LED Lamp 333-2UYC/S 530-A3 Datasheet - Brilliant Yellow - 20mA - 2.0V - English Technical Document

1. Product Overview

This document provides the technical specifications for a high-brightness LED lamp designed for various electronic applications. The device utilizes AlGaInP chip technology to produce a brilliant yellow light output. It is characterized by its reliability, robustness, and compliance with environmental standards such as being lead-free and RoHS compliant.

1.1 Core Advantages

• Choice of various viewing angles for design flexibility.
• Available on tape and reel for automated assembly processes.
• High reliability and robust construction suitable for demanding applications.
• Lead-free and RoHS compliant, adhering to environmental regulations.
• Specifically engineered for applications requiring higher brightness levels.

1.2 Target Market and Applications

This LED is targeted at consumer electronics and display backlighting markets. Typical applications include:

• Television sets
• Computer monitors
• Telephones
• General computer peripherals and indicators

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The following table lists the stress limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

2.2 Electro-Optical Characteristics

These parameters are measured at an ambient temperature (Ta) of 25°C and a forward current (IF) of 20mA, unless otherwise specified. They define the typical performance of the device.

Measurement Notes:

• Forward Voltage Uncertainty: ±0.1V
• Luminous Intensity Uncertainty: ±10%
• Dominant Wavelength Uncertainty: ±1.0nm

2.3 Thermal Characteristics

While specific thermal resistance values are not provided in the datasheet, the absolute maximum ratings for power dissipation (60mW) and operating temperature (-40°C to +85°C) are critical for thermal management. Exceeding the Pd rating will lead to junction temperature rise and potential failure. Designers must ensure adequate heat sinking or current derating in high ambient temperature environments.

3. Binning System Explanation

The datasheet indicates the availability of the LED in different colors and intensities, implying a binning structure. While specific bin codes are not detailed for this model, typical binning parameters for such LEDs include:

• Dominant Wavelength (HUE): The datasheet specifies a typical dominant wavelength of 589nm. Production variation would create bins around this center value (e.g., 587-591nm).
• Luminous Intensity (CAT or Ranks): The luminous intensity has a minimum of 630mcd and a typical of 1250mcd. Devices are likely sorted into intensity bins (e.g., 630-800mcd, 800-1000mcd, 1000-1250+mcd) to ensure consistency within an application.
• Forward Voltage: With a range from 1.7V to 2.4V (typical 2.0V), LEDs may be binned by forward voltage to match driver requirements or for current balancing in parallel arrays.

The label explanation section references CAT (Ranks) and HUE (Dominant Wavelength), confirming these as key binning parameters for ordering.

4. Performance Curve Analysis

The datasheet includes several typical characteristic curves which are essential for understanding device behavior under different conditions.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution. For this brilliant yellow LED, the peak wavelength (λp) is typically 591nm, and the spectrum has a narrow bandwidth (Δλ) of approximately 15nm, indicating a saturated yellow color.

4.2 Directivity Pattern

The directivity curve illustrates the spatial distribution of light. With a typical viewing angle (2θ1/2) of 10 degrees, this is a very narrow-angle LED, concentrating light in a tight beam. This is suitable for applications requiring a focused spot of light or long-distance indication.

4.3 Forward Current vs. Forward Voltage (IV Curve)

This graph shows the exponential relationship between forward voltage (VF) and forward current (IF). The typical VF is 2.0V at 20mA. Designers use this curve to select appropriate current-limiting resistors or constant-current driver settings.

4.4 Relative Intensity vs. Forward Current

This curve demonstrates how light output (relative intensity) increases with forward current. It is generally linear within the recommended operating range but will saturate at higher currents. It is crucial for determining the drive current needed to achieve a desired brightness level.

4.5 Temperature Dependence Curves

Relative Intensity vs. Ambient Temperature: This curve shows that the luminous output of an LED decreases as the ambient (and consequently junction) temperature increases. This thermal derating must be accounted for in designs operating at high temperatures.
Forward Current vs. Ambient Temperature: This curve likely illustrates the relationship for a fixed voltage or power condition, showing how current changes with temperature due to the negative temperature coefficient of the diode's forward voltage.

