LED Lamp 1003SUGD/S400-A4 Datasheet - Brilliant Green - 20mA - 3.3V - 50mcd - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness Brilliant Green LED lamp. The device is part of a series engineered for applications demanding superior luminous output. It utilizes InGaN chip technology encapsulated in a green diffused resin, resulting in a distinct brilliant green emission. Key features include a wide 110-degree viewing angle, availability on tape and reel for automated assembly, and compliance with RoHS and lead-free requirements, ensuring environmental responsibility and manufacturing compatibility.

The LED is designed for reliability and robustness in various electronic applications. Its construction prioritizes stable performance under standard operating conditions, making it a suitable component for both consumer and industrial electronics where consistent color and light output are critical.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not intended for normal operation.

• Continuous Forward Current (I_F): 25 mA. This is the maximum DC current that can be continuously applied to the LED.
• Peak Forward Current (I_FP): 100 mA. This pulsed current rating (at 1/10 duty cycle, 1 kHz) allows for brief periods of higher drive, useful for multiplexing or strobe effects.
• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (P_d): 90 mW. This is the maximum power the package can dissipate, calculated as V_F * I_F.
• Operating & Storage Temperature: Ranges from -40°C to +85°C (operating) and -40°C to +100°C (storage).
• Soldering Temperature: Withstands 260°C for 5 seconds, compatible with standard lead-free reflow profiles.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of 20mA forward current and 25°C ambient temperature (Ta). They define the typical performance users can expect.

• Luminous Intensity (I_v): Typical value is 50 millicandelas (mcd), with a minimum of 16 mcd. This quantifies the perceived brightness of the green light output.
• Viewing Angle (2θ_1/2): 110 degrees (typical). This wide angle indicates the LED emits light over a broad cone, suitable for area illumination or indicators requiring wide visibility.
• Peak Wavelength (λ_p): 518 nm (typical). This is the wavelength at which the spectral power distribution is maximum.
• Dominant Wavelength (λ_d): 525 nm (typical). This is the single wavelength perceived by the human eye to match the color of the LED, defining its "brilliant green" hue.
• Forward Voltage (V_F): 3.3 V (typical), with a maximum of 4.0 V at 20mA. This is crucial for designing the current-limiting circuitry.
• Reverse Current (I_R): Maximum of 50 µA at 5V reverse bias, indicating good junction integrity.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate performance under varying conditions. These are essential for robust design.

3.1 Spectral & Directivity Distribution

The Relative Intensity vs. Wavelength curve shows a narrow emission spectrum centered around 518-525 nm, characteristic of InGaN-based green LEDs. The Directivity curve visually confirms the 110-degree viewing angle, showing how light intensity decreases from the center axis.

3.2 Electrical & Thermal Characteristics

The Forward Current vs. Forward Voltage (I-V Curve) exhibits the classic exponential diode relationship. At the typical operating point of 20mA, the voltage is approximately 3.3V. Designers must use this curve to ensure the driver can supply sufficient voltage, especially at low temperatures where V_F increases.

The Relative Intensity vs. Forward Current curve is generally linear in the lower current range, indicating stable color and efficiency. The Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature curves demonstrate thermal effects. Luminous output decreases as temperature rises, while forward voltage decreases. This underscores the need for thermal management to maintain consistent brightness.

4. Mechanical & Packaging Information

4.1 Package Dimensions

The LED features a standard radial leaded "lamp" package. Critical dimensions include the lead spacing, body diameter, and overall height. The flange height is specified to be less than 1.5mm. Standard tolerance for dimensions is ±0.25mm unless otherwise noted. Engineers must refer to the detailed dimensioned drawing for precise PCB footprint design.

4.2 Polarity Identification

Polarity is typically indicated by lead length (the longer lead is the anode) and/or a flat spot on the LED lens or body near the cathode lead. Correct polarity is essential for operation.

5. Soldering & Assembly Guidelines

Proper handling is critical to prevent damage and ensure long-term reliability.

5.1 Lead Forming

• Bending must occur at least 3mm from the epoxy bulb base to avoid stress on the seal.
• Form leads before soldering.
• Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

5.2 Soldering Process

Hand Soldering: Iron tip temperature max 300°C (for 30W iron), soldering time max 3 seconds per lead, maintaining a minimum 3mm distance from the joint to the epoxy bulb.
Wave/Dip Soldering: Pre-heat to 100°C max (60 sec max), solder bath at 260°C max for 5 seconds max, with the same 3mm distance rule.
A recommended soldering profile graph suggests a rapid temperature ramp to a peak of 260°C, followed by a controlled cooldown. Avoid rapid cooling. Do not solder more than once. Protect the LED from mechanical shock while hot.

5.3 Cleaning & Storage

Cleaning, if needed, should use isopropyl alcohol at room temperature for ≤1 minute. Avoid ultrasonic cleaning unless pre-qualified. For storage, maintain conditions at ≤30°C and ≤70% RH. For long-term storage beyond 3 months, use a sealed container with nitrogen and desiccant.

5.4 Heat & ESD Management

Thermal management is vital. The operating current should be de-rated based on ambient temperature, referencing the de-rating curve. The LED's performance is temperature-dependent. The device is sensitive to Electrostatic Discharge (ESD). Standard ESD precautions (grounded workstations, wrist straps) must be observed during handling.

6. Packaging & Ordering Information

6.1 Packing Specification

The LEDs are packed in moisture-resistant, anti-static bags. The packing hierarchy is:
1. Unit Quantity: 1,500 pieces per anti-static bag.
2. Inner Carton: 5 bags per inner carton (7,500 pieces total).
3. Master/Outside Carton: 10 inner cartons per master carton (75,000 pieces total).

6.2 Label Explanation

Labels on the packaging include:
- CPN: Customer's Part Number.
- P/N: Manufacturer's Part Number (1003SUGD/S400-A4).
- QTY: Quantity contained.
- CAT/HUE: Indicates rank/color bin based on dominant wavelength.
- LOT No.: Traceable manufacturing lot number.

7. Application Notes & Design Considerations

7.1 Typical Applications

This LED is suitable for backlighting and status indication in:
- Television Sets
- Computer Monitors- General Computing Equipment

7.2 Circuit Design

Always use a series current-limiting resistor. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F. Use the maximum V_F (4.0V) from the datasheet for a robust design that ensures I_F does not exceed 20mA even with component tolerances. For example, with a 5V supply: R = (5V - 4.0V) / 0.020A = 50Ω. A standard 51Ω or 56Ω resistor would be appropriate.

7.3 Thermal Design

In applications where multiple LEDs are used or ambient temperatures are high, consider PCB layout for heat dissipation. Avoid placing LEDs near other heat-generating components. For high-reliability applications, implement active or passive cooling if necessary to keep the LED junction temperature within safe limits, as defined by the de-rating curve.

8. Technical Comparison & Differentiation

Compared to older technology like GaP green LEDs, this InGaN-based LED offers significantly higher brightness (luminous intensity) and a more saturated, "brilliant" green color due to its narrower spectrum and higher dominant wavelength purity. The wide 110-degree viewing angle is advantageous over narrower-angle LEDs when broad visibility is needed without secondary optics. Its RoHS compliance and lead-free soldering capability make it suitable for modern global electronics manufacturing.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between Peak and Dominant Wavelength?

Peak Wavelength (λ_p) is the physical wavelength where the LED emits the most optical power. Dominant Wavelength (λ_d) is a colorimetric quantity representing the single wavelength of the monochromatic light that would appear to have the same color as the LED to a standard human observer. For green LEDs, λ_d is often slightly longer than λ_p.

9.2 Can I drive this LED at 25mA continuously?

While the Absolute Maximum Rating for continuous current is 25mA, the standard test condition and typical performance data are specified at 20mA. Operating at 25mA may produce higher light output but will increase power dissipation (heat) and potentially reduce long-term reliability. It is recommended to design for the typical 20mA drive current unless the application specifically requires the marginal extra brightness and thermal implications are managed.

9.3 How critical is the 3mm distance rule for soldering?

Very critical. The epoxy resin encapsulating the LED chip is sensitive to high temperatures. Soldering too close to the bulb can cause thermal stress, leading to micro-cracks in the epoxy, premature yellowing (reducing light output), or even immediate failure. Always maintain the specified distance.

10. Practical Design Case Study

Scenario: Designing a status indicator panel for a device using ten of these green LEDs, powered from a stable 5V rail on the main PCB.

Design Steps:

1. Current Calculation: Target I_F = 20mA per LED.
2. Resistor Calculation: Using worst-case V_F (4.0V) for reliability: R = (5V - 4.0V) / 0.020A = 50Ω. Select a standard 51Ω, 1/8W or 1/10W resistor. Power dissipation in the resistor: P = I²R = (0.02)² * 51 = 0.0204W, well within rating.
3. Layout: Place each LED with its current-limiting resistor nearby. Ensure the PCB footprint matches the datasheet's dimensional drawing, with holes for the radial leads. Provide a few millimeters of spacing between LEDs to aid heat dissipation.
4. Assembly Note: Instruct assembly to bend leads (if necessary) before insertion and to follow the hand-soldering guidelines (300°C max, 3 sec max, 3mm distance).

This simple design ensures reliable, consistent indicator operation over the product's lifetime.

11. Technology Principle

This LED is based on an Indium Gallium Nitride (InGaN) semiconductor chip. When a forward voltage is applied, electrons and holes are injected into the active region of the semiconductor junction. Their recombination releases energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, green. The green diffused resin encapsulant serves to protect the chip, shape the light output beam (creating the 110-degree viewing angle), and diffuse the light to appear more uniform.

12. Industry Trends

The LED industry continues to evolve towards higher efficiency (more lumens per watt), improved color rendering, and greater miniaturization. While this device is a standard through-hole component, a significant trend is the migration to Surface-Mount Device (SMD) packages (like 0603, 0402) for automated assembly and space savings. Furthermore, there is ongoing development in green LED efficiency, historically lower than blue and red, to improve the performance of RGB (Red-Green-Blue) LED systems for displays and lighting. This component represents a mature, reliable solution within this evolving technological landscape.