ELAT07-KB4050J5J7293910-F1S LED Datasheet - Package 7.0x?x?mm - Voltage 2.95-3.95V - Power 3.85W - Cool White 4000-5000K - English Technical Document

1. Product Overview

The ELAT07-KB4050J5J7293910-F1S is a high-performance, surface-mount LED designed for applications requiring high luminous output in a compact form factor. This device utilizes InGaN chip technology to produce cool white light with a correlated color temperature (CCT) ranging from 4000K to 5000K. Its primary design philosophy centers on achieving high optical efficiency within a small package, making it suitable for space-constrained yet demanding lighting solutions.

The core advantages of this LED include a typical luminous flux of 220 lumens at a forward current of 1000mA, resulting in an optical efficiency of approximately 60.27 lumens per watt. It incorporates robust ESD protection, compliant with the JEDEC JS-001-2017 (Human Body Model) standard for up to 8kV, enhancing its reliability in handling and assembly. The device is fully compliant with RoHS, REACH, and halogen-free directives, meeting modern environmental and safety standards.

The target market for this component is broad, encompassing consumer electronics, professional lighting, and automotive applications. Its high brightness and efficiency profile make it particularly well-suited for roles where both performance and miniaturization are critical.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These are not operating conditions.

• DC Forward Current (Torch Mode): 350 mA. This is the maximum continuous current recommended for extended operation.
• Peak Pulse Current: 1000 mA. This rating applies under specific pulsed conditions (400ms on, 3600ms off, for 30000 cycles), typical for camera flash applications.
• ESD Resistance (HBM): 8000 V. This high level of protection safeguards the LED against electrostatic discharge during manufacturing and handling.
• Reverse Voltage: Note 1. The datasheet explicitly states these LEDs are not designed for reverse bias operation. Applying a reverse voltage can cause immediate failure.
• Junction Temperature (Tj): 125 °C. The maximum allowable temperature at the semiconductor junction.
• Operating & Storage Temperature: -40°C to +85°C and -40°C to +100°C, respectively, indicating a wide environmental tolerance.
• Soldering Temperature: 260 °C. This is the peak temperature allowed during reflow soldering processes.
• Viewing Angle (2θ1/2): 120 degrees. This wide viewing angle characterizes a near-Lambertian emission pattern, providing broad, even illumination.
• Power Dissipation (Pulse Mode): 3.85 W. The maximum power the package can handle under pulsed conditions.
• Thermal Resistance (Rth): 8.5 °C/W. This parameter is crucial for thermal management design. It indicates the temperature rise per watt of power dissipated, from the junction to the solder pad or case.

2.2 Electro-Optical Characteristics

These parameters are measured under typical conditions (Tsolder pad = 25°C) and represent the device's performance.

• Luminous Flux (Iv): Minimum 180 lm, Typical 220 lm at IF=1000mA. The measurement tolerance is ±10%.
• Forward Voltage (VF): Ranges from 2.95V to 3.95V at 1000mA, with a measurement tolerance of ±0.1V. The actual VF is binned, as detailed in section 3.
• Color Temperature (CCT): 4000K to 5000K, defining the cool white region.
• Color Rendering Index (CRI): ≥80. This indicates good color rendering, suitable for general lighting where color accuracy is important.
• All electrical and optical data is tested under a 50ms pulse condition to minimize self-heating effects and provide consistent, comparable measurements.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key parameters. This allows designers to select parts that meet specific application requirements for brightness, voltage, and color.

3.1 Forward Voltage Binning

The forward voltage is categorized into three bins, identified by a 4-digit code (e.g., 2932, 3235, 3539). The code represents the minimum and maximum voltage in tenths of a volt.

• Bin 2932: VF = 2.95V to 3.25V
• Bin 3235: VF = 3.25V to 3.55V
• Bin 3539: VF = 3.55V to 3.95V

The specific part number "KB4050J5J7293910" indicates the voltage bin is "29", corresponding to the 2932 bin (2.95V min).

3.2 Luminous Flux Binning

Luminous flux is binned using a letter-number code (e.g., J5, J6, J7).

• Bin J5: Iv = 180 lm to 200 lm
• Bin J6: Iv = 200 lm to 250 lm
• Bin J7: Iv = 250 lm to 300 lm

The part number specifies "J5", placing it in the 180-200 lm bin at 1000mA.

3.3 Chromaticity (Color) Binning

The color is defined on the CIE 1931 chromaticity diagram. The part number includes "4050", which refers to a specific color bin within the 4000K-5000K CCT range. The datasheet provides the corner coordinates (CIE-x, CIE-y) of this bin: (0.344, 0.336), (0.347, 0.375), (0.389, 0.403), and (0.376, 0.355). The measurement allowance for color coordinates is ±0.01. Color bins are defined at IF=1000mA.

4. Performance Curve Analysis

4.1 Relative Spectral Distribution

The spectral power distribution curve shows a dominant peak wavelength (λp) in the blue region (typically around 450-455nm for a phosphor-converted white LED), with a broad secondary emission in the yellow/green/red region from the phosphor. This combination produces the cool white light. The curve confirms the CRI ≥80 claim, as the spectrum has significant emission across the visible range rather than just narrow peaks.

