1. Product Overview
This document details the specifications for a high-brightness LED lamp designed for applications requiring superior luminous output. The device utilizes AlGaInP chip technology to produce a brilliant red color with a water-clear resin encapsulation. It is engineered for reliability and robustness, making it suitable for a variety of electronic display and indicator applications.
1.1 Core Advantages
- High Luminous Intensity: Delivers typical luminous intensity ranging from 3200 to 5000 millicandelas (mcd) at a standard forward current of 20mA.
- Narrow Viewing Angle: Features a typical viewing angle (2θ1/2) of 10 degrees, providing focused and intense light output.
- Compliance and Reliability: The product is compliant with RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm), ensuring environmental safety and long-term reliability.
- Packaging Flexibility: Available on tape and reel for automated assembly processes.
1.2 Target Market and Applications
This LED is specifically targeted at consumer electronics and display backlighting markets. Its primary applications include:
- Television sets (TV)
- Computer monitors
- Telephones
- General computer peripherals and indicator lights
2. In-Depth Technical Parameter Analysis
2.1 Absolute Maximum Ratings
The following table lists the stress limits beyond which permanent damage to the device may occur. These are not operating conditions.
| Parameter | Symbol | Rating | Unit |
|---|---|---|---|
| Continuous Forward Current | IF | 25 | mA |
| Peak Forward Current (Duty 1/10 @ 1KHz) | IFP | 60 | mA |
| Reverse Voltage | VR | 5 | V |
| Power Dissipation | Pd | 60 | mW |
| Operating Temperature | Topr | -40 to +85 | °C |
| Storage Temperature | Tstg | -40 to +100 | °C |
| Soldering Temperature | Tsol | 260 (for 5 sec) | °C |
2.2 Electro-Optical Characteristics (Ta=25°C)
These parameters define the typical performance of the LED under normal operating conditions at 25°C ambient temperature.
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Condition |
|---|---|---|---|---|---|---|
| Luminous Intensity | Iv | 3200 | 5000 | ----- | mcd | IF=20mA |
| Viewing Angle | 2θ1/2 | ----- | 10 | ----- | deg | IF=20mA |
| Peak Wavelength | λp | ----- | 632 | ----- | nm | IF=20mA |
| Dominant Wavelength | λd | ----- | 624 | ----- | nm | IF=20mA |
| Spectrum Radiation Bandwidth | Δλ | ----- | 20 | ----- | nm | IF=20mA |
| Forward Voltage | VF | 1.7 | 2.0 | 2.4 | V | IF=20mA |
| Reverse Current | IR | ----- | ----- | 10 | μA | VR=5V |
Measurement Notes: Forward Voltage: ±0.1V uncertainty; Luminous Intensity: ±10% uncertainty; Dominant Wavelength: ±1.0nm uncertainty.
2.3 Thermal Characteristics
The device's performance is influenced by temperature. The operating range is from -40°C to +85°C. Proper heat sinking or current de-rating is essential for operation near the upper temperature limit to maintain performance and longevity.
3. Binning System Explanation
The product is categorized based on key performance parameters to ensure consistency in application design. The labeling system includes codes for:
- CAT: Ranks of Luminous Intensity (Iv). This allows selection of LEDs within a specific brightness range.
- HUE: Ranks of Dominant Wavelength (λd). This ensures color consistency across multiple units.
- REF: Ranks of Forward Voltage (VF). This helps in designing stable drive circuits by grouping LEDs with similar voltage drops.
These binning codes are typically found on the product label alongside the Part Number (P/N), Customer's Production Number (CPN), Packing Quantity (QTY), and Lot Number (LOT No).
4. Performance Curve Analysis
The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions.
4.1 Relative Intensity vs. Wavelength
This curve shows the spectral power distribution, with a typical peak wavelength (λp) of 632 nm and a dominant wavelength (λd) of 624 nm. The spectrum radiation bandwidth (Δλ) is typically 20 nm, defining the purity and specific shade of the brilliant red color.
4.2 Forward Current vs. Forward Voltage (I-V Curve)
The I-V curve is non-linear, typical of a diode. At the standard operating current of 20mA, the forward voltage (VF) typically measures 2.0V, with a range from 1.7V to 2.4V. This information is critical for designing the current-limiting circuitry.
3.3 Relative Intensity vs. Forward Current
Luminous intensity increases with forward current. However, operating above the recommended continuous current (25mA) or without proper heat management will reduce efficiency and lifespan due to increased junction temperature.
4.4 Temperature Dependency Curves
Relative Intensity vs. Ambient Temperature: The light output decreases as the ambient temperature rises. Designers must account for this derating in high-temperature environments.
Forward Current vs. Ambient Temperature: For a constant voltage drive, the forward current may change with temperature. A constant-current driver is recommended for stable performance across the operating temperature range.
4.5 Directivity Pattern
The polar diagram illustrates the 10-degree typical viewing angle, showing how light intensity is concentrated within a narrow beam.
5. Mechanical and Package Information
5.1 Package Dimension Drawing
The LED features a standard lamp-style package. Key dimensional notes include:
- All dimensions are in millimeters (mm).
- The height of the flange must be less than 1.5mm (0.059\").
- The default tolerance for unspecified dimensions is ±0.25mm.
The drawing specifies the lead spacing, body diameter, total height, and the recommended minimum distance (3mm) from the epoxy bulb to the point of lead bending or soldering.
5.2 Polarity Identification
The cathode is typically identified by a flat spot on the LED lens or by the shorter lead. Always refer to the package diagram for definitive polarity marking to ensure correct installation.
6. Soldering and Assembly Guidelines
6.1 Lead Forming
- Bend leads at a point at least 3mm from the base of the epoxy bulb.
- Perform lead forming before soldering.
- Avoid applying stress to the LED package during forming.
- Cut leads at room temperature.
- Ensure PCB holes align perfectly with LED leads to avoid mounting stress.
6.2 Recommended Soldering Conditions
| Method | Parameter | Condition |
|---|---|---|
| Hand Soldering | Iron Tip Temperature | 300°C Max. (30W Max.) |
| Soldering Time | 3 seconds Max. | |
| Distance from Bulb | 3mm Min. | |
| Dip (Wave) Soldering | Preheat Temperature | 100°C Max. (60 sec Max.) |
| Bath Temperature & Time | 260°C Max., 5 seconds Max. | |
| Distance from Bulb | 3mm Min. | |
| Cooling | Avoid rapid cooling from peak temperature. |
Critical Notes:
1. Avoid stress on leads at high temperatures.
2. Do not solder (dip or hand) more than once.
3. Protect the LED from mechanical shock until it cools to room temperature after soldering.
4. Always use the lowest effective soldering temperature.
6.3 Cleaning
- If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
- Do not use ultrasonic cleaning unless absolutely necessary and only after thorough pre-qualification testing, as it can damage the internal structure.
6.4 Storage Conditions
- Store at ≤30°C and ≤70% Relative Humidity (RH).
- Shelf life after shipping is 3 months under these conditions.
- For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and moisture absorbent.
- Avoid rapid temperature changes in humid environments to prevent condensation.
7. Packaging and Ordering Information
7.1 Packing Specification
- Anti-static Bag: Protects LEDs from electrostatic discharge (ESD).
- Inner Carton: Contains multiple bags.
- Outside Carton: Contains multiple inner cartons.
7.2 Packing Quantity
- Minimum 200 to 500 pieces per anti-static bag.
- 5 bags per inner carton.
- 10 inner cartons per outside carton.
8. Application Suggestions and Design Considerations
8.1 Typical Application Circuits
Always drive the LED with a constant current source or a voltage source with a series current-limiting resistor. Calculate the resistor value using the formula: R = (Vsupply - VF) / IF. Use the maximum VF from the datasheet (2.4V) for a worst-case design to ensure the current does not exceed limits. For example, with a 5V supply and target IF of 20mA: R = (5V - 2.4V) / 0.02A = 130Ω. A standard 130Ω or 150Ω resistor would be suitable.
