ELCS14B-KB4050J6J9283910-F4Z LED Datasheet - High-Efficiency White LED - 250lm @ 1A - 3.95V Max - 5.9W Pulse Power - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, surface-mount white light-emitting diode (LED). The device is engineered for applications requiring high luminous output and efficiency within a compact form factor. Its core advantages include a high typical luminous flux of 250 lumens at a drive current of 1 Ampere, resulting in an impressive optical efficiency of 73.5 lumens per Watt. The LED incorporates robust ESD protection, making it suitable for handling in various assembly environments. It is fully compliant with modern environmental and safety standards, including RoHS, EU REACH, and halogen-free requirements. The primary target markets encompass mobile device subsystems, consumer electronics, general illumination, and automotive lighting, both interior and exterior.

2. Technical Parameters and Specifications

2.1 Absolute Maximum Ratings

The device's operational limits are defined to ensure reliability and prevent permanent damage. Key ratings include a DC forward current (Torch Mode) of 350 mA and a peak pulse current capability of 1500 mA under specified conditions (max duration 400 ms, max duty cycle 10%). The junction temperature must not exceed 150°C. The device can withstand an ESD pulse of up to 2 KV according to the JEDEC JS-001-2017 (HBM) standard. The operating temperature range is from -40°C to +85°C. It is critical to avoid simultaneous application of multiple maximum rating parameters and prolonged operation at these limits to prevent reliability degradation.

2.2 Electro-Optical Characteristics

All electro-optical data is specified at a solder pad temperature (Ts) of 25°C. The primary performance metrics are as follows:

• Luminous Flux (Iv): 220 lm (Min), 250 lm (Typ) at IF=1000mA. Measurement tolerance is ±10%.
• Forward Voltage (VF): 2.85V (Min), 3.95V (Max) at IF=1000mA. Measurement tolerance is ±0.1V. Electrical and optical data is tested under a 50 ms pulse condition.
• Correlated Color Temperature (CCT): Ranges from 4000K to 5000K, with a typical value of 4500K, placing it in the neutral white region.
• Color Rendering Index (CRI): Minimum of 80, with a typical value of 83. Measurement tolerance is ±2.
• Viewing Angle (2θ1/2): 120 degrees, with a tolerance of ±5°. This wide viewing angle is characteristic of a Lambertian radiation pattern.

2.3 Thermal and Reliability Considerations

Proper thermal management is paramount for performance and longevity. The maximum allowable substrate temperature (Ts) is 70°C when operating at 1000mA. The device can tolerate soldering at 260°C for a maximum of two reflow cycles. All specified parameters are assured by reliability testing for 1000 hours, with the criterion that the luminous flux degradation is less than 30%. This testing is performed under good thermal management using a 1.0 x 1.0 cm² Metal Core Printed Circuit Board (MCPCB).

3. Binning System Explanation

The LEDs are sorted (binned) based on three key parameters to ensure consistency within an application. The bin codes are part of the product ordering code (e.g., J6, 4050, 2832 in ELC...J6J9283910).

3.1 Luminous Flux Binning

LEDs are grouped by their total light output at 1000mA. The binning structure is as follows:

• Bin J6: Luminous Flux from 220 lm to 250 lm.
• Bin J7: Luminous Flux from 250 lm to 300 lm.
• Bin J8: Luminous Flux from 300 lm to 330 lm.
• Bin J9: Luminous Flux from 330 lm to 360 lm.

The provided device is from Bin J6.

3.2 Forward Voltage Binning

LEDs are categorized by their voltage drop at 1000mA to aid in driver design and power management.

• Bin 2832: Forward Voltage from 2.85V to 3.25V.
• Bin 3235: Forward Voltage from 3.25V to 3.55V.
• Bin 3539: Forward Voltage from 3.55V to 3.95V.

The provided device falls into the 2832 voltage bin.

3.3 Chromaticity (Color) Binning

The color coordinates on the CIE 1931 chromaticity diagram are tightly controlled. The device uses the "4050" color bin, which defines a specific quadrilateral area on the diagram ensuring the emitted white light falls within a consistent color space. The color coordinates are measured at IF=1000mA with an allowance of ±0.01. This bin corresponds to the correlated color temperature range of 4000K to 5000K.

4. Performance Curve Analysis

4.1 Spectral Distribution

The relative spectral distribution curve (shown in the datasheet) is typical for a phosphor-converted white LED. It features a primary blue peak from the InGaN chip (λp wavelength would be specified, e.g., around 450-455nm) and a broad secondary emission band in the yellow-green-red region from the phosphor. The combination produces white light. The exact shape and peak wavelengths determine the CCT and CRI.

4.2 Radiation Pattern

The typical polar radiation pattern confirms a Lambertian distribution. The relative luminous intensity is plotted against the viewing angle. The pattern shows intensity is highest at 0° (perpendicular to the emitting surface) and decreases following a cosine law, reaching half the peak value at ±60° from the centerline, defining the 120° full viewing angle.

4.3 Forward Characteristics

While the specific graphs for Forward Voltage vs. Current and Relative Luminous Flux vs. Current are marked "TBD" (To Be Determined) in this preliminary datasheet, their general behavior is standard for LEDs. The forward voltage (VF) increases logarithmically with current. The relative luminous flux typically increases sub-linearly with current, and efficiency (lumens per watt) often peaks at a current lower than the maximum rated current. The Correlated Color Temperature (CCT) may also shift slightly with drive current due to junction temperature and phosphor efficiency changes.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED comes in a surface-mount device (SMD) package. The datasheet includes detailed dimensioned drawings (top, side, and bottom views) in millimeters. Key dimensions typically include the package length, width, height, pad sizes, and pad spacing. Tolerances are generally ±0.05mm unless otherwise specified. The bottom view clearly shows the anode and cathode pad markings for correct PCB footprint design and assembly polarity.

5.2 Polarity Identification

Correct polarity is essential for operation. The package has asymmetric pads or markings (visible in the bottom-view drawing) to distinguish the anode (+) and cathode (-). The PCB footprint must be designed to match this asymmetry to prevent incorrect placement.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The device is suitable for reflow soldering processes. The maximum soldering temperature is 260°C, and it can withstand a maximum of two reflow cycles. Designers must adhere to a standard lead-free reflow profile, ensuring the peak temperature and time above liquidus are controlled to prevent thermal damage to the LED die, phosphor, or package.

6.2 Moisture Sensitivity and Storage

The LED is rated at Moisture Sensitivity Level (MSL) 1. This means it has an unlimited floor life at conditions ≤30°C / 85% Relative Humidity. However, best practices should still be followed:

• Before opening: Store the sealed moisture-proof bag at ≤30°C / <90% RH.
• After opening: Use components promptly. If not used immediately, store at ≤30°C / <85% RH. It is recommended not to open the bag until the components are ready for use in production.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied on embossed carrier tapes wound onto reels for automated pick-and-place assembly. The datasheet provides dimensions for the carrier tape pockets, pitch, and the overall reel dimensions. A standard loaded quantity is 2000 pieces per reel, with a minimum order quantity of 1000 pieces.

7.2 Product Labeling

The reel and packaging labels contain critical information for traceability and verification:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., ELC...F4Z).
• LOT NO: Manufacturing lot number for traceability.
• QTY: Quantity of devices in the package.
• CAT: Luminous Flux Bin (e.g., J6).
• HUE: Color Bin (e.g., 4050).
• REF: Forward Voltage Bin (e.g., 2832).
• MSL-X: Moisture Sensitivity Level.

8. Application Notes and Design Considerations

8.1 Typical Application Scenarios

• Mobile Device Camera Flash: The high pulse current capability (1500mA) and high luminous output make it suitable for camera flash/strobe applications in smartphones and tablets.
• Torch and Portable Lighting: Ideal for flashlight modes in devices or dedicated handheld torches due to its high efficiency.
• Backlighting: Can be used for TFT-LCD backlighting in small to medium-sized displays.
• General and Decorative Lighting: Suitable for accent lighting, signage, step lights, and other interior/exterior architectural applications.
• Automotive Lighting: Applicable for interior map lights, door lights, and other non-exterior-forward-lighting functions.

8.2 Critical Design Considerations

1. Thermal Management: This is the most critical factor for performance and lifetime. The LED must be mounted on a PCB with adequate thermal conductivity (e.g., MCPCB or FR4 with thermal vias) to keep the solder pad and junction temperatures within limits. The specified 70°C substrate temperature at 1000mA is a key design target.
2. Current Driving: Use a constant-current LED driver, not a constant-voltage source. The driver must be rated for the required forward current (DC or pulse) and the forward voltage range of the specific bin being used.
3. ESD Precautions: While the device has built-in ESD protection, standard ESD handling procedures should be followed during assembly and handling.
4. Optical Design: The Lambertian emission pattern requires appropriate secondary optics (lenses, reflectors) if beam shaping or specific illumination patterns are needed.