4.2 Typical Radiation Patterns

The polar radiation pattern plots for both horizontal and vertical planes confirm the Lambertian-like distribution with a 120-degree viewing angle. The relative luminous intensity is nearly identical in both planes, indicating symmetrical emission, which is ideal for uniform area lighting.

4.3 Forward Voltage vs. Forward Current

This curve shows the non-linear relationship between VF and IF. As current increases from 0 to 1200mA, the forward voltage rises. The curve is essential for driver design, as it helps determine the required supply voltage and power dissipation at different operating currents.

4.4 Relative Luminous Flux vs. Forward Current

This graph demonstrates the light output's dependence on drive current. Luminous flux increases sub-linearly with current due to efficiency droop and junction heating effects, even in pulsed measurement. The curve is critical for applications like camera flashes where maximizing light output in a short pulse is key.

4.5 Correlated Color Temperature vs. Forward Current

The CCT shows variation with drive current. It may increase or decrease slightly depending on the phosphor system's behavior with current density and temperature. This graph is important for applications requiring stable color temperature across different brightness settings.

Note: All correlation data is tested under superior thermal management using a 1cm² Metal Core Printed Circuit Board (MCPCB), highlighting the importance of heatsinking for achieving datasheet performance.

5. Mechanical and Package Information

The LED comes in a surface-mount device (SMD) package. While the exact length and width dimensions from the drawing are not fully specified in the provided text, the package type is ELAT07. The drawing includes critical dimensions such as pad sizes, placement, and overall outline, with standard tolerances of ±0.1mm unless otherwise noted. Proper pad design on the PCB is essential for reliable soldering, mechanical stability, and optimal thermal and electrical performance.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering

The maximum allowable soldering temperature is 260°C, and the device can withstand a maximum of 3 reflow cycles. Standard lead-free reflow profiles with a peak temperature below 260°C should be used. The JEDEC Moisture Sensitivity Level (MSL) is rated as Level 1, meaning the device has an unlimited floor life at ≤30°C/85% RH and can be stored without dry packing. However, it must withstand 168 hours of soak at 85°C/85% RH prior to reflow, which is a standard preconditioning test.

6.2 Thermal Management

With a thermal resistance (Rth) of 8.5 °C/W, effective heat sinking is mandatory, especially when operating at high currents like 1000mA. The datasheet notes that all reliability tests are performed using a 1.0cm² MCPCB. For optimal lifetime and performance, the junction temperature should be kept as low as possible, and operation at the maximum junction temperature of 125°C should be avoided for periods exceeding one hour. Power dissipation must be calculated (Pd = VF * IF) and managed accordingly.

6.3 Handling and Storage

Storage temperature ranges from -40°C to +100°C. Standard ESD precautions should be followed during handling due to the sensitive semiconductor structure, despite the integrated 8kV ESD protection.

7. Packaging and Ordering Information

The LEDs are supplied in moisture-resistant packing. They are loaded into carrier tapes, with a standard loaded quantity of 2000 pieces per reel. The minimum package quantity is 1000 pieces. The product labeling on the reel includes several key fields: Customer's Product Number (CPN), the manufacturer's Part Number (P/N), Lot Number, Packing Quantity (QTY), and the specific bin codes for Luminous Flux (CAT), Color (HUE), and Forward Voltage (REF). The MSL level is also indicated. The carrier tape and reel dimensions are provided in millimeters in the datasheet drawings.

8. Application Recommendations

8.1 Typical Application Scenarios

• Mobile Phone Camera Flash/Strobe: The high pulsed current capability (1000mA) and high luminous flux make this LED ideal for camera flash applications, providing bright illumination for photography.
• Torch Light for Digital Video: Can be used as a constant or variable-brightness video light.
• General Indoor Lighting: Suitable for downlights, panel lights, and other fixtures requiring a compact, high-output light source.
• Backlighting: For TFT-LCD displays requiring high brightness.
• Automotive Lighting: For interior map lights, dome lights, or exterior auxiliary lights, subject to meeting specific automotive qualification standards.
• Decorative and Architectural Lighting: For accent lighting, step lights, and orientation markers.

8.2 Design Considerations

• Driver Selection: Choose a constant-current LED driver compatible with the forward voltage range (2.95V-3.95V) and capable of delivering the required current (e.g., 350mA continuous, 1000mA pulsed).
• PCB Layout: Ensure PCB pads match the datasheet recommendation. Use a thermally conductive PCB (like MCPCB or FR4 with thermal vias) and adequate copper area to dissipate heat effectively. The thermal path from the LED solder pads to the heatsink must be low resistance.
• Optical Design: The 120-degree viewing angle may require secondary optics (lenses, reflectors) to achieve the desired beam pattern for specific applications like spotlights or flash.
• Electrical Protection: Although the LED has high ESD protection, incorporating transient voltage suppression (TVS) diodes or other protection circuits on the PCB is good practice for robustness in harsh environments.

