1. Product Overview
This document details the specifications for a high-brightness LED lamp designed for applications requiring superior luminous output. The device utilizes AlGaInP chip technology to produce a brilliant yellow light. It is engineered for reliability and robustness, making it suitable for a variety of electronic display and indicator applications.
1.1 Core Advantages and Target Market
The primary advantage of this LED series is its high luminous intensity, with typical values reaching 4263 mcd at a standard forward current of 20mA. This makes it ideal for applications where visibility and brightness are critical. The product is compliant with key environmental regulations including RoHS, EU REACH, and is manufactured as halogen-free. It is available in tape and reel packaging for automated assembly processes, supporting high-volume manufacturing. The target markets primarily include consumer electronics and computer peripherals.
2. Technical Parameter Deep-Dive
This section provides an objective and detailed analysis of the LED's key technical parameters as defined in the Absolute Maximum Ratings and Electro-Optical Characteristics tables.
2.1 Absolute Maximum Ratings
The device is rated for a continuous forward current (IF) of 25 mA, with a peak forward current (IFP) of 60 mA permissible under pulsed conditions (duty cycle 1/10 @ 1kHz). The maximum reverse voltage (VR) is 5V. The power dissipation (Pd) rating is 60 mW. The operational temperature range is specified from -40°C to +85°C, with a slightly wider storage temperature (Tstg) range of -40°C to +100°C. The soldering temperature tolerance is 260°C for 5 seconds, which is a standard for lead-free reflow processes.
2.2 Electro-Optical Characteristics
Under standard test conditions (Ta=25°C, IF=20mA), the device exhibits a luminous intensity (Iv) with a minimum of 2713 mcd and a typical value of 4263 mcd. The viewing angle (2θ1/2) is a narrow 6 degrees, typical for high-intensity, focused light emission. The peak wavelength (λp) is 591 nm, and the dominant wavelength (λd) is 589 nm, firmly placing the output in the brilliant yellow spectrum. The spectrum radiation bandwidth (Δλ) is 15 nm. The forward voltage (VF) ranges from 1.7V to 2.4V, with a typical value of 2.0V. The reverse current (IR) is a maximum of 10 μA at VR=5V.
2.3 Thermal Characteristics
While not explicitly defined in a separate table, thermal management is critical. The power dissipation rating of 60 mW and the operating temperature range define the thermal limits. Proper heat sinking or current de-rating at elevated ambient temperatures is essential for long-term reliability, as indicated in the application notes.
3. Binning System Explanation
The datasheet references a binning system for key parameters, indicated by codes on the packaging label (CAT, HUE, REF). This system allows manufacturers to select LEDs with tightly controlled characteristics for consistent performance in their applications.
- CAT (Ranks of Luminous Intensity): Groups LEDs based on their measured luminous output (e.g., minimum 2713 mcd likely defines one bin).
- HUE (Ranks of Dominant Wavelength): Sorts LEDs according to their dominant wavelength (λd), ensuring color consistency.
- REF (Ranks of Forward Voltage): Classifies LEDs by their forward voltage (VF) drop, which is important for circuit design and power supply considerations.
4. Performance Curve Analysis
The typical electro-optical characteristic curves provide visual insights into the device's behavior under varying conditions.
4.1 Relative Intensity vs. Wavelength
This curve shows the spectral power distribution, with a peak at approximately 591 nm (yellow) and a defined bandwidth, confirming the monochromatic nature of the light output.
4.2 Directivity Pattern
The directivity plot illustrates the narrow 6-degree viewing angle, showing how light intensity decreases sharply outside the central beam.
4.3 Forward Current vs. Forward Voltage (I-V Curve)
This fundamental curve shows the exponential relationship between current and voltage for a diode. The typical VF of 2.0V at 20mA is a key design parameter for driving circuitry.
4.4 Relative Intensity vs. Forward Current
This curve demonstrates that light output (relative intensity) increases with forward current. However, operation beyond the absolute maximum ratings will reduce lifespan and reliability.
4.5 Relative Intensity vs. Ambient Temperature & Forward Current vs. Ambient Temperature
These curves are crucial for thermal design. They show that luminous output decreases as ambient temperature increases. Conversely, for a fixed voltage, the forward current also decreases with rising temperature due to changes in the semiconductor's properties. This highlights the need for thermal management and potential current de-rating in high-temperature environments.
5. Mechanical and Package Information
5.1 Package Dimensions
The LED is housed in a standard lamp-style package. The dimensional drawing provides critical measurements for PCB footprint design and mechanical integration. Key notes specify that all dimensions are in millimeters, the flange height must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise stated. Designers must adhere to these dimensions to ensure proper fit and soldering.
5.2 Polarity Identification
Polarity is typically indicated by lead length (longer lead is anode) or a flat spot on the package flange. The datasheet's dimensional drawing should be consulted for the specific marker used on this component.
6. Soldering and Assembly Guidelines
Proper handling is essential to prevent damage. Key guidelines include:
- Lead Forming: Must be done before soldering, at least 3mm from the epoxy bulb. Avoid stress on the package.
