LED Lamp 323-2SYGD/S530-E2 Datasheet - Brilliant Yellow Green - 20mA - 60mW - English Technical Documentation

1. Product Overview

This document provides the complete technical specifications for the 323-2SYGD/S530-E2 LED lamp. This component is a surface-mount device (SMD) LED designed for applications requiring reliable illumination with specific color characteristics. The primary function of this LED is to emit light when a forward current is applied, converting electrical energy into visible light within the yellow-green spectrum.

1.1 Core Features and Advantages

The LED offers several key features that make it suitable for a variety of electronic applications. It provides a choice of various viewing angles, allowing designers to select the appropriate beam pattern for their specific needs. The product is available on tape and reel, which facilitates automated assembly processes in high-volume manufacturing. It is designed to be reliable and robust, ensuring consistent performance over its operational lifetime. The device complies with several important environmental and safety standards, including the RoHS (Restriction of Hazardous Substances) directive, EU REACH regulations, and is classified as Halogen-Free, with strict limits on Bromine (Br) and Chlorine (Cl) content.

1.2 Target Market and Applications

This LED series is specially engineered for applications demanding higher brightness levels. The primary target markets include consumer electronics and display technologies. Typical applications explicitly mentioned are television sets, computer monitors, telephones, and general computer peripherals. Its characteristics make it suitable for status indicators, backlighting, and general-purpose illumination in compact electronic devices.

2. Technical Specifications and Objective Interpretation

This section details the critical electrical, optical, and thermal parameters that define the LED's performance envelope. All specifications are measured under standard test conditions of an ambient temperature (Ta) of 25°C unless otherwise stated.

2.1 Device Selection and Material Composition

The LED utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip material. This material system is known for producing high-efficiency light emission in the yellow, orange, red, and green spectral regions. The emitted color is specified as Brilliant Yellow Green. The resin used for the LED package lens is Green Diffused, which helps to scatter the light and achieve the specified viewing angle.

2.2 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not recommended operating conditions. The continuous forward current (IF) must not exceed 25 mA. A higher peak forward current (IFP) of 60 mA is permissible but only under pulsed conditions with a duty cycle of 1/10 at 1 kHz. The maximum reverse voltage (VR) the LED can withstand is 5 V. The total power dissipation (Pd) for the package is limited to 60 mW. The device can operate in ambient temperatures ranging from -40°C to +85°C and can be stored in temperatures from -40°C to +100°C. The soldering temperature tolerance is 260°C for a maximum duration of 5 seconds.

2.3 Electro-Optical Characteristics

These parameters describe the LED's performance under normal operating conditions, typically at a forward current (IF) of 20 mA. The luminous intensity (Iv) has a typical value of 80 mcd (millicandela), with a minimum of 40 mcd. The viewing angle (2θ1/2), defined as the angle where intensity drops to half its peak value, is typically 60 degrees. The peak wavelength (λp) is typically 575 nm, and the dominant wavelength (λd) is typically 573 nm, confirming the yellow-green color point. The spectrum radiation bandwidth (Δλ) is typically 20 nm. The forward voltage (VF) ranges from a minimum of 1.7 V, through a typical of 2.0 V, to a maximum of 2.4 V at 20 mA. The reverse current (IR) has a maximum limit of 10 μA when a 5 V reverse bias is applied. The datasheet also notes measurement uncertainties: ±10% for luminous intensity, ±1.0 nm for dominant wavelength, and ±0.1 V for forward voltage.

3. Performance Curve Analysis

Graphical data provides deeper insight into the LED's behavior under varying conditions.

3.1 Spectral and Angular Distribution

The Relative Intensity vs. Wavelength curve shows the spectral power distribution, peaking around 575 nm with a typical bandwidth. The Directivity curve illustrates the spatial radiation pattern, showing how light intensity varies with angle from the central axis, correlating to the 60-degree viewing angle.

3.2 Electrical and Thermal Characteristics

The Forward Current vs. Forward Voltage (IV Curve) demonstrates the diode's exponential relationship. The Relative Intensity vs. Forward Current curve shows that light output increases with current but may become sub-linear at higher currents due to heating and efficiency droop. The Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature curves are crucial for thermal management. They show that luminous output decreases as ambient temperature rises, and the forward voltage has a negative temperature coefficient (decreases with increasing temperature).

4. Mechanical and Packaging Information

4.1 Package Dimensions

The datasheet includes a detailed dimensional drawing of the LED package. Key notes specify that all dimensions are in millimeters. A critical constraint is that the height of the flange must be less than 1.5 mm (0.059 inches). The general tolerance for unspecified dimensions is ±0.25 mm. The drawing defines the body size, lead spacing, and overall footprint necessary for PCB (Printed Circuit Board) layout.

4.2 Polarity Identification and Mounting

While not explicitly detailed in the provided text, standard LED packages have anode and cathode markings, often indicated by a longer lead, a flat edge on the lens, or a marking on the body. Correct polarity is essential for operation.

