Component Lifecycle Data Sheet - Revision 2 - Release Date 2014-12-02 - English Technical Document

1. Product Overview

This technical document provides critical lifecycle management information for an electronic component. The core function of this document is to establish a definitive record of the component's revision status and release timeline, serving as a single source of truth for engineering, procurement, and quality assurance teams. Its primary advantage lies in ensuring traceability and consistency across manufacturing and supply chains, preventing the use of outdated or incorrect component versions in production. The target market includes all sectors utilizing electronic assemblies where version control and lifecycle management are paramount, such as consumer electronics, industrial automation, telecommunications, and automotive electronics.

2. Technical Parameters Deep Objective Interpretation

While the provided PDF excerpt focuses on administrative data, a comprehensive technical document would typically include detailed specifications. Based on standard industry practice, the following sections would be present in a full datasheet and are interpreted here for context.

2.1 Lifecycle and Revision Parameters

The key parameters extracted are the Lifecycle Phase and Revision Number. The lifecycle phase "Revision" indicates the component is in an active state where updates and improvements are being made. The revision number "2" specifies this is the second official iteration of the component's design or documentation. This is a critical parameter for change management.

2.2 Temporal Parameters

The Release Date parameter is "2014-12-02 15:00:46.0". This timestamp provides an absolute reference point for when this specific revision (Revision 2) was officially issued and became the active version for design and manufacturing purposes.

2.3 Validity Parameter

The Expired Period is stated as "Forever". This is a significant parameter indicating that this revision of the documentation does not have a planned obsolescence date from an administrative standpoint. It will remain the valid reference until superseded by a subsequent revision. This does not necessarily reflect the component's production lifespan but the validity of this document version.

3. Grading System Explanation

Although not explicitly detailed in the snippet, component datasheets often include grading or binning systems for key performance characteristics. For an electronic component, common grading parameters could include:

• Performance Grade: Components may be sorted based on measured electrical parameters like leakage current, switching speed, or gain, ensuring they meet specific thresholds for different application tiers.
• Tolerance Grade: Classification based on the precision of component values (e.g., resistor tolerance of 1%, 5%).
• Temperature Grade: Sorting components based on their operational temperature range (e.g., commercial, industrial, automotive).

The absence of such data in this excerpt suggests this document is a cover sheet or summary focusing on revision control rather than the detailed performance bins.

4. Performance Curve Analysis

A full datasheet would contain graphical representations of component behavior. Key performance curves typically include:

• I-V (Current-Voltage) Characteristics: Plots showing the relationship between input current and output voltage, crucial for understanding operating points and limits.
• Temperature Derating Curves: Graphs illustrating how maximum allowable power or current decreases as ambient temperature increases, essential for thermal management.
• Frequency Response: For active components, plots showing gain or impedance versus signal frequency.
• Switching Characteristics: Timing diagrams detailing rise time, fall time, and propagation delays for digital components.

These curves allow engineers to predict component behavior under real-world operating conditions beyond the simple maximum/minimum ratings listed in tables.

5. Mechanical and Packaging Information

Precise mechanical data is fundamental for PCB (Printed Circuit Board) design and assembly. This section would normally contain:

• Dimensional Outline Drawing: A detailed diagram showing the component's exact length, width, height, and any protruding features.
• Land Pattern Design: The recommended copper pad layout on the PCB to which the component will be soldered, ensuring a reliable mechanical and electrical connection.
• Polarity Identification: Clear markings (such as a dot, notch, or beveled edge) and corresponding PCB silkscreen indicators to ensure the component is oriented correctly during assembly.
• Package Type: Specification of the housing (e.g., SOT-23, QFN, 0805).

6. Soldering and Assembly Guidelines

To ensure long-term reliability, manufacturers provide specific instructions for attaching the component to a circuit board.

• Reflow Soldering Profile: A time-temperature graph specifying the ideal preheat, soak, reflow, and cooling stages for the solder paste used with this component. Critical parameters include peak temperature (typically 240-260°C for lead-free solder) and time above liquidus.
• Hand Soldering Instructions: If applicable, guidelines for iron temperature, tip size, and maximum contact time.
• Moisture Sensitivity Level (MSL): A rating indicating how long the component can be exposed to ambient air before it must be baked to remove absorbed moisture, preventing "popcorning" during reflow.
• Storage Conditions: Recommended temperature and humidity ranges for storing components before use to preserve solderability and prevent degradation.

7. Packaging and Ordering Information

This section details how the component is supplied and how to specify the correct version when ordering.