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, this device offers significantly higher luminous flux in a likely similar package size, pushing the boundaries of efficiency (73.5 lm/W at 1A). Its robust 2KV ESD protection exceeds the typical 1KV level found in many consumer-grade LEDs, offering better handling robustness. The combination of high flux, high efficiency, and strong ESD protection in a single package is a key differentiator for demanding applications like camera flashes where space, light output, and reliability are paramount.

10. Frequently Asked Questions (FAQ)

10.1 What is the difference between Torch Mode and Pulse Mode currents?

Torch Mode (IF=350mA): This is the maximum recommended continuous DC forward current for applications like a constant-on flashlight.

Pulse Mode (IPulse=1500mA): This is the maximum peak pulse current for very short durations (max 400ms) with a low duty cycle (max 10%), as used in camera flash applications. Operating at this current continuously will cause overheating and failure.

10.2 Why is thermal management so important for this LED?

LED performance (light output, color, voltage) and lifetime are highly sensitive to junction temperature (Tj). Excessive heat reduces light output (efficiency droop), can cause a color shift, and dramatically accelerates the degradation of the LED materials, leading to premature failure. The 70°C limit for the substrate at 1A is a practical design guideline to keep Tj within a safe operating range.

10.3 How do I interpret the bin codes when ordering?

The full part number (e.g., ELC...J6J92832...4050...F4Z) contains the bin information. You must specify the required bins for Luminous Flux (J6), Forward Voltage (2832), and Chromaticity (4050) to ensure you receive LEDs with the precise performance characteristics needed for your design to function consistently and as intended.

11. Design and Usage Case Study

Scenario: Designing a Smartphone Camera Flash Module

A design engineer is tasked with creating a dual-LED flash system for a high-end smartphone. The key requirements are: very high light output for a duration of ~200ms to illuminate a scene, minimal space consumption, and reliable operation over the device's lifespan.

Implementation: Two of these LEDs are selected. They are driven in parallel by a dedicated flash driver IC. The driver is programmed to deliver a 1500mA pulse to each LED for 200ms when the flash is triggered, utilizing the peak pulse rating. The PCB is a compact, multi-layer design with a dedicated thermal pad connected to the phone's mid-frame for heat dissipation, ensuring the substrate temperature stays below 70°C during the pulse. The 2KV ESD rating provides a safety margin against static discharge during phone assembly and user handling. By specifying tight bins (e.g., J6 for flux, 4050 for color), the light output and color temperature from both LEDs are matched, resulting in consistent, high-quality flash photos.

12. Operational Principle

This is a phosphor-converted white LED. The core is a semiconductor chip made of Indium Gallium Nitride (InGaN) that emits blue light when electrical current passes through it (electroluminescence). This blue light is partially absorbed by a layer of yellow (or a mix of green and red) phosphor material that coats the chip. The phosphor re-emits the absorbed energy as light of longer wavelengths (yellow/red). The combination of the remaining unabsorbed blue light and the phosphor-emitted yellow/red light mixes to produce the perception of white light. The exact ratios of blue to phosphor light determine the Correlated Color Temperature (CCT) – more blue results in a cooler white (higher CCT), while more yellow/red results in a warmer white (lower CCT).

13. Technology Trends

The development of white LEDs like this one is driven by continuous improvements in several areas:

• Efficiency (lm/W): Ongoing research focuses on improving the internal quantum efficiency of the blue InGaN chip (extracting more light per electron) and developing more efficient phosphors with narrower emission bands (for better color rendering and less Stokes shift loss).
• Lumen Density: The trend is to pack more lumens into smaller packages, enabling brighter applications or using fewer LEDs for the same light output, saving cost and space.
• Reliability and Robustness: Enhancements in package materials, die attach techniques, and phosphor stability are increasing lifetime and allowing operation at higher temperatures and currents.
• Color Quality and Consistency: Tighter binning, improved phosphor formulations, and new approaches like violet pump LEDs with RGB phosphors aim to achieve higher CRI (Ra >90, R9 >80) and more consistent color over time and temperature.