1383SDRD/S530-A3 LED Lamp Datasheet - Deep Red - 650nm - 320mcd - 30° Viewing Angle - English Technical Document

1. Product Overview

The 1383SDRD/S530-A3 is a high-brightness, deep-red LED lamp designed for through-hole mounting. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) chip material to produce a deep red emitted color with a red diffused resin lens. This series is engineered for applications demanding superior luminous intensity and reliable performance.

1.1 Core Features and Advantages

• High Brightness: Specifically designed for applications requiring higher luminous output.
• Viewing Angle Options: Available in various viewing angles to suit different application needs.
• Robust Construction: Built for reliability and durability in demanding environments.
• Compliance: The product is Pb-free, compliant with RoHS, EU REACH, and Halogen-Free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).
• Packaging: Available on tape and reel for automated assembly processes.

1.2 Target Applications

This LED is suitable for a wide range of indicator and backlighting applications, including but not limited to: television sets, computer monitors, telephones, and general computing equipment.

2. Technical Specifications and In-Depth Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Continuous Forward Current (I_F): 25 mA
• Peak Forward Current (I_FP): 60 mA (Duty Cycle 1/10 @ 1 kHz)
• Reverse Voltage (V_R): 5 V
• Power Dissipation (P_d): 60 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Soldering Temperature (T_sol): 260°C for 5 seconds (wave or hand soldering)

2.2 Electro-Optical Characteristics (T_a = 25°C)

These parameters define the typical performance of the LED under standard test conditions (I_F = 20 mA).

• Luminous Intensity (I_v): 160 mcd (Min), 320 mcd (Typical). This high intensity is a key feature for visibility.
• Viewing Angle (2θ_1/2): 30° (Typical). This defines the angular spread where intensity is at least half of the peak value.
• Peak Wavelength (λ_p): 650 nm (Typical). The wavelength at which the optical output power is maximum.
• Dominant Wavelength (λ_d): 639 nm (Typical). The single wavelength perceived by the human eye, defining the color.
• Spectral Bandwidth (Δλ): 20 nm (Typical). The range of wavelengths emitted, centered around the peak.
• Forward Voltage (V_F): 1.7 V (Min), 2.0 V (Typ), 2.4 V (Max). The voltage drop across the LED when conducting 20mA.
• Reverse Current (I_R): 10 µA (Max) at V_R = 5V.

Measurement Tolerances: Forward Voltage (±0.1V), Luminous Intensity (±10%), Dominant Wavelength (±1.0nm). These must be considered in precision designs.

2.3 Thermal Characteristics

Proper heat management is critical for LED longevity and performance stability. The operating and storage temperature ranges must be adhered to. The power dissipation limit of 60mW must be respected, which often requires current derating at higher ambient temperatures.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that are essential for understanding device behavior under varying conditions.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, peaking at 650nm with a typical bandwidth of 20nm, confirming the deep red color output.

3.2 Directivity Pattern

Illustrates the spatial distribution of light, confirming the 30° viewing angle. The intensity is highest at 0° (on-axis) and decreases symmetrically.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This non-linear relationship is fundamental for driver design. The typical V_F is 2.0V at 20mA. The curve shows the exponential relationship typical of a diode.

3.4 Relative Intensity vs. Forward Current

Shows that light output is approximately proportional to forward current within the operating range, though efficiency may vary.

3.5 Relative Intensity vs. Ambient Temperature

Demonstrates the negative temperature coefficient of luminous output. Intensity decreases as ambient temperature rises, highlighting the need for thermal management.

3.6 Forward Current vs. Ambient Temperature

Often used to determine necessary current derating. To maintain reliability, the maximum allowable forward current decreases as ambient temperature increases towards the maximum operating limit.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED features a standard 3mm round radial leaded package. Key dimensional notes include:

• All dimensions are in millimeters (mm).
• The height of the flange must be less than 1.5mm (0.059\").
• Standard tolerance is ±0.25mm unless otherwise specified.

The detailed dimensioned drawing in the datasheet provides exact measurements for lead spacing, body diameter, and overall height, which are critical for PCB footprint design and ensuring proper fit in enclosures.

4.2 Polarity Identification

The cathode is typically identified by a flat spot on the LED lens rim and/or by the shorter lead. Correct polarity must be observed during installation.

5. Soldering and Assembly Guidelines

Adherence to these guidelines is crucial to prevent damage during the manufacturing process.

5.1 Lead Forming

• Bending must occur at a point at least 3mm from the base of the epoxy bulb.
• Form leads before soldering.
• Avoid stressing the package. Misaligned PCB holes causing lead stress can degrade the epoxy and LED performance.
• Cut leads at room temperature.

