1. Product Overview
This document details the specifications for a high-brightness, brilliant green LED lamp. The device is part of a series engineered for applications demanding superior luminous output. It utilizes InGaN chip technology encapsulated in a water-clear resin, resulting in a vibrant and intense green emission. The product is designed with reliability and robustness as key attributes, making it suitable for integration into various electronic assemblies.
1.1 Core Advantages
The LED offers several key advantages for designers and manufacturers. It provides a choice of various viewing angles to suit different optical requirements. The component is available on tape and reel for compatibility with automated pick-and-place assembly processes, enhancing production efficiency. Furthermore, the product is compliant with major environmental and safety regulations, including RoHS, EU REACH, and is manufactured as halogen-free, ensuring it meets stringent global standards for electronic components.
1.2 Target Market & Applications
This LED is targeted at the consumer electronics and display backlighting markets. Its primary applications include use as an indicator or backlight source in television sets, computer monitors, telephones, and other computing devices where a clear, bright green signal is required.
2. In-Depth Technical Parameter Analysis
The performance of the LED is defined under specific test conditions, typically at an ambient temperature (Ta) of 25°C. Understanding these parameters is crucial for proper circuit design and thermal management.
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation.
- Continuous Forward Current (IF): 25 mA. Exceeding this current can lead to excessive junction temperature and accelerated degradation.
- Peak Forward Current (IFP): 100 mA (at a duty cycle of 1/10 and 1 kHz frequency). This rating is for pulsed operation only.
- Reverse Voltage (VR): 5 V. Applying a higher reverse voltage can cause breakdown.
- Power Dissipation (Pd): 90 mW. This is the maximum power the package can dissipate.
- Operating & Storage Temperature: Ranges from -40°C to +85°C (operating) and -40°C to +100°C (storage).
- Soldering Temperature (Tsol): 260°C for a maximum of 5 seconds, defining the reflow soldering profile tolerance.
2.2 Electro-Optical Characteristics
These are the typical performance parameters measured at the standard test current of IF=20mA.
- Luminous Intensity (Iv): Ranges from 5000 mcd (min) to 8000 mcd (typ). This high intensity is a defining feature of this series.
- Viewing Angle (2θ1/2): Typically 30 degrees, indicating a moderately focused beam.
- Peak Wavelength (λp): 518 nm, and Dominant Wavelength (λd): 525 nm, classifying the color as brilliant green.
- Forward Voltage (VF): Ranges from 2.7V (min) to 3.7V (max), with a typical value of 3.3V at 20mA. This parameter is critical for driver design.
- Reverse Current (IR): Maximum of 50 µA at VR=5V.
3. Binning System Explanation
The product utilizes a binning system to categorize units based on key optical and electrical parameters, ensuring consistency in mass production. The labels CAT, HUE, and REF correspond to these bins.
- CAT: Ranks of Luminous Intensity. Units are sorted based on their measured light output.
- HUE: Ranks of Dominant Wavelength. This binning ensures color consistency by grouping LEDs with similar peak emission wavelengths.
- REF: Ranks of Forward Voltage. LEDs are grouped by their forward voltage drop to simplify current-limiting circuit design.
4. Performance Curve Analysis
The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions.
4.1 Relative Intensity vs. Wavelength
This spectral distribution curve shows the emission peak at 518 nm (green) with a typical spectral bandwidth (Δλ) of 35 nm, defining the color purity.
4.2 Directivity Pattern
A polar plot illustrating the spatial distribution of light, correlating with the 30-degree viewing angle, showing how intensity decreases from the center axis.
4.3 Forward Current vs. Forward Voltage (I-V Curve)
This curve is non-linear, typical of a diode. It shows the relationship between the applied forward voltage and the resulting current. The typical VF of 3.3V at 20mA is a key operating point.
4.4 Relative Intensity vs. Forward Current
This graph demonstrates that light output (intensity) increases with forward current, but the relationship may become sub-linear at higher currents due to thermal effects and efficiency droop.
4.5 Thermal Performance Curves
Relative Intensity vs. Ambient Temperature: Shows the decrease in light output as the ambient temperature rises, a critical factor for applications in warm environments.
Forward Current vs. Ambient Temperature: Often used to derive de-rating guidelines, indicating how the maximum permissible continuous current should be reduced as temperature increases to prevent overheating.
5. Mechanical & Package Information
5.1 Package Dimensions
The LED uses a standard 7344 surface-mount device (SMD) package. Key dimensional notes include: all dimensions are in millimeters; the flange height must be less than 1.5mm; and the general tolerance is ±0.25mm unless otherwise specified. The dimensional drawing provides exact measurements for footprint design.
5.2 Polarity Identification
The cathode is typically indicated by a visual marker on the package, such as a notch, green dot, or cut corner. The datasheet's package diagram specifies the exact marking for correct orientation during assembly.
6. Soldering & Assembly Guidelines
Proper handling is essential to maintain LED performance and reliability.