• Packaging Specification: Describes the carrier medium (e.g., tape and reel, tube, tray) including reel dimensions, pocket spacing, and component orientation on the tape.
• Label Information: Explains the data printed on the packaging, which typically includes part number, quantity, date code, lot number, and manufacturer code.
• Model Numbering Rule: A breakdown of the part number code, where each segment indicates a specific attribute (e.g., base part, tolerance, packaging, temperature grade). This allows precise identification of the required component variant.

8. Application Suggestions

Guidance on where and how to best utilize the component.

• Typical Application Circuits: Schematic examples showing the component in common configurations, such as in a voltage regulator circuit, a signal conditioning stage, or as a pull-up/pull-down resistor.
• Design Considerations: Important notes for the circuit designer, such as the need for decoupling capacitors nearby, maximum trace lengths for high-speed signals, or layout recommendations to minimize parasitic effects.
• Absolute Maximum Ratings: Stresses beyond which permanent damage may occur (voltage, current, temperature, power). Designers must ensure operating conditions stay well within these limits with appropriate safety margins.

9. Technical Comparison

While this specific document does not provide comparative data, a comprehensive analysis might highlight this component's position relative to alternatives. Potential points of differentiation could include:

• Performance vs. Cost: How its specifications balance with its price point compared to competitors.
• Integration Level: Whether it integrates multiple functions into a single package, saving board space.
• Power Efficiency: Comparative analysis of quiescent current, switching losses, or conduction losses.
• Form Factor: Advantages in size or profile compared to other components serving the same function.

10. Frequently Asked Questions

Answers to common queries based on the technical parameters.

• Q: What is the significance of the "Revision 2" designation? A: It indicates this is the second official version of the component or its documentation. Changes from Revision 1 could include performance improvements, fixed errata, updated test procedures, or modified mechanical drawings. Always consult an Engineering Change Notice (ECN) for specific details on changes between revisions.
• Q: Does "Expired Period: Forever" mean the component will be produced indefinitely? A: No. This refers to the administrative validity of this document revision. The component's production lifespan is determined by market demand and the manufacturer's product lifecycle management. "Forever" here means this document version does not have a pre-set expiration date and remains valid until officially replaced by a new revision.
• Q: How should I handle components from different revision levels in my inventory? A: It is critical to maintain revision control. Mixing revisions on the same PCB assembly is generally not recommended unless the manufacturer explicitly states they are form-fit-function compatible. Always verify compatibility through the manufacturer's ECN documentation.

11. Practical Use Case

Consider a power supply design project initiated in early 2014. The design team selects a specific voltage regulator component, basing their schematic and layout on its Revision 1 datasheet. In December 2014, the manufacturer releases Revision 2. The project manager must:

1. Obtain the Revision 2 datasheet and any associated ECNs.
2. Review the changes. If the changes are minor (e.g., updated test data) and the manufacturer confirms drop-in compatibility, the design may proceed with the new revision.
3. If the changes are significant (e.g., a modified pinout or different thermal pad), the PCB layout may need to be updated before manufacturing.
4. Update the company's internal Bill of Materials (BOM) to specify "Revision 2 or later" to ensure future builds use the correct component version.

This process, governed by the data in this lifecycle document, prevents assembly errors and field failures.

12. Principle Introduction

The principle behind rigorous lifecycle and revision documentation is rooted in configuration management and quality assurance in electronics manufacturing. Every physical component and its accompanying documentation are treated as a "configuration item." Changes to any attribute—electrical, mechanical, or material—constitute a revision. Documenting these revisions with precise identifiers (number, date) creates an auditable trail. This allows complex supply chains, involving designers, component manufacturers, contract assemblers, and end-users, to synchronize on the exact version of a part being used at any point in time. It is a foundational practice for ensuring product consistency, facilitating troubleshooting, and managing field updates or recalls.

13. Development Trends

The field of component documentation and lifecycle management is evolving with industry trends:

• Digital Thread and Digital Twin: Increasing integration of component data (from datasheets to lifecycle status) into digital product models. Revision information will be automatically linked to CAD models and simulation parameters.
• Blockchain for Supply Chain Provenance: Exploration of distributed ledgers to create immutable, transparent records of component revisions and ownership transfers from manufacturer to end product, crucial for combating counterfeits and ensuring authenticity in critical industries like aerospace and medical devices.
• AI-Powered Change Impact Analysis: Advanced systems that can automatically analyze an ECN for a component revision and assess its potential impact on existing designs in a company's portfolio, flagging designs that may require re-evaluation.
• Standardization of Data Formats: A push towards machine-readable datasheets (using formats like IPC-2581, STEP AP242) to automate the ingestion of component parameters, including lifecycle data, directly into design and ERP systems, reducing manual entry errors.

These trends point towards a future where the static PDF datasheet is augmented or replaced by dynamic, linked data sources, making the accurate tracking of revisions like "Revision 2" even more seamless and integral to the product development lifecycle.