5.2 Storage Conditions

• Store at ≤30°C and ≤70% Relative Humidity (RH).
• Shelf life after shipping is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

General Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering:
- Iron Tip Temperature: 300°C Max (30W iron max).
- Soldering Time: 3 seconds Max per lead.

Wave/Dip Soldering:
- Preheat Temperature: 100°C Max (60 sec Max).
- Solder Bath Temperature & Time: 260°C Max for 5 seconds Max.

Critical Soldering Notes:

• Avoid mechanical stress on leads while the LED is hot.
• Do not perform dip/hand soldering more than once.
• Protect the LED from shock/vibration until it cools to room temperature after soldering.
• Avoid rapid cooling from peak soldering temperature.
• Always use the lowest effective soldering temperature.
• Wave soldering parameters must be strictly controlled.

5.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Air dry at room temperature.
• Avoid ultrasonic cleaning. If absolutely required, extensive pre-qualification is necessary to ensure no damage occurs, as it depends on power and assembly conditions.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packed to ensure electrostatic discharge (ESD) protection and moisture resistance.

• Primary Pack: Anti-electrostatic bag.
• Secondary Pack: Inner carton containing multiple bags.
• Tertiary Pack: Outside carton containing multiple inner cartons.

6.2 Packing Quantity

• 200-500 pieces per anti-static bag.
• 5 bags per inner carton.
• 10 inner cartons per outside carton.

6.3 Label Explanation

Labels on packaging contain key information: Customer's Part Number (CPN), Manufacturer's Part Number (P/N), Quantity (QTY), Binning Ranks (CAT), Dominant Wavelength (HUE), Reference data (REF), and Lot Number (LOT No).

7. Application Notes and Design Considerations

7.1 Typical Application Circuits

Always use a current-limiting resistor in series with the LED when connecting to a voltage source. The resistor value can be calculated using Ohm's Law: R = (V_source - V_F) / I_F. For a 5V source and a target I_F of 20mA with V_F = 2.0V: R = (5V - 2.0V) / 0.02A = 150 Ω. The resistor power rating should be P = I_F² * R = (0.02)² * 150 = 0.06W, so a standard 1/8W or 1/4W resistor is sufficient.

7.2 Heat Management in Design

As noted in the datasheet, thermal management must be considered during the design stage. For continuous operation at high ambient temperatures or at currents near the maximum rating, consider:

• Implementing current derating based on the I_F vs. T_a curve.
• Providing adequate ventilation or heatsinking if the LED is enclosed.
• Using a PCB with thermal relief or a larger copper area connected to the LED leads to act as a heat sink.

7.3 Long-Term Reliability

Operating the LED well within its Absolute Maximum Ratings, particularly for current and temperature, is the primary factor ensuring long-term reliability. Avoiding electrical overstress (EOS) from transients and electrostatic discharge (ESD) is also critical, even though the device has some inherent protection (5V reverse voltage rating).

8. Frequently Asked Questions (FAQ)

8.1 What is the difference between Peak Wavelength (650nm) and Dominant Wavelength (639nm)?

Peak Wavelength is the physical wavelength where the LED emits the most optical power. Dominant Wavelength is the psychophysical single wavelength that the human eye perceives as matching the color of the LED's total light output. For deep red LEDs, the dominant wavelength is often slightly shorter than the peak wavelength due to the shape of the emission spectrum and the human eye's sensitivity (photopic response).

8.2 Can I drive this LED with a constant voltage source?

It is strongly discouraged. LEDs are current-driven devices. Their forward voltage has a tolerance and varies with temperature. Connecting directly to a voltage source slightly above V_F can cause a large, potentially destructive, increase in current. Always use a series current-limiting resistor or a dedicated constant-current LED driver.

8.3 Why is the storage condition (3 months) important?

LED packages can absorb moisture from the atmosphere. During the high-temperature soldering process, this trapped moisture can rapidly expand, causing internal delamination or \"popcorning,\" which cracks the epoxy package and destroys the LED. The 3-month shelf life assumes standard factory dry-pack conditions. For components stored longer or in humid environments, baking before soldering is often required, following the manufacturer's or industry-standard (e.g., IPC/JEDEC) guidelines.

8.4 What does \"Pb-free\" and \"Halogen-Free\" mean?

\"Pb-free\" indicates the product does not contain lead, complying with environmental regulations like RoHS. \"Halogen-Free\" (specifically Br <900ppm, Cl <900ppm, Br+Cl <1500ppm) means it contains very low levels of bromine and chlorine, which are used as flame retardants. Reducing halogens is beneficial for environmental and safety reasons during disposal or in case of fire.