6.1 Lead Forming (if applicable for pre-formed leads)
- Bending must occur at least 3mm from the epoxy bulb to avoid stress on the die.
- Forming must be done before soldering and at room temperature.
- PCB holes must align perfectly with LED leads to avoid mounting stress.
6.2 Soldering Parameters
Hand Soldering: Iron tip temperature max 300°C (for 30W iron), soldering time max 3 seconds, maintain a 3mm minimum distance from the joint to the epoxy bulb.
Wave/DIP Soldering: Pre-heat temperature max 100°C (for 60 sec max), solder bath temperature max 260°C for 5 seconds, maintaining the 3mm distance rule. A recommended soldering profile graph illustrates the time-temperature relationship.
6.3 Critical Soldering Notes
- Avoid stress on leads during high-temperature phases.
- Do not solder (dip/hand) more than once.
- Protect the LED from shock/vibration while cooling to room temperature post-soldering.
- Use the lowest effective soldering temperature.
6.4 Cleaning
If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Avoid ultrasonic cleaning unless pre-qualified, as it can damage the internal structure.
6.5 Storage Conditions
Store at ≤30°C and ≤70% Relative Humidity. Shelf life is 3 months from shipment. For longer storage (up to 1 year), use a sealed container with nitrogen atmosphere and desiccant.
7. Packaging & Ordering Information
7.1 Packing Specification
The LEDs are packed in anti-static, moisture-resistant bags. These are placed in inner cartons, which are then packed into master outside cartons. The standard packing quantity is 200-500 pieces per bag, 5 bags per inner carton, and 10 inner cartons per outside carton.
7.2 Label Explanation
Labels on packaging include: CPN (Customer's Part Number), P/N (Manufacturer's Part Number: 7344-15SUGC/S400-A5), QTY (Quantity), CAT/HUE/REF (Binning Codes), and LOT No. (Traceability lot number).
8. Application Notes & Design Considerations
8.1 Thermal Management
This is a critical design factor. The current must be de-rated appropriately at higher ambient temperatures. Designers must refer to the de-rating curve (implied by the Forward Current vs. Ambient Temperature graph) to ensure the junction temperature remains within safe limits, preserving LED lifespan and maintaining light output.
8.2 Current Driving
A constant current driver is recommended over a constant voltage source with a series resistor for optimal stability and efficiency. The driver should be designed for the typical VF of 3.3V and must not exceed the absolute maximum continuous current of 25 mA.
8.3 Optical Design
The 30-degree viewing angle should be considered when designing lenses or light guides. For wider illumination, secondary optics may be required.
9. Technical Comparison & Differentiation
Compared to standard indicator LEDs, this device's primary differentiator is its very high luminous intensity (5000-8000 mcd), making it suitable for applications requiring high visibility or as a compact light source. Its compliance with halogen-free and REACH standards is also a significant advantage for environmentally conscious designs targeting global markets.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: What is the recommended operating current?
A: The electro-optical characteristics are tested at 20mA, which is the standard recommended operating point. It provides the specified luminous intensity while staying well within the 25mA maximum.
Q: Can I drive this LED with a 5V supply?
A: Not directly. With a typical VF of 3.3V, a series current-limiting resistor is mandatory when using a 5V supply to drop the excess voltage and set the correct current. The resistor value must be calculated based on Ohm's Law (R = (Vsupply - VF) / IF).
Q: How does temperature affect brightness?
A: As shown in the performance curves, luminous intensity decreases as ambient temperature increases. Proper heat sinking or current de-rating is necessary for high-temperature environments.
Q: What does the "S400" in the part number signify?
A> While not explicitly defined here, in common industry practice, such suffixes often denote specific binning combinations (e.g., for intensity and wavelength) or tape/reel specifications. The exact meaning should be confirmed with the specific product catalog.
11. Practical Use Case Example
Scenario: Backlight for a Status Indicator on a Network Router. A designer needs a bright, reliable green LED to indicate "power on" or "network activity." They select this LED for its high intensity. They design a PCB footprint matching the 7344 package dimensions. A simple driver circuit using a 3.3V rail and a series resistor is calculated to provide 18mA (slightly conservative). During assembly, they follow the wave soldering profile. The final product offers a clear, bright green indicator visible even in well-lit rooms.
12. Technology Principle Introduction
This LED is based on InGaN (Indium Gallium Nitride) semiconductor technology. When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which in turn defines the wavelength of the emitted light—in this case, green. The water-clear epoxy resin acts as both a protective encapsulant and a primary lens, shaping the light output beam.
13. Industry Trends
The trend in indicator and backlight LEDs continues towards higher efficiency (more light output per watt), improved color consistency through tighter binning, and enhanced reliability under harsh conditions. There is also a strong drive for full compliance with evolving environmental regulations like RoHS and REACH. Miniaturization remains a key trend, although for high-power or high-brightness applications, packages must balance size with the ability to dissipate heat effectively.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |