ELCH08-NF2025J5J8283910-FDH LED Datasheet - Warm White - 220lm @ 1A - 3.9V Max - 6.45W Pulse Power - English Technical Document

1. Product Overview

The ELCH08-NF2025J5J8283910-FDH is a high-performance, surface-mount LED designed for applications requiring high luminous output and efficiency in a compact package. This device utilizes InGaN chip technology to produce a warm white light with a correlated color temperature (CCT) ranging from 2000K to 2500K. Its primary design goals are to deliver high optical efficiency and reliable performance in demanding environments.

1.1 Core Advantages

The key advantages of this LED include its small form factor combined with high luminous efficacy, achieving up to 60 lumens per watt at a drive current of 1 Ampere. It incorporates robust ESD protection, rated up to 8KV according to the JEDEC 3b standard (Human Body Model), enhancing its durability during handling and assembly. The device is also compliant with RoHS and lead-free requirements.

1.2 Target Applications

This LED is suitable for a diverse range of applications. Its high output makes it ideal for camera flash and torch light functions in mobile phones and digital video equipment. It is also well-suited for general indoor lighting, TFT display backlighting, decorative lighting, and both interior and exterior automotive illumination. Furthermore, it can be used in signal and orientation lighting, such as for exit signs or step markers.

2. Technical Parameter Analysis

This section provides a detailed, objective interpretation of the device's key technical specifications as defined in its absolute maximum ratings and electro-optical characteristics.

2.1 Absolute Maximum Ratings

The device is rated for a maximum continuous DC forward current (Torch Mode) of 350 mA. For pulsed operation, it can handle a peak pulse current of 1500 mA under specific conditions: a 400 ms pulse width, a 10% duty cycle (3600 ms off time), and for up to 30,000 cycles. The maximum allowable junction temperature is 150°C, with an operating temperature range of -40°C to +85°C. The power dissipation in pulse mode is specified at 6.45 Watts. It is critical to note that these are absolute limits; continuous operation at or near these values may reduce reliability and lifetime.

2.2 Electro-Optical Characteristics

Under typical conditions (Tsolder pad = 25°C, IF=1000mA, 50ms pulse), the device delivers a luminous flux (Iv) of 220 lm (typical), with a minimum of 180 lm. The forward voltage (VF) ranges from a minimum of 2.85V to a maximum of 3.90V. The correlated color temperature (CCT) for this specific bin (2025) spans from 2000K to 2500K, defining its warm white appearance. All electrical and optical data is measured under pulsed conditions to minimize self-heating effects during testing.

2.3 Thermal Characteristics

Proper thermal management is essential for performance and longevity. The maximum substrate temperature (Ts) is specified as 70°C when operating at 1000mA. The device can withstand a soldering temperature of 260°C for a maximum of 3 reflow cycles. Designers must ensure adequate heat sinking, especially when operating near maximum currents, to maintain the solder pad temperature within safe limits and prevent accelerated lumen depreciation.

3. Binning System Explanation

The LED is sorted into bins based on three key parameters: luminous flux, forward voltage, and chromaticity (color coordinates). This ensures consistency in application.

3.1 Luminous Flux Binning

Luminous flux is categorized into bins denoted by J-codes. The device part number indicates a J5 bin, which corresponds to a luminous flux range of 180 lm to 200 lm at 1000mA. Other available bins include J6 (200-250 lm), J7 (250-300 lm), and J8 (300-330 lm).

3.2 Forward Voltage Binning

Forward voltage is binned to aid in circuit design for consistent current drive. Bins are defined as: 2832 (2.85V - 3.25V), 3235 (3.25V - 3.55V), and 3538 (3.55V - 3.90V). The part number specifies the 2832 bin.

3.3 Chromaticity Binning

The color is defined by the 2025 bin on the CIE 1931 chromaticity diagram. This bin encapsulates a specific quadrilateral area of color coordinates (x, y) that produces light within the 2000K to 2500K CCT range, ensuring a consistent warm white hue. The tolerance for color coordinate measurement is ±0.01.

4. Performance Curve Analysis

Graphical data provides insight into the device's behavior under varying conditions.

4.1 Forward Voltage vs. Forward Current (IV Curve)

The IV curve shows the relationship between forward current and forward voltage. As current increases from 0 to 1500mA, the forward voltage rises non-linearly, starting from approximately 2.6V and reaching near 3.8V. This curve is essential for designing the appropriate current-limiting circuitry.

4.2 Relative Luminous Flux vs. Forward Current

This curve demonstrates the light output's dependence on drive current. Luminous flux increases with current but exhibits a sub-linear trend at higher currents, primarily due to increased junction temperature and efficiency droop. The output is normalized, showing relative flux.

4.3 Correlated Color Temperature vs. Forward Current

The CCT shows variation with drive current. For this warm white LED, the CCT generally increases slightly with higher current, moving from around 2000K at low current towards 2500K at 1500mA. This shift must be considered in color-critical applications.

4.4 Spectral Distribution

The relative spectral power distribution plot shows a broad emission spectrum characteristic of a phosphor-converted white LED. It features a primary blue peak from the InGaN chip and a broader yellow/red emission band from the phosphor, combining to create warm white light.

4.5 Radiation Pattern

The typical polar radiation pattern indicates a Lambertian-like distribution, with a full viewing angle (2θ1/2) of 120 degrees. The intensity is relatively uniform across a wide area, making it suitable for applications requiring broad illumination.