9. Technical Comparison and Differentiation

While a direct side-by-side comparison with other models is not provided in this datasheet, key differentiating features of this LED can be inferred:

• High Efficiency in Small Package: 60.27 lm/W at 1A is a competitive efficiency for a high-current SMD LED.
• Robust ESD Protection: 8kV HBM protection is higher than many standard LEDs, improving reliability.
• Comprehensive Binning: Tight binning on flux, voltage, and color ensures consistency in production runs, which is critical for multi-LED arrays where uniformity is important.
• High-CRI Option: A CRI ≥80 is offered, which is beneficial for lighting applications where color quality matters, compared to typical 70-CRI LEDs.
• Pulse Performance: Characterized and rated for high pulse currents, making it purpose-built for flash applications.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED at 1000mA continuously?
A: No. The Absolute Maximum Rating for DC Forward Current (Torch Mode) is 350mA. The 1000mA rating is for pulsed operation only (400ms on, 3600ms off). Continuous operation at 1000mA would exceed the power dissipation and junction temperature limits, leading to rapid degradation or failure.

Q2: What is the meaning of the code "KB4050J5J7293910" in the part number?
A: It is a binning code that specifies the device's performance characteristics: "4050" = Color Bin (within 4000-5000K), "J5" = Luminous Flux Bin (180-200 lm), "29" = Forward Voltage Bin (2.95-3.25V). The "3910" may refer to other product-specific codes.

Q3: Do I need a heatsink for this LED?
A: Absolutely, especially when operating near its maximum ratings. The thermal resistance of 8.5°C/W means that for every watt dissipated, the junction temperature rises 8.5°C above the solder pad temperature. Without proper heatsinking, the junction temperature will quickly exceed the 125°C limit, reducing lifetime and light output.

Q4: Is a reverse polarity protection circuit necessary?
A: Yes. The datasheet explicitly states the LED is not designed for reverse bias. Accidental application of a reverse voltage, even a small one, can cause immediate and catastrophic failure. Your driver circuit should include protection against this.

Q5: How stable is the color over time and temperature?
A> The datasheet guarantees reliability for 1000 hours with less than 30% luminous flux degradation under specified test conditions. Color shift over lifetime is a common phenomenon in white LEDs but is not quantified in the provided data. Proper thermal management is the key to minimizing color shift over time.

11. Practical Design and Usage Case

Case: Designing a High-Power Mobile Phone Camera Flash
A designer is creating a dual-LED flash for a smartphone. They select the ELAT07-KB4050J5J7293910-F1S for its high pulsed output and small size. The design process involves:
1. Driver Circuit: Selecting a compact, high-efficiency switched-mode capacitor charger IC capable of delivering 1000mA pulses to two LEDs in series (total Vf ~6-8V).
2. PCB Layout: Designing a dedicated small MCPCB or a thick-copper FR4 sub-board for the LEDs to act as a heatsink. The LEDs are placed with sufficient spacing to avoid thermal crosstalk.
3. Thermal Analysis: Modeling the temperature rise during a flash sequence. With a 400ms pulse, the junction temperature will spike. The design must ensure it stays within limits over multiple flashes.
4. Optics: Pairing each LED with a small, efficient TIR (Total Internal Reflection) lens to collimate the 120-degree light into a wider, more uniform beam suitable for photography, avoiding hotspots.
5. Testing: Verifying light output, color temperature consistency between the two LEDs (using tightly binned parts), and flash recycling time under various battery conditions.

12. Principle of Operation

This is a phosphor-converted white LED. The core is a semiconductor chip made of Indium Gallium Nitride (InGaN). When a forward voltage is applied, electrons and holes recombine within the chip's active region, emitting photons. The primary emission from the InGaN chip is in the blue wavelength range. This blue light then strikes a layer of phosphor material (typically Yttrium Aluminum Garnet doped with Cerium, or YAG:Ce) deposited on or near the chip. The phosphor absorbs a portion of the blue light and re-emits it as a broad spectrum of yellow light. The mixture of the remaining blue light and the converted yellow light is perceived by the human eye as white light. The exact ratio of blue to yellow, and the specific phosphor composition, determines the correlated color temperature (CCT) and Color Rendering Index (CRI).

13. Technology Trends

The development of LEDs like the ELAT07 series follows several key industry trends:
Increased Efficiency (lm/W): Ongoing research focuses on improving internal quantum efficiency of the blue chip and the conversion efficiency of phosphors to push lumens per watt higher, reducing energy consumption.
Higher Power Density: The drive to produce more light from smaller packages continues, demanding advances in thermal management materials and package design to extract heat more effectively.
Improved Color Quality and Consistency: Trends include moving towards higher CRI values (90+), better color uniformity across batches, and more stable color over drive current and temperature (reducing CCT shift).
Enhanced Reliability: Improvements in materials (epoxy, phosphor, die attach) and package sealing increase lifetime and lumen maintenance, especially under high-temperature operating conditions.
Integration: There is a trend towards integrating multiple LED chips, drivers, and sometimes control circuitry into single modules or packages for simplified end-product assembly.