Table of Contents
- 1. Product Overview
- 1.1 Core Advantages
- 1.2 Target Market & Applications
- 2. Technical Parameter Deep Dive
- 2.1 Absolute Maximum Ratings (Ta=25 °C)
- 2.2 Electro-Optical Characteristics (Ta=25 °C)
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 Relative Intensity vs. Wavelength
- 4.2 Directivity Pattern
- 4.3 Forward Current vs. Forward Voltage (I-V Curve)
- 4.4 Relative Intensity vs. Forward Current
- 4.5 Temperature Dependence
- 5. Mechanical & Packaging Information
- 5.1 Package Dimensions
- 6. Soldering & Assembly Guidelines
- 6.1 Lead Forming
- 6.2 Storage Conditions
- 6.3 Soldering Process
- 7. Packaging & Ordering Information
- 7.1 Packing Specification
- 7.2 Label Explanation
- 7.3 Model Number Designation
- 8. Application Suggestions & Design Considerations
- 8.1 Circuit Design
- 8.2 Thermal Management
- 8.3 Optical Integration
- 9. Frequently Asked Questions (Based on Technical Parameters)
- 9.1 What is the difference between Peak Wavelength and Dominant Wavelength?
- 9.2 Can I drive this LED at 30mA continuously?
- 9.3 How do I select the right bin for my application?
- 10. Technical Principles & Trends
- 10.1 Operating Principle
- 10.2 Industry Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This document details the specifications for a high-brightness LED lamp designed for applications requiring superior luminous output. The device utilizes an InGaN chip to produce a brilliant green light and is housed in a popular T-1 3/4 round package with general-purpose leads.
1.1 Core Advantages
- High Efficiency: Engineered for maximum light output relative to input power.
- Robust Construction: Features UV-resistant epoxy resin for enhanced durability in outdoor environments.
- Environmental Compliance: The product is compliant with RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl <1500 ppm).
- Selection Flexibility: Available with different colors, intensities, and epoxy lens colors to suit various design needs.
1.2 Target Market & Applications
This LED series is specifically targeted at high-visibility signage and display applications. Typical use cases include:
- Color Graphic Signs
- Message Boards
- Variable Message Signs (VMS)
- Commercial Outdoor Advertising
2. Technical Parameter Deep Dive
2.1 Absolute Maximum Ratings (Ta=25 °C)
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.
| Parameter | Symbol | Rating | Unit |
|---|---|---|---|
| Reverse Voltage | VR | 5 | V |
| Forward Current | IF | 30 | mA |
| Peak Forward Current (Duty 1/10 @1KHz) | IFP | 100 | mA |
| Power Dissipation | Pd | 110 | mW |
| Operating Temperature | Topr | -40 ~ +85 | °C |
| Storage Temperature | Tstg | -40 ~ +100 | °C |
| Soldering Temperature | Tsol | 260 for 5 sec. | °C |
2.2 Electro-Optical Characteristics (Ta=25 °C)
These are the typical performance parameters measured under standard test conditions (IF=20mA).
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Condition |
|---|---|---|---|---|---|---|
| Luminous Intensity | Iv | 18000 | 28500 | 45000 | mcd | IF=20mA |
| Viewing Angle (2θ1/2) | -- | -- | 15 | -- | deg | IF=20mA |
| Peak Wavelength | λp | -- | 518 | -- | nm | IF=20mA |
| Dominant Wavelength | λd | 525 | 530 | 535 | nm | IF=20mA |
| Forward Voltage | VF | 2.8 | 3.2 | 3.6 | V | IF=20mA |
| Reverse Current | IR | -- | -- | 50 | μA | VR=5V |
3. Binning System Explanation
To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.