5. Mechanical and Package Information

The LED is provided in a surface-mount device (SMD) package. The package drawing specifies the physical dimensions, which are critical for PCB footprint design. Key features include the anode and cathode pad locations and the overall package outline. Tolerances for dimensions are typically ±0.1mm unless otherwise noted. The polarity is clearly marked on the package and the carrier tape to ensure correct orientation during automated assembly.

6. Soldering and Assembly Guidelines

The device is rated for reflow soldering with a peak temperature of 260°C. It is classified as Moisture Sensitivity Level (MSL) 1, meaning it has an unlimited floor life at conditions ≤30°C/85% RH and does not require baking before use if kept within these conditions. However, if exposed to higher humidity, it must be baked according to the standard 85°C/85% RH for 168 hours preconditioning. A maximum of 3 reflow cycles is permitted. It is crucial to follow the recommended soldering profile to prevent thermal damage to the LED die or the plastic package.

7. Packaging and Ordering Information

The LEDs are supplied on embossed carrier tape for automated pick-and-place assembly. Each reel contains 2000 pieces. The product labeling on the reel includes critical information: the customer part number (CPN), the manufacturer's part number (P/N), lot number, packing quantity, and the specific bin codes for luminous flux (CAT), color (HUE), and forward voltage (REF). The MSL level is also indicated.

8. Application Recommendations

8.1 Design Considerations

When designing with this LED, thermal management is paramount. Use a PCB with adequate thermal vias and, if necessary, an external heatsink to keep the solder pad temperature below 70°C during operation. For driving the LED, a constant current source is recommended to ensure stable light output and color. Consider the forward voltage binning when designing the driver circuit to accommodate the voltage range. For ESD protection, although the LED has built-in protection, additional circuit-level protection on the PCB is advisable in harsh environments.

8.2 Typical Circuit Configuration

A simple drive circuit consists of a DC power supply, a current-limiting resistor, or a dedicated LED driver IC. For high-current pulsed operation (e.g., camera flash), a capacitor-based boost circuit or a specialized flash driver IC is typically used to deliver the required high peak current.

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, this device offers a significantly higher luminous flux for its package size, making it suitable for applications requiring high brightness in a constrained space. Its high ESD protection rating (8KV HBM) provides an advantage in applications prone to static discharge. The specific warm white CCT bin (2000-2500K) targets applications requiring a cozy, incandescent-like light quality, differentiating it from neutral or cool white LEDs.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between DC forward current and peak pulse current ratings?
A: The DC forward current (350mA) is the maximum current that can be applied continuously. The peak pulse current (1500mA) is a much higher current that can only be applied for very short durations (400ms) with a low duty cycle (10%) to prevent overheating.

Q: How does junction temperature affect performance?
A: Higher junction temperature leads to decreased luminous output (lumen depreciation), a shift in forward voltage, and can accelerate the aging process of the LED, reducing its operational lifetime. Maintaining a low thermal resistance path from the LED junction to the ambient is critical.

Q: What does the J5 bin mean for my application?
A: The J5 bin guarantees that the LED's light output will be between 180 and 200 lumens when driven at 1000mA under test conditions. This allows designers to predict and plan for a minimum brightness level in their system.

Q: Is a heatsink required?
A> For operation at the maximum continuous current (350mA) or especially in pulsed high-current mode, a heatsink or a PCB with excellent thermal conductivity is strongly recommended to maintain reliable operation and long life.

11. Practical Use Case Examples

Case 1: Mobile Phone Camera Flash: In this application, the LED is driven by a dedicated flash driver IC that charges a capacitor and then discharges it through the LED in a short, high-current pulse (up to 1500mA). The high luminous flux in a small package is crucial. Design focus is on managing the brief but intense thermal pulse and ensuring ESD robustness.

Case 2: Architectural Step Lighting: Here, multiple LEDs might be used in a linear array, driven at a lower, constant current (e.g., 200-300mA) for continuous operation. The wide 120-degree viewing angle provides even illumination across steps. The warm white color creates a welcoming ambiance. The design emphasis is on achieving uniform brightness and color across all LEDs in the array, leveraging the tight binning.

12. Operational Principle

This is a phosphor-converted white LED. The core is a semiconductor chip made of Indium Gallium Nitride (InGaN) that emits blue light when electrical current passes through it. This blue light strikes a layer of phosphor material (typically YAG:Ce or similar) deposited on or near the chip. The phosphor absorbs a portion of the blue light and re-emits it as yellow and red light. The combination of the remaining blue light and the converted yellow/red light is perceived by the human eye as white light. The exact ratio of blue to yellow/red emission, controlled by the phosphor composition and thickness, determines the correlated color temperature (CCT), resulting in the warm white output of this device.

13. Technology Trends

The general trend in LED technology is towards higher efficacy (lumens per watt), improved color rendering, and greater reliability at higher power densities. For warm white LEDs, there is ongoing development in phosphor technology to achieve higher efficiency and more stable color performance over temperature and time. Packaging technology continues to evolve to better manage heat extraction from smaller packages, enabling higher flux densities. Furthermore, there is a focus on improving consistency and reducing binning spread through advanced manufacturing processes, which simplifies design for lighting manufacturers.