8.2 Heat Management
This is a critical design factor. The power dissipation (Pd) is VF * IF. At typical 2.0V and 20mA, this is 40mW. While below the 60mW maximum, operating in high ambient temperatures or enclosures with poor airflow requires de-rating the operating current to prevent the junction temperature from exceeding safe limits, which would accelerate lumen depreciation and reduce operational life.
8.3 Optical Design
The narrow 10-degree viewing angle makes this LED ideal for applications requiring a focused beam or directed light, such as indicator lights that need to be visible from a specific angle or backlighting for small segments.
9. Technical Comparison and Differentiation
Compared to standard red LEDs, this device's key differentiators are its very high luminous intensity (3200-5000 mcd) and narrow viewing angle, achieved through the use of AlGaInP chip technology and a specific lens design. This combination is optimized for applications where high brightness in a directed beam is paramount, rather than wide-area illumination. Its compliance with modern environmental standards (RoHS, REACH, Halogen-Free) also makes it suitable for global markets with strict regulatory requirements.
10. Frequently Asked Questions (FAQ)
Q1: What is the difference between peak wavelength (λp) and dominant wavelength (λd)?
A1: Peak wavelength is the wavelength at which the emitted optical power is maximum. Dominant wavelength is the single wavelength perceived by the human eye that matches the color of the LED. For this red LED, λp is 632nm (physical peak), while λd is 624nm (perceived color).
Q2: Can I drive this LED at 25mA continuously?
A2: Yes, 25mA is the Absolute Maximum Continuous Forward Current. However, for optimal longevity and reliability, especially at higher ambient temperatures, it is advisable to operate at or below the typical test condition of 20mA.
Q3: Why is the distance of 3mm from the epoxy bulb so important for soldering and lead bending?
A3: This distance prevents excessive heat transfer from the solder joint or mechanical stress from the bend from reaching the sensitive internal die and wire bonds inside the epoxy bulb, which could cause immediate failure or long-term reliability issues.
Q4: How do I interpret the CAT, HUE, and REF codes when ordering?
A4: These are binning codes. You would specify the desired ranges for luminous intensity (CAT), dominant wavelength (HUE), and forward voltage (REF) based on your application's need for brightness consistency, color uniformity, and circuit stability. Consult the manufacturer's detailed binning specification document for the exact code values and ranges.
11. Practical Design Case Study
Scenario: Designing a status indicator for a networking device that must be clearly visible in a well-lit room from a distance of 3 meters, with a viewing angle of approximately 15 degrees from the front panel.
Component Selection: This LED is an excellent candidate due to its high intensity (≥3200 mcd) which ensures visibility even in bright ambient light. The 10-degree viewing angle naturally creates a bright, focused spot that will fall within the required 15-degree viewing cone.
Circuit Design: Using a 3.3V logic supply common in digital devices. Calculate series resistor: R = (3.3V - 2.4Vmax) / 0.02A = 45Ω. Use a standard 47Ω resistor. Power dissipation in LED: Pd ≈ 2.0V * 0.02A = 40mW. Power in resistor: PR = (0.02A)2 * 47Ω = 18.8mW. Both are within safe limits.
Layout Consideration: Place the LED on the PCB such that the 3mm soldering distance rule can be adhered to. Ensure no other tall components shade the LED's narrow beam.
12. Technical Principle Introduction
This LED is based on an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied, electrons and holes recombine in the active region of the chip, releasing energy in the form of photons—a process called electroluminescence. The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light, in this case, red. The water-clear epoxy resin acts as a lens, shaping the light output into the specified 10-degree viewing angle and protecting the delicate semiconductor chip from the environment.
13. Industry Trends and Developments
The trend in indicator and display LEDs continues towards higher efficiency (more lumens per watt) and increased reliability. While this device offers high intensity, future iterations in this product category may focus on achieving similar brightness at lower drive currents for improved energy efficiency. There is also a continuous push for broader and stricter compliance with environmental regulations beyond RoHS and REACH, such as conflict mineral declarations and circular economy principles. The demand for precise binning (tighter CAT, HUE, REF ranges) is increasing in automated manufacturing to ensure consistent end-product quality without the need for manual calibration or sorting.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |