ELCH09-NB5060J8K2283910-FDX LED Datasheet - Package 5.0x6.0mm - Voltage 2.85-3.95V - Luminous Flux 350lm - White 5000-6000K - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, surface-mount white LED component. The device is engineered to deliver high luminous output within a compact package, making it suitable for space-constrained applications requiring bright, efficient illumination. Its core advantages include excellent optical efficiency, robust ESD protection, and compliance with major environmental regulations.

The primary target markets for this LED encompass mobile device camera flashes, digital video torch lights, various indoor and outdoor lighting fixtures, TFT backlighting units, decorative lighting, and automotive interior/exterior illumination. The component's performance profile aligns with applications demanding reliability, brightness, and color consistency.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The device's operational limits are defined to ensure long-term reliability. Key ratings include a DC forward current (Torch Mode) of 350 mA and a peak pulse current capability of 1500 mA under specific conditions (max 400 ms duration, 10% duty cycle). The junction temperature must not exceed 150°C, with an operating ambient temperature range of -40°C to +85°C. The LED offers robust ESD protection up to 8000V (HBM, JEDEC 3b). It is critical to note that these are stress limits; continuous operation at or near these values may degrade performance and longevity. The component is not designed for reverse bias operation.

2.2 Electro-Optical Characteristics

Measured at a solder pad temperature (Ts) of 25°C, the device's key performance metrics are defined. The typical luminous flux (Iv) is 350 lumens at a forward current (IF) of 1000mA, with a minimum specified value of 300 lm. The forward voltage (VF) at this current ranges from a minimum of 2.85V to a maximum of 3.95V. The correlated color temperature (CCT) for this white LED variant falls between 5000K and 6000K, placing it in the cool white spectrum. All electrical and optical data is tested under a 50ms pulse condition to minimize self-heating effects during measurement.

2.3 Thermal and Reliability Considerations

Proper thermal management is paramount for LED performance and lifespan. The maximum allowable soldering temperature is 260°C for a maximum of two reflow cycles. The device is rated at Moisture Sensitivity Level (MSL) 1, indicating an unlimited floor life at conditions ≤30°C/85% RH. All reliability specifications, including assurances against excessive IV degradation, are validated under conditions of good thermal management, specifically using a 1.0 x 1.0 cm² Metal Core Printed Circuit Board (MCPCB).

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key parameters.

3.1 Forward Voltage Binning

The forward voltage is categorized into three bins: 2832 (2.85V - 3.25V), 3235 (3.25V - 3.55V), and 3539 (3.55V - 3.95V), all measured at IF=1000mA.

3.2 Luminous Flux Binning

The luminous flux output is binned into four categories: J8 (300-330 lm), J9 (330-360 lm), K1 (360-390 lm), and K2 (390-420 lm), measured at IF=1000mA. The typical part number references the J8 bin.

3.3 Chromaticity (Color) Binning

The white color point is defined within a specific region on the CIE 1931 chromaticity diagram, corresponding to a correlated color temperature range of 5000K to 6000K. The bin designated as "5060" provides the reference color coordinates for this range. The allowable measurement tolerance for color coordinates is ±0.01.

4. Performance Curve Analysis

4.1 Spectral and Radiation Patterns

The relative spectral distribution curve shows a peak in the blue wavelength region, typical for a phosphor-converted white LED, with a broad phosphor emission in the yellow spectrum. The combined output results in white light. The typical radiation pattern is Lambertian, characterized by a viewing angle (2θ1/2) of 120 degrees, where intensity is half of the peak value. This provides a wide, uniform illumination field.

4.2 Electrical and Optical Correlations

The forward voltage vs. forward current curve demonstrates the diode's characteristic exponential relationship, with VF increasing with current. The relative luminous flux vs. forward current curve shows that light output increases sub-linearly with current, a common trait due to efficiency droop at higher currents and junction temperatures. The correlated color temperature (CCT) vs. forward current curve indicates that CCT may shift slightly with operating current, which is an important consideration for color-critical applications. All correlation data is measured under superior thermal management.

5. Mechanical and Package Information

5.1 Package Dimension Drawing

The LED is housed in a surface-mount device (SMD) package with nominal dimensions of 5.0mm in length and 6.0mm in width. The detailed mechanical drawing specifies all critical dimensions, including pad locations, overall height, and tolerances (typically ±0.05mm unless otherwise noted). This information is essential for PCB footprint design and assembly.

5.2 Polarity Identification

The component and its carrier tape are marked to indicate polarity. Correct orientation during placement is crucial for proper circuit operation. The datasheet provides a clear diagram showing the anode and cathode identification on the device body and within the reel packaging.

6. Soldering and Assembly Guidelines

The maximum soldering temperature is specified as 260°C. The component can withstand a maximum of two reflow cycles. Due to its MSL Level 1 rating, no special baking is required before use if stored within the specified humidity conditions. However, standard IPC/JEDEC guidelines for handling moisture-sensitive devices should be followed during assembly processes to prevent thermal-mechanical stress.

7. Packaging and Ordering Information

7.1 Packaging Specifications

The LEDs are supplied in moisture-resistant packing. They are loaded into embossed carrier tapes, which are then wound onto reels. The standard loaded quantity is 2000 pieces per reel, with a minimum order quantity of 1000 pieces. Detailed dimensions for the carrier tape and the emitter reel are provided to facilitate automated pick-and-place machine setup.

