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LED Lamp 333-2SURC/S400-A8 Datasheet - Brilliant Red - 20mA - 3200-5000mcd - English Technical Document

Technical datasheet for a high-brightness brilliant red LED lamp. Includes detailed specifications, electro-optical characteristics, package dimensions, and application guidelines.
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PDF Document Cover - LED Lamp 333-2SURC/S400-A8 Datasheet - Brilliant Red - 20mA - 3200-5000mcd - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness LED lamp designed for applications requiring superior luminous output. The device utilizes AlGaInP chip technology to produce a brilliant red color with a water-clear resin encapsulation. It is engineered for reliability and robustness, making it suitable for a variety of electronic display and indicator applications.

1.1 Core Advantages

1.2 Target Market and Applications

This LED is specifically targeted at consumer electronics and display backlighting markets. Its primary applications include:

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The following table lists the stress limits beyond which permanent damage to the device may occur. These are not operating conditions.

ParameterSymbolRatingUnit
Continuous Forward CurrentIF25mA
Peak Forward Current (Duty 1/10 @ 1KHz)IFP60mA
Reverse VoltageVR5V
Power DissipationPd60mW
Operating TemperatureTopr-40 to +85°C
Storage TemperatureTstg-40 to +100°C
Soldering TemperatureTsol260 (for 5 sec)°C

2.2 Electro-Optical Characteristics (Ta=25°C)

These parameters define the typical performance of the LED under normal operating conditions at 25°C ambient temperature.

ParameterSymbolMin.Typ.Max.UnitCondition
Luminous IntensityIv32005000-----mcdIF=20mA
Viewing Angle2θ1/2-----10-----degIF=20mA
Peak Wavelengthλp-----632-----nmIF=20mA
Dominant Wavelengthλd-----624-----nmIF=20mA
Spectrum Radiation BandwidthΔλ-----20-----nmIF=20mA
Forward VoltageVF1.72.02.4VIF=20mA
Reverse CurrentIR----------10μAVR=5V

Measurement Notes: Forward Voltage: ±0.1V uncertainty; Luminous Intensity: ±10% uncertainty; Dominant Wavelength: ±1.0nm uncertainty.

2.3 Thermal Characteristics

The device's performance is influenced by temperature. The operating range is from -40°C to +85°C. Proper heat sinking or current de-rating is essential for operation near the upper temperature limit to maintain performance and longevity.

3. Binning System Explanation

The product is categorized based on key performance parameters to ensure consistency in application design. The labeling system includes codes for:

These binning codes are typically found on the product label alongside the Part Number (P/N), Customer's Production Number (CPN), Packing Quantity (QTY), and Lot Number (LOT No).

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, with a typical peak wavelength (λp) of 632 nm and a dominant wavelength (λd) of 624 nm. The spectrum radiation bandwidth (Δλ) is typically 20 nm, defining the purity and specific shade of the brilliant red color.

4.2 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve is non-linear, typical of a diode. At the standard operating current of 20mA, the forward voltage (VF) typically measures 2.0V, with a range from 1.7V to 2.4V. This information is critical for designing the current-limiting circuitry.

3.3 Relative Intensity vs. Forward Current

Luminous intensity increases with forward current. However, operating above the recommended continuous current (25mA) or without proper heat management will reduce efficiency and lifespan due to increased junction temperature.

4.4 Temperature Dependency Curves

Relative Intensity vs. Ambient Temperature: The light output decreases as the ambient temperature rises. Designers must account for this derating in high-temperature environments.
Forward Current vs. Ambient Temperature: For a constant voltage drive, the forward current may change with temperature. A constant-current driver is recommended for stable performance across the operating temperature range.

4.5 Directivity Pattern

The polar diagram illustrates the 10-degree typical viewing angle, showing how light intensity is concentrated within a narrow beam.

5. Mechanical and Package Information

5.1 Package Dimension Drawing

The LED features a standard lamp-style package. Key dimensional notes include:

The drawing specifies the lead spacing, body diameter, total height, and the recommended minimum distance (3mm) from the epoxy bulb to the point of lead bending or soldering.

5.2 Polarity Identification

The cathode is typically identified by a flat spot on the LED lens or by the shorter lead. Always refer to the package diagram for definitive polarity marking to ensure correct installation.

6. Soldering and Assembly Guidelines

6.1 Lead Forming

6.2 Recommended Soldering Conditions

MethodParameterCondition
Hand SolderingIron Tip Temperature300°C Max. (30W Max.)
Soldering Time3 seconds Max.
Distance from Bulb3mm Min.
Dip (Wave) SolderingPreheat Temperature100°C Max. (60 sec Max.)
Bath Temperature & Time260°C Max., 5 seconds Max.
Distance from Bulb3mm Min.
CoolingAvoid rapid cooling from peak temperature.

Critical Notes:
1. Avoid stress on leads at high temperatures.
2. Do not solder (dip or hand) more than once.
3. Protect the LED from mechanical shock until it cools to room temperature after soldering.
4. Always use the lowest effective soldering temperature.

