ELCH07-NB2025J5J7283910-F3H LED Datasheet - Warm White - 210lm @ 1A - 3.2V Typ - 120° Viewing Angle - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the ELCH07-NB2025J5J7283910-F3H, a high-performance, surface-mount LED designed for demanding lighting applications. This device utilizes InGaN chip technology to produce a warm white light with a correlated color temperature (CCT) ranging from 2000K to 2500K. Its primary design goals are high luminous efficiency within a compact package, making it suitable for space-constrained applications requiring bright, quality illumination.

The core advantages of this LED include a typical luminous flux of 210 lumens at a forward current of 1000mA, resulting in a high optical efficiency of 61.7 lumens per watt. It incorporates robust ESD protection rated up to 8KV (HBM) and is compliant with key industry standards including RoHS, REACH, and halogen-free requirements. The target markets are diverse, encompassing consumer electronics, automotive lighting, general illumination, and specialty lighting applications where reliability and performance are critical.

2. Technical Parameters Deep Objective Interpretation

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These are not recommended operating conditions.

• DC Forward Current (Torch Mode): 350 mA. This is the maximum continuous DC current the LED can handle.
• Peak Pulse Current: 1200 mA. This high current is permissible only under specific pulsed conditions: 400 ms pulse width, 3600 ms off time, for a maximum of 30,000 cycles. This is typical for camera flash applications.
• Junction Temperature (Tj): 145 °C. The maximum allowable temperature at the semiconductor junction. Exceeding this limit risks accelerated degradation or failure.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +100°C (storage).
• Power Dissipation (Pulse Mode): 4.74 W. The maximum power the package can dissipate during pulsed operation, heavily dependent on thermal management.
• Viewing Angle (2θ_1/2): 120 degrees. This wide viewing angle indicates a near-Lambertian emission pattern, suitable for area lighting.

Critical Note: Operating at or near these maximum ratings for extended periods is strongly discouraged as it will lead to reduced reliability and potential permanent damage. Simultaneous application of multiple maximum ratings is not allowed.

2.2 Electro-Optical Characteristics

These parameters are measured under standard test conditions (Ts=25°C) and represent the typical performance of the device.

• Luminous Flux (I_v): Minimum 180 lm, Typical 210 lm at I_F=1000mA. Measurement tolerance is ±10%.
• Forward Voltage (V_F): Range from 2.85V to 3.95V at I_F=1000mA. The typical value is around 3.2V. Measurement tolerance is ±0.1V. All electrical and optical data is tested using a 50 ms pulse to minimize self-heating effects.
• Color Temperature (CCT): 2000K to 2500K, defining its warm white appearance.

The performance is assured by reliability testing for 1000 hours, with the criterion that the luminous flux degradation is less than 30%. All reliability tests assume good thermal management using a 1.0 cm x 1.0 cm Metal Core Printed Circuit Board (MCPCB).

2.3 Thermal and Reliability Characteristics

Effective thermal management is paramount for LED performance and longevity. Key thermal parameters include:

• Junction Temperature (Tj max): 145°C.
• Substrate Temperature (T_s): Must be maintained at or below 70°C when operating at I_F=1000mA. This parameter is crucial for system thermal design.
• Soldering Temperature: Withstands a peak temperature of 260°C during reflow soldering.
• Allowable Reflow Cycles: 2 cycles maximum.
• Moisture Sensitivity Level (MSL): Level 1. This is the most robust level, indicating an unlimited floor life at ≤30°C/85% RH before requiring baking. This simplifies handling and storage.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins. This device uses a three-dimensional binning system.

3.1 Forward Voltage Binning

LEDs are grouped by their forward voltage drop at 1000mA into three bins:

• Bin 2832: V_F = 2.85V to 3.25V
• Bin 3235: V_F = 3.25V to 3.55V
• Bin 3539: V_F = 3.55V to 3.95V

This allows designers to select LEDs with similar electrical characteristics for consistent driver performance.

3.2 Luminous Flux Binning

LEDs are sorted by their total light output at 1000mA:

• Bin J5: I_v = 180 lm to 200 lm
• Bin J6: I_v = 200 lm to 250 lm
• Bin J7: I_v = 250 lm to 300 lm

The part number "J5" indicates this specific device falls within the J5 brightness bin.

3.3 Chromaticity (Color) Binning

The color is defined within the warm white region on the CIE 1931 chromaticity diagram. The bin "2025" in the part number corresponds to a specific quadrilateral area on this diagram, ensuring all LEDs within this bin have very similar color coordinates (x, y), resulting in a consistent warm white color appearance between 2000K and 2500K. The measurement allowance for color coordinates is ±0.01.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (V-I Curve)

The V-I curve shows a non-linear relationship. The forward voltage increases with current, starting from approximately 2.6V at very low currents and rising to about 3.6V at 1200mA. This curve is essential for designing the current-limiting circuitry or constant-current driver.

4.2 Relative Luminous Flux vs. Forward Current

The light output increases sub-linearly with current. While output rises significantly from 0mA to 1000mA, the rate of increase may diminish at the highest currents due to efficiency droop, a common phenomenon in LEDs where internal efficiency decreases at high current densities. This highlights the importance of operating at the recommended current for optimal efficacy.

4.3 Correlated Color Temperature (CCT) vs. Forward Current

The CCT remains relatively stable across the operating current range, varying only slightly between approximately 1900K and 2400K. This stability is crucial for applications where consistent color temperature is required despite dimming or changes in drive current.

4.4 Spectral Distribution and Radiation Pattern

The relative spectral distribution plot shows a broad emission spectrum characteristic of a phosphor-converted white LED, with a peak wavelength (λ_p) in the blue region (from the InGaN chip) and a broad yellow/red emission from the phosphor. The typical radiation pattern is Lambertian (cosine law), confirmed by the polar plot showing a smooth, wide beam with 120-degree viewing angle. The intensity is nearly identical on the X and Y axes.

5. Mechanical and Package Information

The LED comes in a surface-mount device (SMD) package. The package drawing (not reproduced here but referenced on page 8 of the datasheet) provides critical dimensions including length, width, height, and pad layout. Tolerances are typically ±0.1 mm unless otherwise specified. The drawing includes key features such as the optical lens shape, cathode marking, and recommended solder pad footprint for PCB design, which is vital for ensuring proper soldering, thermal conduction, and optical alignment.

6. Soldering and Assembly Guidelines

• Reflow Soldering: The device can withstand a peak soldering temperature of 260°C. It is rated for a maximum of 2 reflow cycles.
• Thermal Management: As specified, the substrate temperature must not exceed 70°C at 1000mA. This necessitates the use of an appropriate PCB (e.g., MCPCB or a design with sufficient thermal vias) and possibly additional heatsinking depending on the application's duty cycle and ambient conditions.
• Storage: As an MSL Level 1 device, no special dry storage is required under normal factory conditions (≤30°C/85% RH).
• Handling: Standard ESD precautions should be observed due to the integrated ESD protection, which is rated up to 8KV but can still be vulnerable to higher-energy events.

7. Packaging and Ordering Information

The LEDs are supplied on embossed carrier tapes for automated pick-and-place assembly. Each reel contains 2000 pieces, with a minimum order quantity of 1000 pieces. The carrier tape has dimensions specified in the datasheet and includes polarity indicators to ensure correct orientation during assembly. The product labeling on the reel includes fields for Customer Part Number (CPN), Manufacturer Part Number (P/N), Lot Number, Quantity, and the three binning codes: CAT (Luminous Flux Bin), HUE (Color Bin), and REF (Forward Voltage Bin), along with the MSL level.

8. Application Suggestions

8.1 Typical Application Scenarios

• Mobile Phone Camera Flash: The high pulse current capability (1200mA) and high luminous flux make it ideal for use as a strobe or torch light in mobile devices.
• General Lighting: Indoor lighting, decorative lighting, step lights, exit signs, and other architectural or accent lighting.
• Backlighting: Suitable for TFT display backlighting units requiring warm white light.
• Automotive Lighting: Both interior (ambient lighting, dashboard illumination) and exterior applications (depending on specific automotive qualification requirements).

8.2 Design Considerations

• Driver Design: Use a constant-current driver tailored to the forward voltage bin and desired operating current (e.g., 350mA for continuous, up to 1200mA for pulsed flash).
• Thermal Design: This is the most critical aspect. Calculate the necessary thermal resistance from the LED junction to ambient to keep T_j and T_s within limits. Use of MCPCBs or insulated metal substrates (IMS) is highly recommended for high-current applications.
• Optical Design: The 120-degree Lambertian pattern is good for wide, even illumination. For focused beams, secondary optics (lenses, reflectors) will be required.