- Storage: Store at ≤30°C and ≤70% RH. For long-term storage (>3 months), use a nitrogen-purged, sealed container with desiccant.
- Soldering:
- Maintain a minimum 3mm distance from the solder joint to the epoxy bulb.
- Hand Soldering: Iron tip ≤300°C (30W max), time ≤3 seconds.
- Wave/DIP Soldering: Preheat ≤100°C (≤60 sec), solder bath ≤260°C for ≤5 seconds.
- Avoid multiple soldering cycles and mechanical stress during/after soldering until the device cools.
- Cleaning: Use isopropyl alcohol at room temperature for ≤1 minute if necessary. Avoid ultrasonic cleaning unless pre-qualified.
7. Packaging and Ordering Information
7.1 Packaging Specification
The LEDs are packed in anti-static bags, placed in inner cartons, which are then packed into outside cartons. The standard packing quantity is 200-500 pieces per bag, 6 bags per inner carton, and 10 inner cartons per master (outside) carton.
7.2 Label Explanation
The packaging label includes codes for traceability and binning: CPN (Customer Part Number), P/N (Part Number), QTY (Quantity), CAT (Luminous Intensity bin), HUE (Dominant Wavelength bin), REF (Forward Voltage bin), and LOT No. (Lot Number).
8. Application Suggestions
8.1 Typical Application Scenarios
Due to its high brightness and focused beam, this LED is well-suited for: Backlighting for TV sets and monitors, status indicators in telephones and computers, panel indicators, and other applications requiring a bright, visible yellow signal.
8.2 Design Considerations
- Current Limiting: Always use a series resistor or constant current driver to limit IF to the desired value (e.g., 20mA for typical brightness).
- Thermal Management: Consider PCB layout for heat dissipation, especially if operating near maximum ratings or in high ambient temperatures. Refer to de-rating guidelines.
- ESD Protection: Implement standard ESD precautions during handling and assembly, as LEDs are sensitive to electrostatic discharge.
- Optical Design: The narrow viewing angle may require lenses or diffusers if a wider illumination area is needed.
9. Technical Comparison and Differentiation
Compared to standard indicator LEDs, this device's key differentiator is its very high luminous intensity (4263 mcd typ.) from a standard lamp package. The use of AlGaInP technology provides high efficiency in the yellow/orange/red spectrum. Its compliance with modern environmental standards (RoHS, REACH, Halogen-Free) is a baseline expectation but remains a key feature for regulated markets. The narrow viewing angle offers high axial intensity, which is an advantage for directed light applications but a limitation where wide-angle emission is required.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: Can I drive this LED at 30mA for more brightness?
A: The Absolute Maximum Rating for continuous forward current is 25 mA. Operating at 30mA exceeds this rating, which will significantly reduce reliability and lifespan, and may cause immediate failure. Always operate within the specified limits.
Q: What resistor value should I use for a 5V supply?
A: Using Ohm's Law: R = (Vsupply - VF) / IF. With Vsupply=5V, VF=2.0V (typical), and IF=20mA (0.02A), R = (5 - 2.0) / 0.02 = 150 Ω. Choose a standard resistor value close to this (e.g., 150Ω or 160Ω) and ensure its power rating is sufficient (P = I2R = 0.06W, so a 1/8W or 1/4W resistor is fine).
Q: Why does the light output decrease when the LED gets hot?
A: This is a fundamental characteristic of semiconductor LEDs. As temperature increases, the internal quantum efficiency decreases, and non-radiative recombination increases, resulting in lower light output for the same drive current. This is shown in the "Relative Intensity vs. Ambient Temp." curve.
11. Practical Application Case
Scenario: Designing a high-visibility status indicator for industrial equipment. An engineer needs a yellow LED that can be clearly seen in a brightly lit factory environment. They select this LED for its high intensity (4263 mcd). They design a PCB with a footprint matching the package dimensions. They use a constant current driver set to 20mA to ensure consistent brightness and longevity. They mount the LED behind a small, clear window on the equipment panel. The narrow 6-degree viewing angle is perfect for this directed indicator application. They follow the recommended wave soldering profile during assembly and ensure the storage conditions are met before use. The result is a robust, reliable, and highly visible status indicator.
12. Operating Principle Introduction
This LED operates on the principle of electroluminescence in a semiconductor diode. The chip material is AlGaInP (Aluminum Gallium Indium Phosphide), which is a direct bandgap semiconductor. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, brilliant yellow (~589-591 nm). The epoxy resin lens serves to protect the semiconductor die, shape the light output beam (resulting in the 6-degree viewing angle), and enhance light extraction from the chip.
13. Technology Trends
The LED industry continues to evolve towards higher efficiency (more lumens per watt), improved color rendering, and greater reliability. While this device uses established AlGaInP technology, trends in the broader market include the development of more efficient phosphor-converted white LEDs and micro-LEDs for display applications. For monochromatic LEDs like this one, ongoing development focuses on pushing efficiency limits, improving high-temperature performance, and enabling even tighter binning for color and flux consistency in demanding applications. The emphasis on environmental compliance (Halogen-Free, REACH) is also a persistent trend driven by global regulations.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |