LED Lamp 494-10SYGT/S530-E2 Datasheet - Brilliant Yellow Green - 20mcd - 2.0V - 60mW - English Technical Document

1. Product Overview

This document provides the technical specifications for a high-brightness Brilliant Yellow Green LED lamp. The device is designed using AlGaInP chip technology, encapsulated in a green transparent resin, and is intended for applications requiring reliable and robust illumination with a distinctive color output.

1.1 Core Advantages and Target Market

The LED offers several key features making it suitable for modern electronic designs. It is available in various viewing angles and packaging options like tape and reel for automated assembly. The product is compliant with environmental regulations, being Pb-free, RoHS compliant, EU REACH compliant, and Halogen Free (with Bromine <900 ppm, Chlorine <900 ppm, Br+Cl < 1500 ppm). Its primary applications include backlighting and indicator functions in consumer electronics such as television sets, computer monitors, telephones, and general computing equipment.

2. Technical Parameters: In-Depth Objective Interpretation

This section details the critical operational limits and performance characteristics of the LED under standard test conditions (Ta=25°C).

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. The continuous forward current (I_F) must not exceed 25 mA. For pulsed operation, a peak forward current (I_FP) of 60 mA is allowed at a duty cycle of 1/10 and 1 kHz. The maximum reverse voltage (V_R) is 5 V. The device can dissipate up to 60 mW of power. The operational temperature range is from -40°C to +85°C, while storage can be from -40°C to +100°C. The soldering temperature tolerance is 260°C for a maximum duration of 5 seconds.

2.2 Electro-Optical Characteristics

These parameters define the typical performance when operated within the recommended conditions. At a forward current of 20 mA, the luminous intensity (I_v) is typically 20 mcd, with a minimum of 10 mcd. The viewing angle (2θ_1/2) is typically 100 degrees. The peak wavelength (λ_p) is typically 575 nm, and the dominant wavelength (λ_d) is typically 573 nm, defining its Brilliant Yellow Green color. The spectral bandwidth (Δλ) is typically 20 nm. The forward voltage (V_F) typically measures 2.0 V, ranging from 1.7 V to 2.4 V at 20 mA. The reverse current (I_R) is a maximum of 10 µA at 5 V. Measurement uncertainties are noted for forward voltage (±0.1V), luminous intensity (±10%), and dominant wavelength (±1.0nm).

2.3 Thermal Characteristics

While not presented as a separate table, thermal management is crucial. The power dissipation rating of 60 mW and the operating temperature range directly relate to the device's thermal performance. Proper heat sinking or current derating is necessary when operating near the maximum ratings or in elevated ambient temperatures to ensure longevity and maintain optical performance.

3. Performance Curve Analysis

The datasheet includes several graphical representations of the LED's behavior under varying conditions.

3.1 Relative Intensity vs. Wavelength

This curve illustrates the spectral power distribution, showing the emission centered around the 575 nm peak with a defined bandwidth, confirming the yellow-green color point.

3.2 Directivity Pattern

This polar plot visualizes the spatial distribution of light, corresponding to the 100-degree viewing angle, showing how intensity decreases from the center axis.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This fundamental curve shows the exponential relationship between current and voltage, essential for designing the correct current-limiting circuitry. The typical V_F of 2.0V at 20mA is a key design parameter.

3.4 Relative Intensity vs. Forward Current

This graph demonstrates how light output increases with drive current. It is typically sub-linear at higher currents due to efficiency droop and thermal effects, informing decisions on optimal drive current for desired brightness.

3.5 Relative Intensity vs. Ambient Temperature

This curve shows the negative temperature coefficient of light output. As ambient temperature rises, luminous intensity generally decreases, which is critical for applications with wide temperature variations.

3.6 Forward Current vs. Ambient Temperature

Often related to de-rating, this graph may indicate how the maximum allowable forward current should be reduced as ambient temperature increases to stay within the power dissipation limits.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The datasheet includes a detailed mechanical drawing of the LED package. Key dimensions include the overall length, width, and height of the component, lead spacing, and the size and position of the epoxy lens. Notes specify that all dimensions are in millimeters, the flange height must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise stated. This information is vital for PCB footprint design and ensuring proper fit within the assembly.

4.2 Polarity Identification

The cathode is typically identified by a flat spot on the lens, a shorter lead, or a specific marking on the package body as shown in the dimension diagram. Correct polarity must be observed during installation.

5. Soldering and Assembly Guidelines

Proper handling is essential to prevent damage and ensure reliability.

5.1 Lead Forming

If required, leads should be bent at a point at least 3mm from the base of the epoxy bulb. Forming must be done before soldering at room temperature to avoid stressing the package or leads, which can cause breakage or degraded performance. PCB holes must align precisely with the LED leads to avoid mounting stress.

5.2 Storage

LEDs should be stored at 30°C or less and 70% relative humidity or less. The recommended storage life after shipment is 3 months. For longer storage up to one year, use a sealed container with a nitrogen atmosphere and desiccant. Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

A minimum distance of 3mm must be maintained between the solder joint and the epoxy bulb. Recommended conditions are:
Hand Soldering: Iron tip temperature max 300°C (30W max), soldering time max 3 seconds.
Wave/DIP Soldering: Preheat temperature max 100°C (60 sec max), solder bath temperature max 260°C for 5 seconds.
A recommended soldering temperature profile graph is provided, typically showing a ramp-up, preheat, reflow, and cooling phase. Dip or hand soldering should not be performed more than once. Avoid stress on the leads at high temperatures. After soldering, protect the LED from mechanical shock until it cools to room temperature. Do not use rapid cooling processes.

5.4 Cleaning

If cleaning is necessary, use isopropyl alcohol at room temperature for no more than one minute, then air dry. Ultrasonic cleaning is not recommended as it can damage the LED. If absolutely required, pre-qualification is necessary to determine safe power levels and duration.