3.1 Luminous Intensity Binning
| Bin Code | Min. | Max. | Unit | Condition |
|---|---|---|---|---|
| X | 18000 | 22500 | mcd | IF =20mA |
| Y | 22500 | 28500 | ||
| Z | 28500 | 36000 | ||
| Z1 | 36000 | 45000 |
Tolerance of Luminous Intensity: ±10%
3.2 Dominant Wavelength Binning
| Bin Code | Min. | Max. | Unit | Condition |
|---|---|---|---|---|
| 1 | 525 | 530 | nm | IF =20mA |
| 2 | 530 | 535 |
Tolerance of Dominant Wavelength: ±1nm
3.3 Forward Voltage Binning
| Bin Code | Min. | Max. | Unit | Condition |
|---|---|---|---|---|
| 0 | 2.8 | 3.0 | V | IF =20mA |
| 1 | 3.0 | 3.2 | ||
| 2 | 3.2 | 3.4 | ||
| 3 | 3.4 | 3.6 |
Tolerance of Forward Voltage: ±0.1V
4. Performance Curve Analysis
The datasheet provides several characteristic curves that are crucial for circuit design and thermal management.
4.1 Relative Intensity vs. Wavelength
This curve shows the spectral power distribution, with a typical peak wavelength (λp) of 518nm and a dominant wavelength (λd) of 530nm, confirming the brilliant green color output.
4.2 Directivity Pattern
The viewing angle (2θ1/2) is 15 degrees, indicating a very narrow beam. This makes the LED ideal for directed lighting applications where light needs to be focused over a distance, such as in message signs.
4.3 Forward Current vs. Forward Voltage (I-V Curve)
The I-V curve is essential for designing the current-limiting circuitry. At the typical operating current of 20mA, the forward voltage is 3.2V. The curve helps determine the required supply voltage and series resistor value.
4.4 Relative Intensity vs. Forward Current
This curve demonstrates the relationship between drive current and light output. While intensity increases with current, it is crucial not to exceed the absolute maximum ratings (30mA continuous, 100mA pulsed) to prevent accelerated degradation or failure.
4.5 Temperature Dependence
Two key curves illustrate temperature effects: Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature. Typically, LED luminous output decreases as junction temperature rises. Furthermore, for a constant voltage drive, the forward current may increase with temperature due to changes in the semiconductor's properties, potentially leading to thermal runaway if not properly managed. These curves underscore the importance of effective heat sinking and constant-current drivers in high-reliability applications.
5. Mechanical & Packaging Information
5.1 Package Dimensions
The LED uses a standard T-1 3/4 (5mm) round package. Key dimensional notes include:
- All dimensions are in millimeters unless specified otherwise.
- The standard tolerance is ±0.25mm.
- The maximum allowable protrusion of resin under the flange is 1.5mm.
(Note: A detailed dimensioned drawing would be included here based on the PDF diagram, specifying lead diameter, lens diameter, total height, and lead spacing.)
6. Soldering & Assembly Guidelines
6.1 Lead Forming
- Bend leads at a point at least 3mm from the base of the epoxy bulb.
- Perform lead forming before soldering.
- Avoid stressing the package during forming to prevent internal damage or breakage.
- Cut leadframes at room temperature.
- Ensure PCB holes align perfectly with LED leads to avoid mounting stress.
6.2 Storage Conditions
- Recommended storage: ≤30°C and ≤70% Relative Humidity after receipt.
- Maximum storage life under these conditions: 3 months.
- For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
- Avoid rapid temperature changes in humid environments to prevent condensation.
6.3 Soldering Process
Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
| Process | Parameter | Value / Condition |
|---|---|---|
| Hand Soldering | Iron Tip Temperature | 300°C Max. (30W Max.) |
| Soldering Time | 3 seconds Max. | |
| Dip Soldering | Preheat Temperature | 100°C Max. (60 sec Max.) |
| Bath Temperature & Time | 260°C Max., 5 seconds Max. | |
| Distance from Bulb | 3mm Min. |
Critical Notes:
- Avoid mechanical stress on leads while the LED is at high temperature.
- Do not perform dip or hand soldering more than once.
- Protect the epoxy bulb from shock or vibration until it cools completely after soldering.
7. Packaging & Ordering Information
7.1 Packing Specification
- Anti-static Bag: Each bag contains a minimum of 200 and a maximum of 500 pieces.