9. Technical Comparison and Differentiation

While a direct side-by-side comparison with other models is not provided in this datasheet, key differentiating features of this LED can be inferred:

• High Efficacy in Warm White: Achieving 61.7 lm/W in a warm white (2000-2500K) CCT range is a notable performance point, as efficiency often drops in warmer CCTs compared to cool white.
• Robust Pulse Handling: The 1200mA pulse rating under defined conditions is specifically tailored for camera flash applications, which is a specialized requirement.
• Integrated High-Level ESD Protection: 8KV HBM protection is above the typical industry level, offering greater robustness in handling and end-use.
• Comprehensive Compliance: Meets RoHS, REACH, and Halogen-Free standards, which is essential for modern electronics, especially in consumer and automotive markets.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 1000mA continuously?
A: The Absolute Maximum Rating for DC forward current is 350mA. The 1000mA value is a test condition for specifying luminous flux and is typically associated with pulsed operation (like flash). For continuous operation, you must not exceed 350mA and must ensure the substrate temperature (T_s) remains at or below 70°C through effective thermal management.

Q: What does the "2025" in the part number mean?
A: It refers to the chromaticity (color) bin. LEDs in this bin will have color coordinates within a defined area on the CIE diagram, yielding a warm white color with a Correlated Color Temperature between 2000K and 2500K.

Q: How many of these LEDs can I run in series on a 12V supply?
A: With a typical V_F of ~3.2V, you could theoretically run 3 LEDs in series (3 * 3.2V = 9.6V), leaving headroom for the current regulator. However, you must account for the maximum and minimum V_F from the binning (2.85V to 3.95V) and design the driver to handle this range across all units in the series string.

Q: Is a heatsink necessary?
A> For any operation above low currents, yes. The datasheet explicitly states that substrate temperature must be ≤ 70°C at 1000mA and all reliability data is based on using a 1cm² MCPCB. For continuous operation at lower currents, thermal analysis is still required to ensure T_j < 145°C.

11. Practical Use Case Example

Design Case: Portable Work Light
A designer is creating a battery-powered, high-output work light. They choose this LED for its high lumen output and warm white color, which is easier on the eyes. They plan to use a 3.7V Li-ion battery. To drive the LED, they select a boost constant-current driver set to 300mA (below the 350mA DC max) to ensure good efficiency and longevity. They design a compact aluminum PCB to act as both the circuit carrier and heatsink, ensuring the LED's thermal pad is properly soldered to a large copper pour connected to thermal vias. The wide 120-degree beam angle provides good area coverage without additional optics. The MSL Level 1 rating simplifies the assembly process in their manufacturing facility.

12. Operating Principle Introduction

This is a phosphor-converted white LED. The core is a semiconductor chip made of Indium Gallium Nitride (InGaN). When a forward voltage is applied, electrons and holes recombine within the chip, emitting photons primarily in the blue region of the spectrum. This blue light then strikes a layer of phosphor coating (typically YAG:Ce or similar) deposited on or near the chip. The phosphor absorbs a portion of the blue light and re-emits it as yellow and red light. The mixture of the remaining blue light and the broad-spectrum yellow/red light from the phosphor is perceived by the human eye as white light. The exact ratio of blue to phosphor-converted light determines the Correlated Color Temperature (CCT); a higher red/yellow content results in a "warmer" white light, as is the case with this 2000-2500K device.

13. Technology Trends

The LED industry continues to evolve along several key vectors relevant to this type of device:

• Increased Efficiency (lm/W): Ongoing improvements in chip epitaxy, phosphor technology, and package design drive higher luminous efficacy, reducing energy consumption and thermal load for the same light output.
• Improved Color Quality and Consistency: Advancements in phosphor systems and binning processes lead to tighter color tolerances (smaller bin areas) and higher Color Rendering Index (CRI) values, even for warm white LEDs.
• Higher Power Density and Reliability: Package materials and thermal interface technologies are improving, allowing for higher drive currents and power dissipation while maintaining or improving lifetime (L70, L90 metrics).
• Integration and Miniaturization There is a trend towards integrating multiple LED chips, drivers, and control circuitry into single, smarter modules. However, discrete high-power LEDs like this one remain essential for applications requiring maximum flexibility in optical and thermal design.
• Pulsed Performance for Sensing: For applications beyond illumination, such as LiDAR or structured light for 3D sensing, the ability to handle very short, high-current pulses with precise timing is becoming increasingly important.