5. Soldering and Assembly Guidelines

Proper handling is critical to ensure reliability and prevent damage.

5.1 Lead Forming

If leads require bending, it must be done at a point at least 3 mm from the base of the epoxy bulb. Forming should always occur before soldering. Stress on the LED package during forming must be avoided to prevent internal damage or breakage. Leads should be cut at room temperature. PCB holes must align perfectly with the LED leads to avoid mounting stress, which can degrade the epoxy resin and the LED itself.

5.2 Storage Conditions

LEDs should be stored at 30°C or less and 70% relative humidity (RH) or less. The recommended storage life under these conditions is 3 months from shipment. For longer storage (up to one year), they should be kept in a sealed container with a nitrogen atmosphere and moisture-absorbent material. Rapid temperature changes in high-humidity environments should be avoided to prevent condensation.

5.3 Soldering Process

The solder joint must be at least 3 mm from the epoxy bulb. Recommended conditions are provided for both hand soldering and dip (wave) soldering. For hand soldering, use an iron tip at a maximum of 300°C (for a 30W iron) for no more than 3 seconds. For dip soldering, preheat to a maximum of 100°C for up to 60 seconds, followed by a solder bath at a maximum of 260°C for 5 seconds. A soldering profile diagram is typically included, showing the time-temperature relationship. Stress should not be applied to the leads while the LED is hot. Dip or hand soldering should not be performed more than once. After soldering, the LED must be protected from mechanical shock until it cools to room temperature. Rapid cooling is not recommended. The lowest possible soldering temperature that achieves a reliable joint is always desirable.

5.4 Cleaning

If cleaning is necessary, use isopropyl alcohol at room temperature for no more than one minute, then air dry. Ultrasonic cleaning is generally not recommended. If absolutely required, its parameters (power, duration) must be pre-qualified to ensure no damage occurs, as it can cause micro-cracks in the die or package.

6. Application Design Considerations

6.1 Thermal Management

Effective heat dissipation is paramount for LED performance and longevity. The application design must account for heat management. The operating current should be de-rated appropriately based on the ambient temperature, referring to de-rating curves. Controlling the temperature around the LED in the final application is necessary to maintain specified luminous output and prevent accelerated aging.

6.2 ESD (Electrostatic Discharge) Protection

The LED is sensitive to electrostatic discharge and surge voltages, which can damage the semiconductor die. Proper ESD handling procedures must be followed during assembly, including the use of grounded workstations, wrist straps, and conductive containers.

6.3 Current Limiting

An LED is a current-driven device. A series current-limiting resistor or a constant-current driver circuit is mandatory to prevent the forward current from exceeding the maximum rating, which would lead to rapid failure.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged using moisture-resistant and anti-static materials. The packing hierarchy is: LEDs are placed in anti-electrostatic bags. These bags are then placed into inner cartons. Multiple inner cartons are packed into an outside carton for shipment.

7.2 Packing Quantity and Label Explanation

The minimum packing quantity is 200 to 500 pieces per bag. Six bags are packed into one inner carton. Ten inner cartons constitute one outside carton. Labels on the packaging contain several codes: CPN (Customer's Production Number), P/N (Production Number), QTY (Packing Quantity), CAT (Ranks of Luminous Intensity), HUE (Ranks of Dominant Wavelength), REF (Ranks of Forward Voltage), and LOT No (Lot Number for traceability).

8. Technical Comparison and Differentiation

While a direct comparison with other products is not provided in the source document, key differentiators of this LED can be inferred. The use of AlGaInP chip technology typically offers higher efficiency and better color saturation in the yellow-red spectrum compared to older technologies. Compliance with Halogen-Free and stringent RoHS/REACH standards is a significant advantage for products targeting global markets, especially Europe. The combination of a typical 80 mcd intensity at 20 mA with a 60-degree viewing angle offers a balance of brightness and beam width suitable for indicator and backlight roles.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λp) is the wavelength at which the emitted optical power is maximum. Dominant wavelength (λd) is the single wavelength of monochromatic light that matches the perceived color of the LED. For this yellow-green LED, they are very close (575 nm vs. 573 nm).

Q: Can I drive this LED with a 3.3V supply without a resistor?
A: No. The forward voltage is typically 2.0V but can be as low as 1.7V. Connecting it directly to 3.3V would cause excessive current, likely exceeding the 25 mA maximum and destroying the LED. A series resistor must be used to limit the current to 20 mA or less.

Q: Why is the storage life limited to 3 months?
A> This is a precaution against moisture absorption by the plastic package. Moisture absorbed during storage can expand rapidly during soldering ("popcorning"), causing internal damage. The 3-month limit assumes standard industrial storage environments. For longer storage, the nitrogen-bag method is prescribed.

Q: The soldering temperature is 260°C, but my PCB has other components rated for 240°C. What should I do?
A> You must follow the most restrictive process. You may need to use a lower soldering temperature profile and potentially a different solder alloy, but this must be validated to ensure a reliable electrical and mechanical joint is formed on the LED leads.