5050 Full Color SMT LED Datasheet - 5.0x5.0x1.6mm - Red/Green/Blue - 150mA - English Technical Document

1. Product Overview

This document details the technical specifications for a high-performance, full-color Surface-Mount Technology (SMT) LED. The device integrates individual red, green, and blue semiconductor chips within a single 5050 package, enabling the generation of a wide spectrum of colors through additive color mixing. The primary design goals are high luminous output, wide viewing angle, and suitability for automated assembly processes.

1.1 Core Features and Advantages

• High Luminosity Chips: Utilizes advanced semiconductor materials (GaInAlP for red, InGaN for green and blue) to achieve superior light output.
• SMT Package: White plastic SMT package designed for compatibility with standard infrared (IR) reflow soldering processes, facilitating high-volume, automated PCB assembly.
• Individual Chip Control: Features a 6-pin lead frame package where the anode and cathode for each color (Red, Green, Blue) are independently accessible. This allows for precise individual driving and control of each color channel, essential for color tuning and serial connection of multiple LEDs.
• Wide Viewing Angle: The package design yields a typical viewing angle (2θ_1/2) of 120 degrees, ensuring good visibility from a broad range of perspectives.
• Environmental Compliance: The product is lead-free (Pb-free), compliant with the EU REACH regulation, and meets halogen-free standards (Br < 900ppm, Cl < 900ppm, Br+Cl < 1500ppm). The product itself conforms to RoHS directives.
• Reliability: Preconditioning is based on JEDEC J-STD-020D Level 3 standards, indicating robustness against moisture-induced stress during soldering.

1.2 Target Applications

The combination of high brightness, full-color capability, and SMT form factor makes this LED suitable for various applications requiring vibrant, controllable illumination.

• Amusement and Gaming Equipment: For decorative lighting, status indicators, and interactive light effects.
• Information Display Boards: Used in signage, message boards, and other displays where multi-color indication is necessary.
• Mobile Device Flashlights: Suitable as a camera flash or fill-light for cellular phones and digital cameras, leveraging its small size and color capability.
• Light Pipe Applications: The wide viewing angle and point-source nature make it ideal for coupling into light guides or pipes for edge-lit panels or indicator systems.

2. Technical Specifications and In-Depth Interpretation

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Forward Current (I_F): 150 mA for each color (Red, Green, Blue). This is the maximum continuous DC current recommended for reliable operation.
• Peak Forward Current (I_FP): 200 mA for each color, permissible only under pulsed conditions (duty cycle 1/10, frequency 1 kHz). Exceeding the continuous rating even briefly can degrade the chip.
• Power Dissipation (P_d): Red: 420 mW; Green/Blue: 555 mW. This is the maximum power the package can dissipate as heat at 25°C ambient. Proper PCB thermal design is crucial to stay within this limit during operation.
• Junction Temperature (T_j): Maximum 115°C. The temperature of the semiconductor chip itself must not exceed this value.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +100°C (storage).
• Soldering Temperature: Reflow soldering: 260°C peak temperature for 10 seconds maximum. Hand soldering: 350°C for 3 seconds maximum. These profiles are critical to prevent package cracking or internal bond wire damage.

2.2 Electro-Optical Characteristics (Ta=25°C)

These are the typical performance parameters measured under standard test conditions (25°C ambient, I_F=150mA per color).

• Luminous Flux (I_v): The total visible light output.
  • Red: Typical 25 lumens (lm), range 13.9-39.8 lm.
  • Green: Typical 40 lm, range 13.9-51.7 lm.
  • Blue: Typical 8.5 lm, range 4.9-18.1 lm.
• Luminous Intensity (I_v): The light output in a specific direction (candela). Typical values are 7550 mcd (Red), 12100 mcd (Green), and 2550 mcd (Blue).
• Viewing Angle (2θ_1/2): 120 degrees typical (110-130 deg range). This is the full angle where intensity is at least half of the peak value.
• Dominant Wavelength (λ_d): The perceived color of the light.
  • Red: 622 nm typical (617-629 nm).
  • Green: 525 nm typical (518-530 nm).
  • Blue: 457 nm typical (455-470 nm).
• Forward Voltage (V_F): The voltage drop across the LED at the test current.
  • Red: 2.3V typical (1.8-2.8V).
  • Green: 3.4V typical (2.7-3.7V).
  • Blue: 3.2V typical (2.7-3.7V).
  Note the significant difference between red and blue/green voltages, requiring separate current-limiting circuit design for each channel.
• Reverse Current (I_R): Maximum 10 μA at a reverse bias of 5V. LEDs are not designed for reverse voltage operation.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted (binned) based on key optical and electrical parameters. This allows designers to select parts that meet specific application requirements for color and brightness uniformity.