5. Mechanical and Package Information

5.1 Package Dimension Drawing

The datasheet includes a detailed dimensioned drawing of the LED package. Key dimensions include the overall body size, lead spacing, and epoxy lens dimensions. Critical notes from the drawing:

• All dimensions are in millimeters (mm).
• The height of the flange must be less than 1.5mm (0.059\").
• The default tolerance for unspecified dimensions is ±0.25mm.

This drawing is essential for PCB footprint design, ensuring proper fit and alignment during assembly.

5.2 Polarity Identification

The cathode is typically identified by a flat side on the LED lens, a shorter lead, or a marking on the package. The PCB footprint must be designed to match this polarity to prevent reverse connection, which could damage the LED if the reverse voltage exceeds 5V.

6. Soldering and Assembly Guidelines

Proper handling is critical to maintain LED performance and reliability.

6.1 Lead Forming

• Bend leads at a point at least 3mm from the base of the epoxy bulb.
• Perform lead forming before soldering.
• Avoid stressing the LED package during forming to prevent internal damage or breakage.
• Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

6.2 Storage Conditions

• Store at ≤30°C and ≤70% Relative Humidity after receipt.
• Shelf life in original packaging is 3 months.
• For longer storage (up to 1 year), use a sealed container with nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Parameters

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Additional Soldering Notes:

• Avoid stress on leads during high-temperature soldering.
• Do not solder (dip or hand) more than once.
• Protect the LED from mechanical shock until it cools to room temperature after soldering.
• Use the lowest possible temperature that achieves a reliable solder joint.

6.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Dry at room temperature before use.
• Avoid ultrasonic cleaning. If absolutely required, pre-qualify the process to ensure no damage occurs.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage:

• Primary Pack: Anti-electrostatic bag.
• Inner Pack: Carton containing multiple bags.
• Outer Pack: Master shipping carton.

7.2 Packing Quantity

• Minimum 200 to 500 pieces per anti-static bag.
• 5 bags per inner carton.
• 10 inner cartons per outside carton.

7.3 Label Explanation

Labels on packaging contain key information for traceability and identification:

• CPN: Customer's Production Number
• P/N: Production Number (Part Number)
• QTY: Packing Quantity
• CAT: Ranks (Intensity/Performance Binning)
• HUE: Dominant Wavelength (Color Binning)
• REF: Reference
• LOT No: Lot Number for traceability

8. Application Suggestions

8.1 Typical Application Scenarios

• Status Indicators: Its high brightness and focused beam make it ideal for power, alert, or status indicators in consumer electronics (TVs, monitors, phones).
• Backlighting: Can be used for localized backlighting of small LCD panels, icons, or keypads.
• Panel Mount Indicators: Suitable for front-panel indicators where a bright, distinct yellow signal is required.

8.2 Design Considerations

• Current Limiting: Always use a series resistor or constant-current driver to limit the forward current to a safe value (≤25mA continuous). Calculate the resistor value using the typical VF (2.0V) and the supply voltage: R = (Vsupply - VF) / IF.
• Thermal Management: In high ambient temperatures or enclosed spaces, consider derating the operating current to prevent overheating and premature lumen depreciation.
• Optical Design: The 10-degree viewing angle creates a narrow beam. For wider illumination, secondary optics (diffusers, lenses) may be required.
• ESD Protection: Although not explicitly stated as sensitive, standard ESD handling precautions are recommended during assembly.

9. Technical Comparison and Differentiation

While a direct comparison with other part numbers is not provided, this LED's key differentiating features based on its datasheet are:

• Very Narrow Viewing Angle (10°): Compared to standard LEDs with 30-60° viewing angles, this device offers superior beam concentration, ideal for directed light applications.
• AlGaInP Chip Technology: This material system is known for high efficiency in the red, orange, amber, and yellow color regions, often providing higher brightness and better color saturation than older technologies.
• High Typical Luminous Intensity (1250mcd @ 20mA): Delivers high brightness at a standard drive current, potentially reducing the number of LEDs needed for a given light output requirement.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What resistor do I need for a 5V supply?