6.3 Cleaning

6.4 Storage Conditions

7. Packaging and Ordering Information

7.1 Packing Specification

7.2 Packing Quantity

  1. Minimum 200 to 500 pieces per anti-static bag.
  2. 5 bags per inner carton.
  3. 10 inner cartons per outside carton.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

Always drive the LED with a constant current source or a voltage source with a series current-limiting resistor. Calculate the resistor value using the formula: R = (Vsupply - VF) / IF. Use the maximum VF from the datasheet (2.4V) for a worst-case design to ensure the current does not exceed limits. For example, with a 5V supply and target IF of 20mA: R = (5V - 2.4V) / 0.02A = 130Ω. A standard 130Ω or 150Ω resistor would be suitable.

8.2 Heat Management

This is a critical design factor. The power dissipation (Pd) is VF * IF. At typical 2.0V and 20mA, this is 40mW. While below the 60mW maximum, operating in high ambient temperatures or enclosures with poor airflow requires de-rating the operating current to prevent the junction temperature from exceeding safe limits, which would accelerate lumen depreciation and reduce operational life.

8.3 Optical Design

The narrow 10-degree viewing angle makes this LED ideal for applications requiring a focused beam or directed light, such as indicator lights that need to be visible from a specific angle or backlighting for small segments.

9. Technical Comparison and Differentiation

Compared to standard red LEDs, this device's key differentiators are its very high luminous intensity (3200-5000 mcd) and narrow viewing angle, achieved through the use of AlGaInP chip technology and a specific lens design. This combination is optimized for applications where high brightness in a directed beam is paramount, rather than wide-area illumination. Its compliance with modern environmental standards (RoHS, REACH, Halogen-Free) also makes it suitable for global markets with strict regulatory requirements.

10. Frequently Asked Questions (FAQ)

Q1: What is the difference between peak wavelength (λp) and dominant wavelength (λd)?
A1: Peak wavelength is the wavelength at which the emitted optical power is maximum. Dominant wavelength is the single wavelength perceived by the human eye that matches the color of the LED. For this red LED, λp is 632nm (physical peak), while λd is 624nm (perceived color).

Q2: Can I drive this LED at 25mA continuously?
A2: Yes, 25mA is the Absolute Maximum Continuous Forward Current. However, for optimal longevity and reliability, especially at higher ambient temperatures, it is advisable to operate at or below the typical test condition of 20mA.

Q3: Why is the distance of 3mm from the epoxy bulb so important for soldering and lead bending?
A3: This distance prevents excessive heat transfer from the solder joint or mechanical stress from the bend from reaching the sensitive internal die and wire bonds inside the epoxy bulb, which could cause immediate failure or long-term reliability issues.

Q4: How do I interpret the CAT, HUE, and REF codes when ordering?
A4: These are binning codes. You would specify the desired ranges for luminous intensity (CAT), dominant wavelength (HUE), and forward voltage (REF) based on your application's need for brightness consistency, color uniformity, and circuit stability. Consult the manufacturer's detailed binning specification document for the exact code values and ranges.

11. Practical Design Case Study

Scenario: Designing a status indicator for a networking device that must be clearly visible in a well-lit room from a distance of 3 meters, with a viewing angle of approximately 15 degrees from the front panel.

Component Selection: This LED is an excellent candidate due to its high intensity (≥3200 mcd) which ensures visibility even in bright ambient light. The 10-degree viewing angle naturally creates a bright, focused spot that will fall within the required 15-degree viewing cone.

Circuit Design: Using a 3.3V logic supply common in digital devices. Calculate series resistor: R = (3.3V - 2.4Vmax) / 0.02A = 45Ω. Use a standard 47Ω resistor. Power dissipation in LED: Pd ≈ 2.0V * 0.02A = 40mW. Power in resistor: PR = (0.02A)2 * 47Ω = 18.8mW. Both are within safe limits.

Layout Consideration: Place the LED on the PCB such that the 3mm soldering distance rule can be adhered to. Ensure no other tall components shade the LED's narrow beam.

12. Technical Principle Introduction

This LED is based on an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied, electrons and holes recombine in the active region of the chip, releasing energy in the form of photons—a process called electroluminescence. The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light, in this case, red. The water-clear epoxy resin acts as a lens, shaping the light output into the specified 10-degree viewing angle and protecting the delicate semiconductor chip from the environment.

13. Industry Trends and Developments

The trend in indicator and display LEDs continues towards higher efficiency (more lumens per watt) and increased reliability. While this device offers high intensity, future iterations in this product category may focus on achieving similar brightness at lower drive currents for improved energy efficiency. There is also a continuous push for broader and stricter compliance with environmental regulations beyond RoHS and REACH, such as conflict mineral declarations and circular economy principles. The demand for precise binning (tighter CAT, HUE, REF ranges) is increasing in automated manufacturing to ensure consistent end-product quality without the need for manual calibration or sorting.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.