5.5 Heat Management

Thermal management must be considered during the application design phase. The operating current should be appropriately de-rated based on the ambient temperature, referring to the de-rating curve (implied in the performance graphs) to prevent exceeding the maximum junction temperature and ensure long-term reliability.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage. They are placed in anti-static bags. These bags are then packed into inner cartons, which are subsequently placed into outside cartons for shipping.

6.2 Packing Quantity and Label Explanation

Standard packing quantities are 200-1000 pieces per anti-static bag, 4 bags per inner carton, and 10 inner cartons per outside carton. Labels on the packaging include codes for: Customer's Production Number (CPN), Production Number (P/N), Packing Quantity (QTY), Ranks (CAT, likely for luminous intensity or wavelength binning), Dominant Wavelength (HUE), Forward Voltage (REF), and Lot Number (LOT No).

7. Application Suggestions

7.1 Typical Application Scenarios

This LED is ideally suited for status indicators, backlighting for small displays, and panel illumination in consumer electronics like TVs, monitors, telephones, and computers where a distinct yellow-green signal is required.

7.2 Design Considerations

Circuit Design: Always use a series current-limiting resistor. Calculate the resistor value based on the supply voltage (V_CC), the typical forward voltage (V_F ~2.0V), and the desired forward current (I_F, not to exceed 25mA continuous). Formula: R = (V_CC - V_F) / I_F.
PCB Layout: Follow the recommended footprint from the package dimensions. Ensure the polarity marking on the PCB matches the LED's cathode.
Thermal Design: For continuous operation at or near maximum current, consider the PCB's ability to act as a heat sink. Using wider copper traces connected to the LED pads can help dissipate heat.
Optical Design: The 100-degree viewing angle provides a wide beam. For more focused light, external lenses or reflectors may be needed.

8. Technical Comparison and Differentiation

While a direct comparison with other part numbers is not provided in this single datasheet, the key differentiating factors of this LED can be inferred:
Chip Technology: The use of AlGaInP semiconductor material is standard for high-efficiency yellow and amber LEDs, offering good brightness and color purity.
Environmental Compliance: Full compliance with RoHS, REACH, and Halogen-Free standards makes it suitable for global markets with strict environmental regulations.
Package: The standard lamp package offers ease of handling and soldering for through-hole applications, though the document also mentions availability on tape and reel, suggesting SMD variants or automated assembly compatibility.

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: What resistor do I need for a 5V supply?
A1: Targeting a safe 20mA drive current with a typical V_F of 2.0V: R = (5V - 2.0V) / 0.020A = 150 Ω. Use the nearest standard value (e.g., 150Ω or 160Ω) and check the power rating of the resistor (P = I²R = 0.06W, so a 1/8W or 1/4W resistor is fine).

Q2: Can I drive this LED with 3.3V?
A2: Yes. Using the same calculation: R = (3.3V - 2.0V) / 0.020A = 65 Ω. A 68Ω standard resistor would result in a slightly lower current (~19.1mA), which is acceptable.

Q3: How bright is 20 mcd?
A3: 20 millicandelas is a moderate brightness suitable for indoor indicator applications where it will be viewed from a short distance. It is clearly visible in normal room lighting conditions.

Q4: What does \"Brilliant Yellow Green\" mean?
A4: This is a descriptive name for the color defined by its dominant wavelength of approximately 573 nm. It sits between pure green (~525 nm) and pure yellow (~590 nm) on the spectrum.

Q5: Is a heat sink required?
A5: For continuous operation at the absolute maximum current of 25mA in a high ambient temperature, thermal considerations are important. For typical use at 20mA in room temperature, the PCB traces are usually sufficient. Refer to the de-rating curves for high-temperature operation.

10. Practical Use Case Example

Scenario: Designing a power-on indicator for a desktop computer.
Implementation: The LED is placed on the front panel. It is connected in series with a 180Ω current-limiting resistor to the 5V standby power rail of the motherboard. When the computer is plugged in (even if off), the 5VSB rail is active, lighting the LED with approximately 16.7mA ((5V-2.0V)/180Ω), providing a clear \"standby\" indication. The wide viewing angle ensures visibility from various angles. The low power consumption ( ~50mW for LED+resistor) is negligible. The Halogen-Free and RoHS compliance meets the environmental standards required for computer manufacturing.

11. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor diode. The active region is composed of an AlGaInP (Aluminum Gallium Indium Phosphide) compound semiconductor. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn dictates the wavelength (color) of the emitted light—in this case, around 573-575 nm for yellow-green. The epoxy resin package serves to protect the semiconductor chip, acts as a lens to shape the light output beam (100-degree viewing angle), and enhances light extraction efficiency.

12. Technology Trends (Objective Perspective)

The LED industry continues to evolve. While this is a standard through-hole lamp package, broader trends influencing such components include:
Increased Efficiency: Ongoing material science research aims to improve the internal quantum efficiency (IQE) and light extraction efficiency (LEE) of AlGaInP LEDs, potentially leading to higher brightness at the same current or the same brightness at lower power.
Miniaturization: There is a general market shift towards surface-mount device (SMD) packages (like 0603, 0402) for indicators due to their smaller footprint and compatibility with automated pick-and-place assembly, though through-hole packages remain relevant for prototyping, repair, and certain rugged applications.
Color Consistency: Advances in epitaxial growth and binning processes allow for tighter control over dominant wavelength and luminous intensity, providing more consistent color and brightness from device to device within a production batch.
Reliability and Lifetime: Improvements in packaging materials (epoxy, silicone) and die-attach techniques continue to enhance the long-term reliability and lumen maintenance of LEDs, especially under high-temperature operating conditions.