- Inner Carton: Contains 5 bags.
- Master/Outside Carton: Contains 10 inner cartons.
7.2 Label Explanation
Labels on the packaging provide traceability and bin information:
- CPN: Customer's Product Number
- P/N: Product Number (e.g., 333/G1C1-AVYA/X/MS)
- QTY: Packing Quantity
- CAT: Rank of Luminous Intensity (e.g., X, Y, Z, Z1)
- HUE: Rank of Dominant Wavelength (e.g., 1, 2)
- REF: Rank of Forward Voltage (e.g., 0, 1, 2, 3)
- LOT No: Manufacturing Lot Number
7.3 Model Number Designation
The part number 333/G1C1-AVYA/X/MS can be decoded as follows (based on the provided production designation format):
- 333: Likely indicates the series or basic package type (T-1 3/4).
- G1: Specifies the chip material/type (InGaN).
- C1: Denotes the emitted color (Brilliant Green).
- AVYA: May refer to specific optical or performance characteristics.
- X: Represents the luminous intensity bin code.
- MS: Likely indicates the resin color (Water Clear) and the presence of a stopper (No).
8. Application Suggestions & Design Considerations
8.1 Circuit Design
- Current Limiting: Always use a series resistor or a constant-current driver to set the forward current to the desired level (typically 20mA). Calculate the resistor value using R = (Vsupply - VF) / IF.
- Reverse Voltage Protection: The maximum reverse voltage is only 5V. Incorporate protection (like a diode in parallel) if the LED could be exposed to reverse bias, such as in AC circuits or multi-LED arrays.
8.2 Thermal Management
- Although power dissipation is relatively low (110mW max), maintaining a low junction temperature is critical for long-term reliability and stable light output, especially in high-ambient-temperature environments or enclosed fixtures.
- Ensure adequate ventilation or heat sinking if multiple LEDs are densely packed.
8.3 Optical Integration
- The narrow 15-degree viewing angle produces a focused beam. For wider illumination, secondary optics (diffusers or lenses) will be required.
- The water-clear resin lens provides the highest possible light output. For a softer appearance or color mixing, consider LEDs with diffused or tinted lenses if available in the series.
9. Frequently Asked Questions (Based on Technical Parameters)
9.1 What is the difference between Peak Wavelength and Dominant Wavelength?
Peak Wavelength (λp = 518nm) is the wavelength at which the emitted optical power is maximum. Dominant Wavelength (λd = 530nm) is the single wavelength perceived by the human eye that matches the color of the light. For green LEDs, the dominant wavelength is often longer than the peak wavelength due to the shape of the human eye's sensitivity curve (photopic response).
9.2 Can I drive this LED at 30mA continuously?
While 30mA is the Absolute Maximum Rating for continuous forward current, operating at this limit will generate more heat and potentially reduce the LED's lifespan. For optimal reliability and efficiency, it is recommended to operate at or below the typical test condition of 20mA.
9.3 How do I select the right bin for my application?
For applications requiring uniform appearance (like a multi-LED sign), specify tight bins for both Dominant Wavelength (HUE) and Luminous Intensity (CAT). For example, requesting all LEDs from bin "Y" (22500-28500 mcd) and bin "1" (525-530 nm) will ensure consistent brightness and color across your display. For less critical applications, a wider bin range may be acceptable and more cost-effective.
10. Technical Principles & Trends
10.1 Operating Principle
This LED is based on an InGaN (Indium Gallium Nitride) semiconductor chip. When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light—in this case, brilliant green.
10.2 Industry Trends
The drive for higher efficiency (more lumens per watt) and improved reliability continues to be the primary trend in LED technology. Advances in chip design, epitaxial growth, and phosphor technology (for white LEDs) are constantly pushing performance boundaries. Furthermore, there is a strong industry-wide focus on standardization of footprints, photometric testing, and color binning to simplify design and ensure quality for end-users. The compliance with halogen-free and other environmental regulations, as seen in this datasheet, is also a standard requirement in modern electronic components.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |