LED Lamp 383-2SYGC/S530-E2 Datasheet - Brilliant Yellow Green - 20mA - 320mcd - English Technical Document

1. Product Overview

This document provides the technical specifications for a high-brightness Brilliant Yellow Green LED lamp. The device is designed using AlGaInP chip technology encapsulated in a water-clear resin, offering reliable performance for various electronic applications requiring clear, vibrant indicator lighting.

1.1 Core Features and Advantages

• High Brightness: The series is specially engineered for applications demanding superior luminous intensity.
• Environmental Compliance: The product is Pb-free, compliant with RoHS, EU REACH, and Halogen-Free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).
• Packaging Options: Available on tape and reel for automated assembly processes.
• Viewing Angle Choice: Offered with various viewing angles to suit different application needs.
• Robust Design: Built for reliable and long-lasting operation.

1.2 Target Applications

This LED is suitable for backlighting and status indication in a range of consumer and computer electronics, including:

• Television Sets
• Computer Monitors
• Telephones
• General Computer Peripherals

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

The following ratings define the limits beyond which permanent damage to the device may occur. All values are specified at an ambient temperature (Ta) of 25°C.

Parameter	Symbol	Rating	Unit
Continuous Forward Current	IF	25	mA
Peak Forward Current (Duty 1/10 @ 1KHz)	IFP	60	mA
Reverse Voltage	VR	5	V
Power Dissipation	Pd	60	mW
Operating Temperature	Topr	-40 to +85	°C
Storage Temperature	Tstg	-40 to +100	°C
Soldering Temperature	Tsol	260 (for 5 sec)	°C

Design Consideration: The continuous forward current rating of 25mA is a key parameter for circuit design. Exceeding this value, even momentarily, can significantly reduce the LED's lifespan or cause immediate failure. The peak current rating allows for brief pulses, useful in multiplexed display applications, but the duty cycle and frequency must be strictly adhered to.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured under standard test conditions (Ta=25°C, IF=20mA unless otherwise stated).

Parameter	Symbol	Min.	Typ.	Max.	Unit	Condition
Luminous Intensity	Iv	160	320	--	mcd	IF=20mA
Viewing Angle (2θ1/2)	--	--	10	--	deg	IF=20mA
Peak Wavelength	λp	--	575	--	nm	IF=20mA
Dominant Wavelength	λd	--	573	--	nm	IF=20mA
Spectrum Bandwidth	Δλ	--	20	--	nm	IF=20mA
Forward Voltage	VF	1.7	2.0	2.4	V	IF=20mA
Reverse Current	IR	--	--	10	μA	VR=5V

Parameter Analysis:

• Luminous Intensity (320 mcd typ.): This indicates a bright output suitable for daylight-visible indicators. The wide min-typ range suggests a binning process; designers should use the minimum value for worst-case brightness calculations.
• Viewing Angle (10° typ.): A very narrow viewing angle. This LED is designed for focused, directed light rather than wide-area illumination, making it ideal for panel indicators where light should be visible primarily from the front.
• Forward Voltage (2.0V typ.): A relatively low forward voltage for an AlGaInP LED, which helps in reducing power consumption and thermal load. The circuit's current-limiting resistor must be calculated based on the maximum VF (2.4V) to ensure the current never exceeds the absolute maximum rating under all conditions.
• Wavelengths (~573-575 nm): This places the color firmly in the brilliant yellow-green region of the spectrum, which is highly perceptible to the human eye.

Note on Measurement Uncertainty: Luminous Intensity (±10%), Dominant Wavelength (±1.0nm), Forward Voltage (±0.1V).

3. Performance Curve Analysis

The datasheet provides several characteristic curves that are crucial for understanding the LED's behavior under non-standard conditions.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution. The typical peak is at 575nm with a spectral bandwidth (FWHM) of 20nm, confirming a saturated yellow-green color with minimal spread into adjacent colors.

3.2 Directivity Pattern

Illustrates the spatial distribution of light, correlating with the 10-degree viewing angle. The pattern shows high intensity at 0° (on-axis) with a rapid fall-off, characteristic of a narrow-beam LED.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This graph is essential for driver design. It shows the exponential relationship between voltage and current. A small increase in voltage beyond the typical 2.0V can lead to a large, potentially damaging increase in current, highlighting the necessity of a constant-current driver or a properly sized series resistor.

3.4 Relative Intensity vs. Forward Current

Shows the light output's dependence on drive current. While output increases with current, it is not perfectly linear, and efficiency typically drops at higher currents due to increased heat generation.

3.5 Thermal Performance Curves

Relative Intensity vs. Ambient Temperature: Shows the light output decreasing as ambient temperature rises. This thermal derating must be accounted for in applications with high ambient temperatures. Forward Current vs. Ambient Temperature: Under constant voltage conditions, the forward current would change with temperature due to the negative temperature coefficient of the diode's forward voltage. This reinforces the need for current regulation.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED features a standard radial leaded package (often referred to as a "3mm" or "T1" package). Key dimensional notes from the drawing include:

• All dimensions are in millimeters (mm).
• The height of the flange must be less than 1.5mm (0.059\").
• Standard tolerance is ±0.25mm unless otherwise specified.

The dimensional drawing provides critical measurements for PCB footprint design, including lead spacing, body diameter, and overall height to ensure proper fit and alignment during assembly.

4.2 Polarity Identification

The longer lead typically denotes the anode (positive). The datasheet diagram should be consulted to confirm the specific polarity marking, which is often indicated by a flat spot on the LED lens or a notch in the flange near the cathode lead.

5. Assembly, Handling, and Reliability Guidelines

5.1 Lead Forming

• Bend leads at a point at least 3mm from the base of the epoxy bulb.
• Perform forming before soldering.
• Avoid stressing the package. Stress can crack the epoxy or damage the internal wire bonds.
• Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

5.2 Storage Conditions

• Recommended: ≤30°C and ≤70% Relative Humidity.
• Storage life after shipment: 3 months under recommended conditions.
• For longer storage (up to 1 year): Use a sealed container with nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Instructions

Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Process	Parameter	Limit
Hand Soldering	Iron Tip Temperature	300°C Max. (30W Max.)
	Soldering Time	3 seconds Max.
	Distance to Bulb	3mm Min.
Dip (Wave) Soldering	Preheat Temperature	100°C Max. (60 sec Max.)
	Bath Temperature & Time	260°C Max., 5 sec Max.
	Distance to Bulb	3mm Min.
	Cooling	Do not use rapid-rate cooling.

Additional Soldering Notes:

• Avoid mechanical stress on leads while the LED is hot.
• Do not perform dip/hand soldering more than once.
• Protect the LED from shock/vibration until it cools to room temperature.
• Always use the lowest possible temperature that achieves a reliable solder joint.

5.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Air dry at room temperature.
• Do not use ultrasonic cleaning unless absolutely necessary and only after thorough pre-qualification testing, as it can damage the internal structure.

5.5 Thermal Management

Heat dissipation must be considered during the application design phase. While this is a low-power device, operating at or near the maximum current in a high ambient temperature will require derating the current to maintain reliability and prevent accelerated lumen depreciation. Proper PCB layout to dissipate heat from the leads is recommended.

6. Packing and Ordering Information

6.1 Packing Specification

The LEDs are packed to prevent electrostatic discharge (ESD) and moisture damage:

1. Primary Packing: Anti-static bags.
2. Secondary Packing: Inner cartons containing multiple bags.
3. Tertiary Packing: Outside cartons containing multiple inner cartons.

Packing Quantities:

• 200 to 500 pieces per anti-static bag.
• 4 bags per inner carton.
• 10 inner cartons per outside carton.

6.2 Label Explanation

Labels on the packaging contain the following information for traceability and identification:

• CPN: Customer's Production Number
• P/N: Production Number (Device Part Number)
• QTY: Packing Quantity
• CAT: Ranks (Performance Binning)
• HUE: Dominant Wavelength
• REF: Forward Voltage
• LOT No: Lot Number for traceability

7. Application Notes and Design Considerations

7.1 Typical Application Circuits

The most common drive method is a series resistor. The resistor value (R) is calculated using Ohm's Law: R = (V_supply - VF_LED) / I_LED. Example: For a 5V supply, using the maximum VF of 2.4V and a desired current of 20mA: R = (5V - 2.4V) / 0.020A = 130 Ohms. A standard 130Ω or next-higher value (e.g., 150Ω) resistor would be used. The power rating of the resistor should be at least P = I²R = (0.02)² * 130 = 0.052W, so a standard 1/8W (0.125W) resistor is sufficient.

7.2 Design Considerations

• Current Regulation: For consistent brightness, especially with a varying supply voltage or in temperature-fluctuating environments, consider using a constant current driver instead of a simple resistor.
• Reverse Voltage Protection: The maximum reverse voltage is only 5V. If there is any chance of reverse bias (e.g., in AC circuits or with inductive loads), a protection diode in parallel with the LED (cathode to anode) is mandatory.
• Viewing Angle: The 10° viewing angle makes this LED ideal for panel-mounted indicators where light should be directed at the user. It is less suitable for area lighting or wide-angle illumination.
• Heat in Enclosed Spaces: When mounted behind a panel or in a sealed enclosure, the ambient temperature around the LED may be higher than the general environment, necessitating further current derating.

8. Technology and Principle Introduction

This LED utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. This material system is particularly efficient for producing light in the yellow, orange, red, and green regions of the visible spectrum. When a forward voltage is applied, electrons and holes recombine in the active region of the semiconductor, releasing energy in the form of photons. The specific composition of the AlGaInP layers determines the bandgap energy and thus the wavelength (color) of the emitted light—in this case, brilliant yellow-green at ~573-575 nm. The water-clear epoxy resin lens serves to protect the chip, shape the light output into a narrow beam, and enhance light extraction from the semiconductor.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λp, 575nm) is the wavelength at which the emission spectrum has its maximum intensity. Dominant Wavelength (λd, 573nm) is the single wavelength of monochromatic light that matches the perceived color of the LED when compared to a standard white light source. For a saturated color like this yellow-green, they are very close, but dominant wavelength is more relevant for color specification.

9.2 Can I drive this LED with a 3.3V supply?

Yes, but you must use a series current-limiting resistor. Using the typical VF of 2.0V and target 20mA: R = (3.3V - 2.0V) / 0.020A = 65 Ohms. Always calculate using the maximum VF (2.4V) for a safe design: R_min = (3.3V - 2.4V) / 0.020A = 45 Ohms. A resistor between 45Ω and 65Ω would work, with a higher value providing a safety margin against over-current.

9.3 Why is the storage life limited to 3 months?

The epoxy packaging material can absorb moisture from the atmosphere. During subsequent high-temperature soldering, this trapped moisture can rapidly expand, causing internal delamination or cracking ("popcorning"). The 3-month limit assumes storage under controlled conditions (≤30°C/70%RH). For longer storage, the nitrogen-packed option removes moisture and oxygen, preventing degradation.

9.4 Is a heat sink required?

For operation at or below the typical 20mA in normal ambient temperatures, a dedicated heat sink is not required for the LED itself. However, good thermal management of the PCB is always beneficial for long-term reliability. The leads provide the primary thermal path, so ensuring they are soldered to adequate copper area on the PCB will help dissipate heat.