Deep Red LED Lamp 333-2SDRD/S530-A3 Datasheet - 5mm Round - Voltage 2.0V - Power 60mW - English Technical Document

1. Product Overview

This document details the technical specifications for a 5mm round, through-hole, deep red LED lamp. The device is designed using AlGaInP chip technology, encapsulated in a red diffused resin, to produce a high-brightness deep red light output. It is a robust and reliable component suitable for a variety of indicator and backlighting applications in consumer electronics.

1.1 Core Features and Advantages

• High Brightness: Specifically engineered for applications requiring higher luminous intensity.
• Viewing Angle Options: Available in various viewing angles to suit different application needs.
• Packaging: Available on tape and reel for automated assembly processes.
• Environmental Compliance: The product is Pb-free and remains within RoHS compliant versions.
• Reliability: Designed to be reliable and robust for long-term operation.

1.2 Target Applications

This LED is primarily intended for use as an indicator or backlight source in various electronic devices, including but not limited to:

• Television Sets
• Computer Monitors
• Telephones
• Personal Computers and Peripherals

2. Technical Parameter Analysis

This section provides a detailed, objective interpretation of the device's key electrical, optical, and thermal parameters as defined in the Absolute Maximum Ratings and Electro-Optical Characteristics tables.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.

• Continuous Forward Current (I_F): 25 mA. This is the maximum DC current that can be continuously applied to the LED.
• Peak Forward Current (I_FP): 60 mA. This higher current is permissible only under pulsed conditions (duty cycle 1/10 @ 1 kHz), useful for multiplexing or achieving brief higher brightness.
• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (P_d): 60 mW. The maximum power the package can dissipate, calculated as V_F * I_F.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +100°C (storage). These wide ranges indicate suitability for industrial and automotive environments.
• Soldering Temperature: 260°C for 5 seconds. This defines the reflow or hand-soldering thermal profile tolerance.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured at a standard test condition of 25°C and a forward current of 20 mA.

• Luminous Intensity (I_v): 100 mcd (Min), 160 mcd (Typ). This quantifies the perceived brightness of the deep red light. The measurement uncertainty is ±10%.
• Viewing Angle (2θ_1/2): 30° (Typ). This narrow viewing angle, characteristic of a non-diffused or lightly diffused lens, produces a more focused beam of light.
• Peak Wavelength (λ_p): 650 nm (Typ). The wavelength at which the optical output power is maximum.
• Dominant Wavelength (λ_d): 639 nm (Typ). The single wavelength perceived by the human eye, defining the color. Uncertainty is ±1.0 nm.
• Forward Voltage (V_F): 2.0 V (Typ), 2.4 V (Max) at I_F=20mA. This low voltage is typical for AlGaInP red LEDs. The measurement uncertainty is ±0.1V.
• Reverse Current (I_R): 10 µA (Max) at V_R=5V. This specifies the maximum leakage current in the off state.

3. Performance Curve Analysis

The typical characteristic curves provide visual insight into the device's behavior under varying conditions, which is crucial for circuit design and thermal management.

3.1 Spectral and Spatial Distribution

The Relative Intensity vs. Wavelength curve shows a narrow spectral bandwidth (Δλ ~20 nm) centered around 650 nm, confirming the deep red color purity. The Directivity curve visually represents the 30° viewing angle, showing the angular distribution of light intensity.

3.2 Electrical and Thermal Relationships

• Forward Current vs. Forward Voltage (I-V Curve): This exponential curve is fundamental for designing current-limiting circuitry. The typical V_F of 2.0V at 20mA serves as the design point for the series resistor calculation: R = (V_supply - V_F) / I_F.
• Relative Intensity vs. Forward Current: This curve demonstrates that light output is approximately linear with current in the normal operating range, allowing for simple brightness dimming via current control.
• Relative Intensity vs. Ambient Temperature: Shows the decrease in luminous output as junction temperature rises. This thermal derating must be accounted for in high-temperature environments or high-power designs.
• Forward Current vs. Ambient Temperature: While not a direct rating, this curve, when considered with the de-rating requirement, informs the need to reduce operating current at elevated ambient temperatures to maintain reliability and prevent accelerated lumen depreciation.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The device is a standard 5mm round LED with a red diffused lens. Key dimensional notes include:

• All dimensions are in millimeters.
• The lead spacing is on a 0.1-inch (2.54mm) grid, compatible with standard prototyping boards.
• The height of the flange (the rim at the base of the dome) must be less than 1.5mm to ensure proper seating on a PCB.
• General tolerance for dimensions is ±0.25mm unless otherwise specified.

4.2 Polarity Identification

The cathode is typically identified by a flat spot on the rim of the LED package and/or by the shorter lead. Correct polarity must be observed during installation.

5. Soldering and Assembly Guidelines

Proper handling is critical to maintain device integrity and performance.

5.1 Lead Forming

• Bend leads at a point at least 3mm from the base of the epoxy bulb.
• Perform forming before soldering.
• Avoid stressing the package. Misaligned PCB holes causing lead stress can degrade the epoxy resin and LED performance.
• Cut leads at room temperature.

5.2 Storage

• Store at ≤30°C and ≤70% RH. Shelf life is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature transitions in humid environments to prevent condensation.

5.3 Soldering Process

Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

• Hand Soldering: Iron tip temperature ≤300°C (for a 30W max iron), soldering time ≤3 seconds.
• Wave or Dip Soldering: Preheat ≤100°C (max 60 sec), solder bath temperature ≤260°C for ≤5 seconds.
• Avoid stress on leads during high-temperature phases.
• Do not solder more than once (single-pass soldering).
• Allow LEDs to cool gradually to room temperature after soldering; avoid rapid quenching.

5.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Avoid ultrasonic cleaning. If absolutely required, extensive pre-qualification is necessary to ensure no damage occurs.

5.5 Heat Management

Proper thermal design is essential. The operating current must be de-rated appropriately at higher ambient temperatures, as indicated by the de-rating curve. Inadequate heat sinking can lead to reduced light output, color shift, and shortened lifespan.

6. Packaging and Ordering Information

6.1 Packing Specification

The device is packaged to prevent electrostatic discharge (ESD) and moisture damage:

• Primary Pack: Anti-static bags.
• Secondary Pack: Inner cartons containing multiple bags.
• Tertiary Pack: Outside cartons containing multiple inner cartons.
• Packing Quantity: Minimum 200-500 pieces per bag. 5 bags per inner carton. 10 inner cartons per outside carton.

6.2 Label Explanation

Labels on packaging may include codes for tracking and specification:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 333-2SDRD/S530-A3).
• QTY: Quantity contained.
• CAT / Ranks: Possibly indicates performance binning (e.g., luminous intensity grade).
• HUE: Dominant Wavelength code.
• LOT No: Traceable manufacturing lot number.

7. Application Suggestions and Design Considerations

7.1 Circuit Design

Always use a series current-limiting resistor. Calculate based on the typical V_F (2.0V) but ensure the circuit can tolerate the maximum V_F (2.4V) without exceeding the desired current. For example, with a 5V supply and target I_F of 20mA: R = (5V - 2.0V) / 0.02A = 150 Ω. Check current at max V_F: I = (5V - 2.4V) / 150 Ω ≈ 17.3 mA, which is safe.

7.2 PCB Layout

Ensure holes are accurately aligned to the 2.54mm lead spacing. Provide adequate clearance around the LED body for the 3mm minimum solder joint distance. For indicators viewed from multiple angles, consider the 30° viewing angle when positioning the LED on the assembly.

7.3 Thermal Management in Arrays

When using multiple LEDs in close proximity or at high drive currents, consider the collective heat generation. Provide adequate spacing, ventilation, or consider using a lower drive current to manage junction temperature and maintain consistent brightness and longevity.

