics, package dimensions, and application guidelines.
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PDF Document Cover - LED Lamp 339-1SURSYGC/S530-A3 Datasheet - Bicolor/Bipolar - 25mA - Brilliant Red/Yellow Green - English Technical Document

1. Product Overview

The 339-1SURSYGC/S530-A3 is a dual-chip LED lamp designed for applications requiring clear, reliable indicator lighting. It is available in both bicolor and bipolar configurations, offering design flexibility. The primary emitted colors are Brilliant Red and Brilliant Yellow Green, achieved through AlGaInP semiconductor technology. The device is characterized by its solid-state reliability, long operational life, and low power consumption, making it suitable for integration into various electronic systems.

1.1 Core Advantages and Target Market

The key advantages of this LED lamp include matched chips for uniform light output and a wide viewing angle, ensuring consistent visual performance. It is designed to be I.C. compatible, simplifying circuit design. The product complies with relevant environmental regulations, including RoHS, EU REACH, and is Halogen Free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). Its primary target markets and applications are consumer electronics and computing peripherals, specifically:

2. In-Depth Technical Parameter Analysis

This section provides a detailed breakdown of the device's electrical, optical, and thermal specifications.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

Parameter Symbol Rating (SUR/SYG) Unit
Continuous Forward Current IF 25 mA
Peak Forward Current (Duty 1/10 @ 1KHz) IFP 60 mA
Reverse Voltage VR 5 V
Power Dissipation Pd 60 mW
Operating Temperature Topr -40 to +85 °C
Storage Temperature Tstg -40 to +100 °C
Soldering Temperature Tsol 260 (for 5 sec.) °C

2.2 Electro-Optical Characteristics (Ta=25°C)

These are the typical operating parameters under standard test conditions.

Parameter Symbol Min. Typ. Max. Unit Condition
Forward Voltage VF 1.7 2.0 2.4 V IF=20mA
Reverse Current IR -- -- 10 µA VR=5V
Luminous Intensity IV -- 250 (SUR) / 63 (SYG) -- mcd IF=20mA
Viewing Angle (2θ1/2) -- -- 25 -- deg IF=20mA
Peak Wavelength λp -- 632 (SUR) / 575 (SYG) -- nm IF=20mA
Dominant Wavelength λd -- 624 (SUR) / 573 (SYG) -- nm IF=20mA
Spectrum Radiation Bandwidth Δλ -- 20 -- nm IF=20mA

Measurement Notes: Forward Voltage uncertainty is ±0.1V. Luminous Intensity uncertainty is ±10%. Dominant Wavelength uncertainty is ±1.0nm.

3. Performance Curve Analysis

The datasheet provides characteristic curves for both the SUR (Brilliant Red) and SYG (Brilliant Yellow Green) variants. These curves are essential for understanding device behavior under varying conditions.

3.1 SUR (Brilliant Red) Characteristics

The curves for the SUR LED show the relationship between relative intensity and wavelength, directivity pattern, forward current versus forward voltage (I-V curve), relative intensity versus forward current, relative intensity versus ambient temperature, and forward current versus ambient temperature. The I-V curve is typical of a diode, showing an exponential increase in current after the forward voltage threshold (~1.7-2.0V) is reached. The intensity vs. temperature curve shows a decrease in output as ambient temperature rises, which is a common characteristic of LEDs due to increased non-radiative recombination and efficiency droop.

3.2 SYG (Brilliant Yellow Green) Characteristics

The SYG LED shares similar curve types: relative intensity vs. wavelength, directivity, I-V curve, and intensity vs. forward current. Additionally, it includes a curve for chromaticity coordinate vs. forward current, which is crucial for applications where color consistency under different drive conditions is important. The forward current vs. ambient temperature curve helps in thermal management design.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED is housed in a standard lamp-style package. Key dimensional notes from the datasheet include:

A detailed dimensioned drawing is provided in the original datasheet, specifying lead spacing, body diameter, and overall height. Designers must refer to this drawing for accurate PCB footprint creation.

5. Soldering and Assembly Guidelines

Proper handling is critical to maintain LED performance and reliability.

5.1 Lead Forming

5.2 Storage

5.3 Soldering Process

Maintain a distance of at least 3mm from the solder joint to the epoxy bulb.

Parameter Hand Soldering DIP (Wave) Soldering
Iron Tip Temperature 300°C Max. (30W Max.) --
Soldering Time 3 sec Max. --
Preheat Temperature -- 100°C Max. (60 sec Max.)
Bath Temp. & Time -- 260°C Max., 5 sec Max.
Min. Distance to Bulb 3mm 3mm

Additional Soldering Notes:

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage.

