LED Lamp 333-2SYGC/S530-E2 Datasheet - Brilliant Yellow Green - 20mA - 2.0V - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the 333-2SYGC/S530-E2 LED lamp. This component is a surface-mount device (SMD) designed for applications requiring high brightness and reliable performance in a compact form factor. The LED emits a brilliant yellow-green light, achieved through an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip encapsulated in a water-clear resin package. This combination offers excellent luminous intensity and color purity.

The series is characterized by its robust construction, lead-free (Pb-free) compliance, and adherence to RoHS (Restriction of Hazardous Substances) directives, making it suitable for modern electronic manufacturing. It is available on tape and reel for automated assembly processes, supporting high-volume production.

1.1 Target Applications

The primary application areas for this LED lamp include backlighting and status indication in consumer and industrial electronics. Typical use cases are:

• Television sets (TV)
• Computer monitors
• Telephones
• Desktop and laptop computers

Its design makes it suitable for both indicator functions and area illumination where a distinct yellow-green signal is required.

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed analysis of the key electrical, optical, and thermal parameters defined in the datasheet. Understanding these values is critical for proper circuit design and ensuring long-term reliability.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be applied continuously without degrading the LED's performance or lifespan.
• Peak Forward Current (IFP): 60 mA. This rating applies to pulsed operation with a duty cycle of 1/10 at 1 kHz. It allows for brief periods of higher current, useful for multiplexing or achieving higher instantaneous brightness.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in the reverse direction can cause junction breakdown.
• Power Dissipation (Pd): 60 mW. This is the maximum power the package can dissipate as heat at an ambient temperature (Ta) of 25°C. Operating above this limit requires careful thermal management.
• Operating & Storage Temperature: The device can function from -40°C to +85°C and be stored from -40°C to +100°C.
• Soldering Temperature (Tsol): The leads can withstand 260°C for 5 seconds, which is compatible with standard lead-free reflow soldering profiles.

2.2 Electro-Optical Characteristics

These parameters are measured under standard test conditions (Ta=25°C, IF=20mA) and represent the typical performance of the device.

• Luminous Intensity (Iv): 400 mcd (Min), 800 mcd (Typ). This specifies the amount of visible light emitted in a given direction. The high typical value indicates a bright output suitable for many indicator applications.
• Viewing Angle (2θ1/2): 10° (Typ). This narrow viewing angle indicates a highly directional light beam, concentrating the luminous intensity within a small cone. This is ideal for applications where light needs to be directed precisely.
• Peak & Dominant Wavelength (λp, λd): Approximately 575 nm and 573 nm, respectively. This places the emitted color firmly in the yellow-green region of the visible spectrum. The close values of peak and dominant wavelength indicate good color saturation.
• Spectrum Radiation Bandwidth (Δλ): 20 nm (Typ). This defines the spectral width of the emitted light at half its maximum intensity (Full Width at Half Maximum - FWHM). A value of 20 nm is typical for monochromatic LEDs.
• Forward Voltage (VF): 2.0 V (Typ), 2.4 V (Max) at 20mA. This is the voltage drop across the LED when operating. It is crucial for designing the current-limiting circuitry. The datasheet notes a measurement uncertainty of ±0.1V for this parameter.
• Reverse Current (IR): 10 μA (Max) at VR=5V. This is the leakage current when the LED is reverse-biased.

3. Performance Curve Analysis

The datasheet includes several characteristic curves that illustrate how the LED's performance varies with different operating conditions. These graphs are essential for understanding behavior beyond the single-point specifications.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution of the emitted light. It will peak around 575 nm (yellow-green) with a typical FWHM of 20 nm, confirming the monochromatic nature of the output.

3.2 Directivity Pattern

This polar plot visualizes the 10° viewing angle, showing how the luminous intensity decreases sharply as the observation angle moves away from the central axis (0°).

3.3 Forward Current vs. Forward Voltage (IV Curve)

This graph depicts the exponential relationship between current (I) and voltage (V) for a semiconductor diode. For designers, it highlights that a small change in forward voltage can lead to a large change in current, underscoring the importance of using a constant-current driver or a well-calculated current-limiting resistor.

3.4 Relative Intensity vs. Forward Current

This curve shows that light output (intensity) increases with forward current, but the relationship is not perfectly linear, especially at higher currents. It also implies that efficiency (lumens per watt) may decrease at very high currents.

3.5 Thermal Characteristics

The curves for Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature are critical for thermal management. Typically, LED luminous output decreases as junction temperature rises. Furthermore, for a fixed driving voltage, the forward current will increase with temperature due to the negative temperature coefficient of the diode's forward voltage. This can lead to thermal runaway if not properly managed, making constant-current driving even more important.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED is provided in a standard lamp-style SMD package. The dimensional drawing specifies all critical measurements including body length, width, height, lead spacing, and flange details. Key notes from the drawing include:

• All dimensions are in millimeters (mm).
• The height of the flange must be less than 1.5mm.
• The general tolerance for unspecified dimensions is ±0.25mm.

These dimensions are vital for PCB footprint design, ensuring proper fit and soldering.

4.2 Polarity Identification

The cathode (negative) lead is typically indicated by a flat spot on the lens, a notch in the package, or a shorter lead. The datasheet's dimensional drawing should clearly mark the cathode. Correct polarity must be observed during assembly to prevent damage.

5. Soldering and Assembly Guidelines

Proper handling is essential to maintain the LED's integrity and performance.

5.1 Lead Forming

• Bending must be done at least 3mm from the base of the epoxy bulb.
• Form leads before soldering.
• Avoid applying stress to the package during bending.
• Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

5.2 Storage

• Store at ≤30°C and ≤70% Relative Humidity (RH).
• Shelf life after shipment is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering:

• Iron tip temperature: Max 300°C (for a 30W max iron).
• Soldering time per lead: Max 3 seconds.

Wave or Dip Soldering:

• Preheat temperature: Max 100°C (for max 60 seconds).
• Soldering bath temperature: Max 260°C.
• Soldering time: Max 5 seconds.

General Soldering Notes:

• Avoid stress on leads at high temperatures.
• Do not solder (dip/hand) more than once.
• Protect the LED from mechanical shock until it cools to room temperature.
• Avoid rapid cooling from peak temperature.
• Always use the lowest possible temperature that achieves a reliable solder joint.

5.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Air dry at room temperature.
• Do not use ultrasonic cleaning unless absolutely necessary and only after thorough pre-qualification testing, as it can damage the internal structure.

6. Thermal Management and Reliability

Effective heat dissipation is paramount for LED performance and longevity.

• Heat management must be considered during the initial application design phase.
• The operating current should be appropriately de-rated based on the ambient temperature, referring to any de-rating curves provided in the specification.
• The temperature surrounding the LED in the final application must be controlled. Excessive heat reduces light output (lumen depreciation) and can significantly shorten the device's operational life.

7. Electrostatic Discharge (ESD) Protection

Like most semiconductor devices, this LED is sensitive to Electrostatic Discharge (ESD). The datasheet emphasizes the importance of ESD precautions. Standard ESD handling procedures must be followed during all stages of production, assembly, and handling:

• Use grounded workstations and wrist straps.
• Store and transport components in anti-static packaging (as indicated in the packing specification).
• Avoid contact with insulating materials that can generate static charge.

8. Packing and Ordering Information

8.1 Packing Specification

The LEDs are packed to ensure protection from moisture and electrostatic discharge:

1. Primary Packing: A minimum of 200 to 500 pieces are placed in one anti-electrostatic bag.
2. Secondary Packing: Five bags are placed into one inner carton.
3. Tertiary Packing: Ten inner cartons are packed into one master (outside) carton.

8.2 Label Explanation

Labels on the packaging contain key information for traceability and identification:

• CPN: Customer's Part Number
• P/N: Manufacturer's Part Number (e.g., 333-2SYGC/S530-E2)
• QTY: Quantity of pieces in the bag/carton
• CAT / Ranks: Possibly indicates performance binning (e.g., luminous intensity grade).
• HUE: Dominant Wavelength value.
• REF: Reference code.
• LOT No: Manufacturing Lot Number for traceability.

9. Application Suggestions and Design Considerations

9.1 Circuit Design

Always drive the LED with a constant current source or a voltage source in series with a current-limiting resistor. Calculate the resistor value using the typical forward voltage (2.0V) and the desired operating current (e.g., 20mA), factoring in the power supply voltage: R = (V_supply - Vf_LED) / I_LED. Choose a resistor with sufficient power rating.

9.2 PCB Layout

Design the PCB footprint exactly according to the package dimensions. Ensure adequate copper area or thermal vias around the LED's cathode/anode pads if operating at high currents or in high ambient temperatures to help dissipate heat.

9.3 Optical Design

The 10° narrow viewing angle makes this LED suitable for applications requiring a focused beam or where light should not spill into adjacent areas. For wider illumination, secondary optics (e.g., lenses or diffusers) would be required.

10. Technical Comparison and Differentiation

While a direct comparison requires specific competitor data, this LED's key differentiating features based on its datasheet are:

• High Brightness: A typical luminous intensity of 800 mcd is significant for a standard lamp package.
• Narrow Viewing Angle: The 10° beam is highly directional, which can be an advantage or a constraint depending on the application.
• AlGaInP Chip Technology: This material system is known for high efficiency in the yellow, orange, and red spectral regions, offering good performance for yellow-green.
• Robust Packaging & Guidelines: The detailed handling and soldering instructions support reliable manufacturing.

11. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED at its maximum continuous current of 25mA?
A1: Yes, but you must ensure excellent thermal management. The LED's lifetime and light output stability will be better if operated at a lower current, such as the test condition of 20mA. Always refer to any lifetime or de-rating curves if available.

Q2: Why is the viewing angle so narrow (10°)?
A2: The narrow angle is a result of the package lens design and the chip placement. It concentrates the light into a tight beam, maximizing forward-facing intensity (candela). This is ideal for panel indicators where the user views the LED head-on.

Q3: What does "Water Clear" resin mean?
A3: It means the encapsulating epoxy is transparent and colorless. This allows the true color of the AlGaInP chip (yellow-green) to be emitted without any tinting or diffusion from the package itself.

Q4: How critical is the 3mm distance for lead bending and soldering?
A4: Very critical. Bending or soldering closer to the epoxy bulb transfers mechanical and thermal stress directly to the sensitive semiconductor die and the wire bonds inside, potentially causing immediate failure or latent reliability issues.

12. Practical Application Example

Scenario: Designing a status indicator for a network router.
The LED needs to be clearly visible from the front of the device. A 5V supply rail is available.

1. Selection: The 333-2SYGC/S530-E2 is chosen for its high brightness and distinct color.
2. Circuit Calculation: Target current = 20mA. Using typical Vf = 2.0V. Resistor R = (5V - 2.0V) / 0.020A = 150 Ohms. The nearest standard value is 150Ω. Power dissipation in resistor: P = I^2 * R = (0.02^2)*150 = 0.06W. A standard 1/8W (0.125W) resistor is sufficient.
3. PCB Design: The footprint is created exactly per the dimension drawing. The LED is placed behind a small aperture on the router's front panel. The narrow 10° viewing angle ensures the light is directed straight out through the aperture with minimal loss.
4. Assembly: Components are placed using the tape and reel. The PCB undergoes a reflow soldering process, adhering to the 260°C for 5 seconds profile.

13. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor p-n junction. The active region is composed of AlGaInP. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light—in this case, yellow-green (~573-575 nm). The water-clear epoxy resin encapsulates the chip, providing mechanical protection, shaping the light output beam (lens effect), and enhancing light extraction from the semiconductor material.

14. Technology Trends and Context

AlGaInP-based LEDs represent a mature and highly efficient technology for the amber-to-red color range, including yellow-green. Key trends in the broader LED industry that provide context for such components include:

• Increased Efficiency: Ongoing material and packaging research continues to push the luminous efficacy (lumens per watt) higher.
• Miniaturization: While this is a standard package, the industry trend is towards ever-smaller chip-scale packages (CSP) for high-density applications.
• Smart Integration: The future may see more LEDs integrated with drivers, controllers, or sensors into single modules.
• Reliability Focus: As LEDs are used in more critical applications (automotive, industrial), datasheets and standards are placing greater emphasis on long-term reliability data (LM-80 testing, lifetime projections).

This particular LED, with its well-defined specifications and robust construction guidelines, is a reliable solution for traditional indicator and backlighting roles where proven performance and cost-effectiveness are key considerations.