3.1 Luminous Flux Binning

LEDs are categorized into bins based on their measured light output at 150mA. The bins for each color have overlapping ranges to cover the full Min-Max specification.

• Red (R): Bins R1 through R4, covering 13.9 lm to 39.8 lm.
• Green (G): Bins G1 through G5, covering 13.9 lm to 51.7 lm.
• Blue (B): Bins B1 through B5, covering 4.9 lm to 18.1 lm.

A tolerance of ±11% applies to the luminous flux values within each bin.

3.2 Forward Voltage Binning

LEDs are binned by their forward voltage drop to aid in circuit design and power supply selection.

• Red: Single bin "1828" covering 1.8V to 2.8V.
• Green & Blue: Single bin "2737" covering 2.7V to 3.7V.

A tolerance of ±0.1V applies.

3.3 Dominant Wavelength Binning

This is the most critical binning for color-sensitive applications, ensuring a consistent hue.

• Red: Bins RA (617-621 nm), RB (621-625 nm), RC (625-629 nm).
• Green: Bins GA through GD (518-530 nm in ~3nm steps).
• Blue: Bins BA through BE (455-470 nm in ~3nm steps).

A tolerance of ±1nm applies to the dominant wavelength.

4. Performance Curve Analysis

4.1 Spectral Distribution

The typical spectral distribution curve shows the relative intensity of light emitted across different wavelengths for each chip. The red chip emits in a narrow band centered around 622nm. The green chip emits around 525nm, and the blue chip around 457nm. The purity of these spectral peaks is important for achieving saturated colors. The curve should be compared to the standard human eye response curve (V(λ)) to understand perceived brightness.

4.2 Radiation Pattern

The diagram of radiation characteristics illustrates the spatial distribution of light intensity (relative intensity vs. angle). The curve confirms the wide, Lambertian-like emission pattern with a typical 120-degree viewing angle, where intensity is fairly uniform across the central region and falls off towards the edges.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve for the blue chip (and implied for others) shows the exponential relationship between current and voltage. Below the turn-on voltage (~2.7V for blue/green, ~1.8V for red), very little current flows. Above this threshold, current increases rapidly with a small increase in voltage. This characteristic necessitates the use of a constant-current driver, not a constant-voltage source, to prevent thermal runaway and ensure stable light output.

4.4 Dominant Wavelength vs. Forward Current

These curves for Red, Green, and Blue chips show how the emitted color (dominant wavelength) shifts with driving current. Typically, as current increases, junction temperature rises, causing a slight shift in wavelength (usually towards longer wavelengths for InGaN-based green/blue LEDs). This effect is important for applications requiring precise color stability across different brightness levels.

4.5 Relative Luminous Intensity vs. Forward Current

This curve depicts the light output (relative to a reference) as a function of drive current. It is generally linear at lower currents but may exhibit saturation or roll-off at higher currents due to thermal effects and efficiency droop. The curve informs the trade-off between brightness and efficiency/heat.

4.6 Maximum Permissible Forward Current vs. Temperature

This derating curve is crucial for thermal management. It shows the maximum safe continuous forward current as a function of the ambient (or case) temperature. As temperature increases, the maximum allowable current decreases linearly. For example, at 85°C, the permissible current is significantly lower than the 150mA rating at 25°C. Designers must use this graph to ensure the LED is not overdriven in the application's operating environment.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a standard 5050 SMT package. The key dimensions are:

• Package Length: 5.0 mm
• Package Width: 5.0 mm
• Package Height (typical): 1.6 mm

Tolerances are ±0.1mm unless otherwise specified. A detailed dimensioned drawing (top, side, and bottom views) is provided in the datasheet, showing the pin layout and mechanical features.

5.2 Pinout and Polarity Identification

The package has six pins arranged in two rows of three. The pin numbering is typically counter-clockwise when viewed from the top. The datasheet diagram clearly labels the anode and cathode pins for the Red, Green, and Blue chips. Correct polarity identification is essential to prevent reverse biasing the LED during assembly. The bottom view often includes a polarity marker (such as a chamfered corner or a dot) to aid orientation on the PCB.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The recommended profile for infrared (IR) reflow soldering is a critical process parameter.

• Peak Temperature: 260°C maximum.
• Time Above Liquidus (TAL): The time the solder joints spend above the melting point should be controlled, typically aiming for the recommended 10 seconds at peak temperature.
• Ramp Rates: Controlled heating and cooling rates (e.g., 1-3°C/second) are recommended to minimize thermal shock to the plastic package and internal bonds.

It is imperative to follow the JEDEC J-STD-020D Level 3 moisture sensitivity level (MSL) precautions. If the devices have been exposed to ambient air beyond their specified floor life, they must be baked before reflow to prevent "popcorning" (package cracking due to rapid vapor expansion).

6.2 Hand Soldering

If manual soldering is necessary, extreme care must be taken:

• Limit iron tip temperature to 350°C maximum.
• Limit contact time per pin to 3 seconds maximum.
• Use a heat sink (e.g., tweezers) on the lead between the joint and the package body to prevent excessive heat from traveling into the LED.

6.3 Storage Conditions

Devices should be stored in their original moisture-barrier bags with desiccant at temperatures between -40°C and +100°C, in a non-condensing environment. Once the sealed bag is opened, the devices' exposure to ambient humidity is limited by their MSL rating (Level 3).

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The LEDs are supplied in embossed carrier tape on reels for automated pick-and-place machines.

• Carrier Tape Dimensions: Pocket size (Dim A): 5.70±0.10 mm, (Dim B): 5.38±0.10 mm, Depth (Dim C): 1.60±0.10 mm.
• Reel Dimensions: Standard 13-inch (330mm) reel dimensions are provided.
• Quantity per Reel: Standard packing is 1000 pieces per reel. Minimum order quantities can be 250 or 500 pieces per reel.

7.2 Label Explanation

The reel label contains codes that specify the binning of the LEDs on that reel:

• CAT: Luminous Intensity Rank (based on luminous flux bin).
• HUE: Dominant Wavelength Rank (wavelength bin code).
• REF: Forward Voltage Rank (voltage bin code).
• LOT No: Traceability lot number.
• P/N: Full product number.
• QTY: Quantity on the reel.

Consulting these codes is essential when ordering to ensure receipt of parts with the specific optical and electrical characteristics required for the application.

8. Application Design Considerations

8.1 Driver Circuit Design

Due to the different forward voltages of the red (∼2.3V) and green/blue (∼3.4V) chips, a simple series connection with a single current-limiting resistor is not optimal if uniform current is desired. The recommended approach is to use separate current-limiting resistors for each color channel or, better yet, a dedicated constant-current LED driver IC with multiple channels. This ensures consistent brightness and color regardless of supply voltage variations or V_F bin spread. Pulse-Width Modulation (PWM) is the preferred method for dimming and color mixing, as it maintains a constant current (and thus stable color point) while varying the duty cycle.

8.2 Thermal Management

The power dissipation per LED can be up to 0.555W (for green/blue at 150mA). When multiple LEDs are used on a board, the total heat generation can be significant. Proper thermal design is critical:

• PCB Layout: Use a PCB with sufficient copper area (thermal pads) connected to the LED's thermal pad (if present) or leads to conduct heat away.
• Thermal Vias: Implement an array of thermal vias under the LED footprint to transfer heat to inner ground planes or the bottom side of the board.
• Derating: Always consult the maximum current vs. temperature derating curve. In high ambient temperature applications, reduce the drive current accordingly to keep the junction temperature below 115°C.

8.3 Optical Design

The wide 120-degree viewing angle is beneficial for general illumination but may require secondary optics (lenses, reflectors) for applications needing a focused beam. For light pipe applications, the small emitting area and wide angle facilitate efficient coupling. When designing for color mixing, consider the spatial overlap of the red, green, and blue emission patterns to achieve uniform blended colors at the target.

9. Technical Comparison and Differentiation

Compared to earlier RGB LED packages or discrete single-color LEDs, this device offers several key advantages:

• Integration: Three chips in one SMT package save PCB space and simplify assembly versus using three separate LEDs.
• Individual Control: The 6-pin design provides true independent anode/cathode access for each color, offering superior flexibility compared to common-anode or common-cathode 4-pin RGB LEDs. This enables more complex driving schemes like serial connection for higher voltage operation.
• Performance: The use of "super-luminosity" chips suggests higher efficiency and light output than standard offerings in the same package size.
• Compliance: Full compliance with modern environmental regulations (RoHS, REACH, Halogen-Free) is a baseline requirement but is explicitly confirmed here.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Can I drive all three colors with a single 5V supply and one resistor?

Not optimally. The forward voltage of the green and blue LEDs (∼3.4V) leaves only ∼1.6V for a current-limiting resistor at 5V, which allows for stable current control. However, the red LED (∼2.3V) would have ∼2.7V across its resistor. Using one resistor value for all three would result in vastly different currents and brightness levels due to the different V_F values. Separate resistors or a constant-current driver are required.

10.2 What is the difference between luminous flux (lm) and luminous intensity (mcd)?

Luminous flux (lumens) measures the total amount of visible light emitted by the source in all directions. Luminous intensity (candelas) measures how bright the source appears in a specific direction. For a wide-angle LED like this, the intensity value is the peak value typically measured on-axis. The total flux gives a better idea of the overall light output for illumination, while intensity is relevant for indicators viewed from a specific angle.

10.3 How do I achieve white light with this RGB LED?

White light is created by mixing appropriate intensities of red, green, and blue light. The exact ratios depend on the specific chromaticity target (e.g., cool white, warm white) and the spectral characteristics of the individual LEDs. Due to variations in chip efficiency and binning, achieving a consistent, high-quality white point typically requires individual calibration or feedback from a color sensor in the system. It is more complex than using a dedicated white LED phosphor.

10.4 Why is the maximum junction temperature only 115°C?

The junction temperature limit is determined by the materials used in the LED chip, bond wires, and package. Excessive heat accelerates degradation mechanisms, reducing light output (lumen depreciation) and potentially causing catastrophic failure. Operating at or near the maximum T_j will significantly shorten the device's lifetime. Good thermal design aims to keep the junction temperature as low as possible during operation.

11. Practical Design and Usage Examples

11.1 Example: Status Indicator for a Consumer Device

In a smart home device, a single 5050 RGB LED can provide multiple status codes: red for error, green for ready, blue for Bluetooth pairing, yellow (red+green) for standby, etc. The wide viewing angle ensures visibility from any direction. A simple microcontroller with three PWM-capable GPIO pins and three current-limiting resistors (e.g., 15-20Ω for ~20mA from a 3.3V or 5V supply) can drive the LED. The low current extends lifetime and minimizes heat.

11.2 Example: Backlighting for a Small Sign

For edge-lighting an acrylic sign, several of these LEDs can be placed along the edge. Their wide angle helps couple light into the acrylic. By arranging them in a series string (e.g., all reds in series, all greens in series, all blues in series), a higher voltage, lower current driver can be used, improving efficiency. The independent control allows the sign's color to be programmed dynamically. Thermal management involves ensuring the acrylic or mounting substrate can dissipate the heat from the combined LED array.

12. Operating Principle

The device operates on the principle of electroluminescence in semiconductor materials. When a forward voltage exceeding the chip's bandgap energy is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons (light). The color (wavelength) of the emitted light is determined by the bandgap energy of the semiconductor material: GaInAlP for red light (~622 nm), and InGaN for green (~525 nm) and blue (~457 nm) light. Three separate semiconductor chips, fabricated from these different materials, are mounted within a single reflective cup and encapsulated in a clear or diffused resin to form the complete LED package.

13. Technology Trends

The general trend in full-color SMT LEDs like this is towards higher efficiency (more lumens per watt), improved color consistency (tighter binning), and higher maximum drive currents in the same or smaller package sizes. There is also a move towards integrating control electronics (like constant-current drivers or even simple microcontrollers) within the LED package itself, creating "smart LED\