7.2 Product Labeling

The reel label contains critical information for traceability and correct application: Customer Product Number (CPN), manufacturer's Part Number (P/N), Lot Number, Packing Quantity (QTY), and the specific bin codes for Luminous Flux (CAT), Color (HUE), and Forward Voltage (REF). The Moisture Sensitivity Level (MSL-X) is also indicated.

8. Application Recommendations

8.1 Typical Application Scenarios

This LED is well-suited for:
- Mobile Device Camera Flash: Its high pulse current capability and brightness make it ideal for smartphone camera flashes.
- Portable Lighting: Torch lights for digital video cameras or handheld devices.
- General Illumination: Indoor lighting, step lights, exit signs, and other architectural markers.
- Backlighting: For small to medium-sized TFT-LCD panels.
- Automotive Lighting: Both interior (dome lights, reading lights) and exterior (auxiliary lights, signature lighting) applications, subject to specific automotive qualification.
- Decorative Lighting: Accent lighting in consumer electronics or entertainment venues.

8.2 Design Considerations

1. Thermal Management: Use an adequate PCB thermal design (e.g., MCPCB with sufficient copper area or thermal vias) to maintain a low junction temperature. This preserves luminous output, color stability, and operational life.
2. Current Driving: Implement a constant-current driver circuit appropriate for the desired operating point (e.g., 350mA for torch mode, up to 1A for high output). Consider derating for high ambient temperatures.
3. Optical Design: The 120-degree Lambertian beam pattern is suitable for wide-area illumination. Secondary optics (lenses, reflectors) may be needed for beam shaping or focusing.
4. ESD Protection: While the device has built-in ESD protection, adhering to good ESD handling practices during assembly is still recommended.

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, this device offers a significantly higher luminous flux output (350lm) at a 1A drive current, resulting in superior luminous efficacy (100 lm/W typ.). The combination of high brightness, a compact 5.0x6.0mm footprint, and a wide 120-degree viewing angle provides a favorable balance for many applications. Its compliance with halogen-free, RoHS, and REACH standards ensures it meets stringent environmental requirements for global markets. The detailed binning structure for flux, voltage, and color allows designers to select parts with tight parameter tolerances for consistent system performance.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between DC Forward Current and Peak Pulse Current?
A: The DC Forward Current (350mA) is the maximum continuous current recommended for reliable long-term operation (e.g., in a torch mode). The Peak Pulse Current (1500mA) is a much higher current that can be applied for very short durations (≤400ms) at a low duty cycle (≤10%), which is typical for camera flash applications to achieve a very bright, brief burst of light.

Q: How do I interpret the luminous flux bin code (e.g., J8) in the part number?
A: The bin code (J8, K1, etc.) indicates the guaranteed minimum and maximum luminous flux range for that specific LED when measured at 1000mA. For example, a J8 binned LED will have a flux between 300 and 330 lumens. This allows designers to predict and control the brightness level of their final product.

Q: Why is thermal management so frequently emphasized?
A: LED performance degrades with increasing junction temperature. Excessive heat reduces light output (lumen depreciation), can cause a shift in color temperature, and most critically, accelerates the chemical processes that lead to permanent failure. Effective heat sinking is non-negotiable for achieving the rated performance and lifespan.

11. Practical Design and Usage Examples

Example 1: Smartphone Camera Flash Module
In this scenario, the LED would be driven by a dedicated flash driver IC. The design would utilize the peak pulse current rating (1500mA) to achieve maximum brightness for a photo. The PCB would need dedicated thermal pads connected to internal ground planes or other thermal paths to dissipate the heat from the brief, high-power pulse. The wide viewing angle helps illuminate a scene evenly, reducing harsh shadows.

Example 2: Architectural Step Light
For a low-profile step light, multiple LEDs might be arranged in a linear array and driven at a lower continuous current (e.g., 200-300mA) for energy efficiency and long life. The 120-degree beam angle ensures the light spreads across the step tread. The design must account for potential high ambient temperatures if installed outdoors or in enclosed fixtures.

12. Operational Principle Introduction

This is a phosphor-converted white LED. The core semiconductor chip, made of Indium Gallium Nitride (InGaN), emits light in the blue wavelength region when forward biased. This blue light is partially absorbed by a phosphor coating (typically based on Yttrium Aluminum Garnet or similar materials) deposited over the chip. The phosphor re-emits this energy as a broad spectrum of yellow light. The combination of the remaining unabsorbed blue light and the emitted yellow light is perceived by the human eye as white light. The exact proportion of blue to yellow determines the correlated color temperature (CCT), resulting in the 5000-6000K cool white output of this device.

13. Technology Trends and Context

The development of this LED aligns with several ongoing trends in solid-state lighting: Increased Efficiency: Achieving 100 lm/W represents continuous improvement in extracting more visible light per electrical watt, reducing energy consumption. Miniaturization with High Output: Packaging high luminous flux into a relatively small 5.0x6.0mm footprint enables sleeker, more compact end products. Standardization and Binning: Detailed multi-parameter binning allows for predictable performance in volume manufacturing, which is critical for consumer electronics and lighting products. Environmental Compliance: Adherence to RoHS, REACH, and halogen-free standards is now a baseline requirement for electronic components in most global markets, reflecting the industry's focus on sustainable manufacturing.