6.2 Label Explanation

Labels on the packaging contain the following information:

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

For standard indicator use, a simple series current-limiting resistor is required. The resistor value (Rs) can be calculated using Ohm's Law: Rs = (Vsupply - VF) / IF. Where VF is the typical forward voltage (2.0V) and IF is the desired forward current (e.g., 20mA). Ensure the resistor's power rating is sufficient: PR = (IF)² * Rs.

7.2 Design Considerations

8. Technical Comparison and Differentiation

The 339-1 series differentiates itself through its dual-chip design in a standard lamp package. Compared to single-die LEDs, it offers the possibility of two colors or a bipolar (reverse polarity protection) configuration in the same footprint. The use of AlGaInP technology provides high efficiency for red and yellow-green wavelengths, resulting in good luminous intensity (250 mcd for red, 63 mcd for yellow-green) at a modest 20mA drive current. The wide 25-degree viewing angle ensures visibility from various perspectives, which is advantageous for panel indicators.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the difference between the SUR and SYG versions?

SUR denotes the Brilliant Red LED (λd ~624nm), while SYG denotes the Brilliant Yellow Green LED (λd ~573nm). They differ in the dominant wavelength and typical luminous intensity.

9.2 Can I drive this LED at its maximum continuous current of 25mA?

Yes, but the electro-optical characteristics in the datasheet are specified at 20mA. Operating at 25mA will produce higher light output but will also increase power dissipation and junction temperature, potentially affecting long-term reliability and causing a slight shift in wavelength. It is generally good practice to derate and operate slightly below the absolute maximum rating for improved lifespan.

9.3 What does "bicolor" and "bipolar" mean for this lamp?

Bicolor: The package contains two separate LED chips (e.g., one red, one green) that can be controlled independently. They typically have three leads (common cathode or anode).
Bipolar: The package contains a single LED die but is constructed such that it will light when voltage is applied in either polarity (though likely only one polarity is correct for the intended color). It acts as a simple indicator that lights regardless of DC polarity, often used in AC or polarity-agnostic circuits. The datasheet mentions these are available in White Clear and Color Clear resin.

9.4 How critical is the 3mm minimum distance for soldering and lead bending?

Very critical. The epoxy resin that forms the LED bulb is sensitive to heat and mechanical stress. Soldering or bending closer than 3mm can transfer excessive heat to the semiconductor die, damaging it, or can crack the epoxy, leading to premature failure or moisture ingress.

10. Practical Design and Usage Case

Scenario: Designing a dual-status indicator for a power supply unit.
A designer needs a single component to show "Standby" (yellow) and "On" (red) states. They select the bicolor version of the 339-1 lamp. They design a circuit where a microcontroller pin drives the cathode of the yellow (SYG) die through a current-limiting resistor for standby. Another pin drives the cathode of the red (SUR) die through a separate resistor for the "On" state. The anodes of both dies are tied together to the positive supply rail. The 25° viewing angle ensures the indicator is visible from the front panel. The designer follows the soldering guidelines, ensuring a 3mm gap, and specifies the correct PCB footprint from the package dimensions. They also ensure the storage and handling instructions are passed to the manufacturing team.

11. Technology Principle Introduction

The 339-1 LED lamp utilizes Aluminum Gallium Indium Phosphide (AlGaInP) semiconductor material for its light-emitting region. AlGaInP is a compound semiconductor whose bandgap energy--and thus the color of emitted light--can be tuned by varying the ratios of aluminum, gallium, and indium. A Brilliant Red emission (~624nm) requires a different composition than a Brilliant Yellow Green emission (~573nm). When a forward voltage exceeding the diode's turn-on voltage is applied, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons (light). The specific wavelength of these photons is determined by the bandgap of the AlGaInP material. The epoxy lens serves to protect the semiconductor die, shape the light output beam (25° viewing angle), and enhance light extraction.

12. Industry Trends and Context

While this product represents a mature through-hole LED technology, it remains relevant in applications requiring high reliability, ease of manual assembly, or specific mechanical form factors. The industry trend for indicator lights in consumer electronics has largely shifted towards surface-mount device (SMD) LEDs (e.g., 0603, 0402 packages) for automated assembly and space savings. However, through-hole LEDs like the 339-1 are still widely used in industrial controls, appliances, and areas where superior mechanical bond strength or higher single-point light output from a larger package is desired. The emphasis on environmental compliance (RoHS, REACH, Halogen-Free) seen in this datasheet is a direct reflection of global regulatory trends driving electronics manufacturing towards greener materials and processes.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.