Using Ohm's Law and the typical forward voltage (VF=2.0V) at the desired current (e.g., 20mA):
R = (5V - 2.0V) / 0.020A = 150 Ohms.
The nearest standard value is 150Ω. The power rating of the resistor should be at least P = I²R = (0.02)² * 150 = 0.06W, so a 1/8W (0.125W) or 1/4W resistor is suitable.

10.2 Can I drive this LED with 3.3V?

Yes. The forward voltage (1.7V to 2.4V) is well below 3.3V. You will need a current-limiting resistor. For example, to drive at 20mA: R = (3.3V - 2.0V) / 0.020A = 65 Ohms. A 68Ω standard resistor would result in a slightly lower current (~19.1mA).

10.3 Why is the luminous intensity given as a range (Min 630mcd, Typ 1250mcd)?

This reflects natural manufacturing variations. The LEDs are sorted into bins (CAT/Ranks) based on measured output. For consistent brightness in an application, specify or request LEDs from a specific intensity bin.

10.4 What is the difference between Peak Wavelength (591nm) and Dominant Wavelength (589nm)?

Peak Wavelength (λp) is the wavelength at which the emission spectrum has its maximum intensity.
Dominant Wavelength (λd) is the single wavelength of monochromatic light that matches the perceived color of the LED's light most closely. They are often close but not identical, especially for non-monochromatic sources. λd is more relevant for color specification.

11. Practical Use Case Example

Scenario: Designing a high-visibility power indicator for a network router.

1. Requirement: A bright, attention-grabbing yellow light visible from across a room to indicate \"power on\" status.
2. Selection Rationale: The brilliant yellow color and high intensity (up to 1250mcd) meet the visibility requirement. The narrow 10° viewing angle is acceptable as the indicator is meant to be viewed from a general frontal direction.
3. Circuit Design: The router's internal logic supply is 3.3V. Using the typical VF of 2.0V and targeting 15mA for longevity and reduced heat: R = (3.3V - 2.0V) / 0.015A = 86.7Ω. A standard 82Ω resistor is selected, resulting in a current of ~15.9mA.
4. PCB Layout: The footprint is designed per the package dimension drawing. A keep-out area of 3mm is maintained around the LED leads for soldering. The LED is placed near the front panel with a small aperture.
5. Assembly: LEDs are hand-soldered using a temperature-controlled iron at 280°C for less than 2 seconds per lead, ensuring the 3mm distance rule is followed.

12. Technology Principle Introduction

This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor technology. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region. Their recombination releases energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light. For this device, the alloy is tuned to produce photons in the yellow region of the spectrum (~589-591nm). The epoxy resin package serves to protect the semiconductor chip, act as a primary lens to shape the light output (resulting in the 10° beam), and enhance light extraction efficiency.

13. Industry Trends and Developments

The LED industry continues to evolve, even for standard indicator lamps. Relevant trends include:

• Increased Efficiency: Ongoing material and process improvements lead to higher luminous efficacy (more light output per electrical watt), allowing for lower power consumption or higher brightness from the same form factor.
• Miniaturization: There is a constant drive towards smaller package sizes (e.g., 0402, 0201 chip LEDs) while maintaining or improving optical performance, enabling denser and more compact electronic designs.
• Enhanced Reliability: Improvements in packaging materials (epoxy, silicone) lead to better resistance to thermal cycling, humidity, and UV exposure, extending operational lifetime.
• Integrated Solutions: A trend towards LEDs with built-in current-limiting resistors or IC drivers simplifies circuit design and reduces component count on the PCB.
• Color Consistency: Advances in binning and process control allow for tighter tolerances on dominant wavelength and luminous intensity, providing more uniform appearance in multi-LED applications.