8. Technical Comparison and Differentiation

This deep red LED, based on AlGaInP technology, offers key advantages:

• vs. Older GaAsP Red LEDs: Significantly higher luminous efficiency and brighter output for the same current.
• vs. Broad-Angle Diffused LEDs: The 30° viewing angle provides a more directed beam, ideal for panel indicators where light should be visible primarily from the front, reducing stray light.
• vs. Standard Red (~630nm): The deeper red color (639-650nm) may be preferable for specific aesthetic requirements, sensor applications, or where differentiation from orange-red is needed.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 Can I drive this LED at 25mA continuously?

Yes, 25mA is the Absolute Maximum Continuous Forward Current. However, for optimal longevity and reliability, it is standard practice to operate below the maximum rating. Driving at the typical test current of 20mA is recommended.

9.2 Why is the viewing angle only 30 degrees?

The 30° viewing angle is a design characteristic of this specific LED, achieved through the shape of the lens and the diffusion level of the resin. It is suitable for applications requiring a more focused beam of light rather than wide-area illumination.

9.3 How do I interpret the "Typical" values in the datasheet?

"Typical" values represent the expected average performance of the product under specified conditions. Individual units may vary within the Min/Max ranges provided. Always design circuits to function correctly with the worst-case combination of parameters (e.g., Min V_F with Max current limit).

9.4 Is a heat sink required?

For operation at 20mA in typical ambient conditions (<85°C), a dedicated heat sink is usually not required for a single LED due to the low power dissipation (~40mW). However, thermal management through PCB copper area becomes important in arrays, high ambient temperatures, or when operating near the maximum current.

10. Practical Use Case Example

Scenario: Designing a Power-On Indicator for a Device.

1. Requirement: A bright, deep red indicator visible from the front of a panel.
2. Component Selection: This LED is chosen for its high typical intensity (160mcd) and focused 30° viewing angle.
3. Circuit Design: The device is powered by a 3.3V rail. A series resistor is calculated: R = (3.3V - 2.0V) / 0.02A = 65 Ω. The nearest standard value of 68 Ω is selected, resulting in I_F ≈ (3.3V-2.0V)/68Ω ≈ 19.1 mA.
4. PCB Implementation: A 2.54mm spaced footprint is used. The LED is placed on the front panel with the lens protruding through a 5.2mm hole. The solder pads are placed ensuring the 3mm distance rule from the LED body is maintained.
5. Assembly: LEDs are hand-soldered using a temperature-controlled iron set to 280°C, with the solder joint completed in under 3 seconds, well below the bulb.

11. Operating Principle

This is a semiconductor light-emitting diode. When a forward voltage exceeding the junction's built-in potential is applied, electrons and holes are injected into the active region from the n-type and p-type materials, respectively. In the AlGaInP (Aluminum Gallium Indium Phosphide) chip, these charge carriers recombine, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the deep red wavelength of light emitted (~650 nm). The red diffused epoxy resin encapsulates the chip, providing mechanical protection, shaping the light output (30° viewing angle), and diffusing the light to create a uniform appearance.

12. Technology Trends

While this through-hole 5mm LED represents a mature and widely used package technology, the broader LED industry trends continue to focus on:

• Increased Efficiency: Ongoing material science improvements aim to produce more lumens per watt (higher efficacy) from AlGaInP and other semiconductor materials.
• Surface-Mount Device (SMD) Dominance: For automated, high-volume assembly, SMD packages (like 0603, 0805, 1206, and specialized LED packages) have largely replaced through-hole LEDs in new designs due to smaller size and lower assembly cost.
• Color Consistency and Binning: Manufacturing processes continue to advance, allowing for tighter bins (groupings) of wavelength (color) and luminous intensity, giving designers more predictable performance.
• Reliability and Lifetime: Research focuses on improving lumen maintenance (resistance to light output decay over time) and longevity, especially under high-temperature and high-current operating conditions.

The 5mm through-hole LED remains a staple for prototyping, hobbyist projects, educational purposes, and applications where manual assembly or replacement is anticipated, supported by its simplicity, robustness, and widespread availability.