334-15/T1C3-7TVA LED Lamp Datasheet - White Light - 30 deg Viewing Angle - 20mA - 3.2V Typ - English Technical Document

1. Product Overview

This document provides the technical specifications for the 334-15/T1C3-7TVA, a high-intensity white LED lamp. The device is engineered to deliver superior luminous output from a compact package, making it suitable for applications demanding bright, reliable illumination. Its core design utilizes an InGaN chip combined with a phosphor-filled reflector to convert blue emission into ideal white light.

1.1 Core Advantages

• High Luminous Intensity: Capable of delivering up to 14250 mcd at a standard drive current of 20mA.
• Optimized Thermal Performance: Features a low thermal resistance package for efficient heat dissipation, contributing to long-term reliability.
• Regulatory Compliance: The product is designed to comply with key environmental and safety standards, including RoHS, EU REACH, and halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl <1500 ppm).
• Consistent White Light: The phosphor conversion technology ensures a stable and desirable white chromaticity.

1.2 Target Applications

This LED is primarily targeted at markets requiring robust and bright point-source lighting.

• Automotive Lighting: Ideal for interior lighting, dashboard indicators, and auxiliary signal lights.
• Electronic Signs and Signals: Suitable for status indicators, backlit panels, and informational displays.
• General Lighting: Can be used in accent lighting, decorative lighting, and other applications where a compact, bright white source is needed.

2. Technical Parameter Deep-Dive

The following sections provide a detailed, objective analysis of the device's key performance parameters.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

• Continuous Forward Current (I_F): 20 mA. This is the maximum DC current recommended for continuous operation.
• Peak Forward Current (I_FP): 100 mA. Permissible only under pulsed conditions (duty cycle 1/10 @ 1 kHz).
• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (P_d): 110 mW. The maximum power the package can dissipate at Ta=25°C.
• Operating Temperature (T_opr): -40°C to +85°C. The ambient temperature range for normal operation.
• Storage Temperature (T_stg): -40°C to +100°C.
• ESD (HBM): 4000 V. Indicates a moderate level of electrostatic discharge protection.
• Soldering Temperature (T_sol): 260°C for 5 seconds. Defines the reflow soldering profile limit.

2.2 Electro-Optical Characteristics

These are the typical electrical and optical performance parameters measured at Ta=25°C and I_F=20mA, unless otherwise specified.

• Forward Voltage (V_F): 2.8V to 3.6V. The voltage drop across the LED when conducting the specified current. A typical value is around 3.2V.
• Luminous Intensity (I_V): 7150 mcd to 14250 mcd. This wide range is managed through a binning system (see Section 3). The output is highly current-dependent.
• Viewing Angle (2θ_1/2): 30 degrees (typical). This defines the angular spread where luminous intensity is at least half of the peak axial intensity.
• Chromaticity Coordinates (x, y): Typical values are x=0.31, y=0.30, placing the white point within a standard white region on the CIE diagram. Specific bins define tighter coordinate ranges.
• Zener Protection: The device includes an integrated Zener diode with a reverse voltage (V_Z) of 5.2V (typical at I_Z=5mA), offering basic protection against reverse voltage transients.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into performance bins. This allows designers to select parts that meet specific application requirements for brightness and voltage.

3.1 Luminous Intensity Binning

LEDs are categorized into three bins based on their measured luminous intensity at I_F=20mA. The tolerance within each bin is ±10%.

• Bin T: 7150 mcd (Min) to 9000 mcd (Max)
• Bin U: 9000 mcd (Min) to 11250 mcd (Max)
• Bin V: 11250 mcd (Min) to 14250 mcd (Max)

3.2 Forward Voltage Binning

LEDs are also binned according to their forward voltage drop at I_F=20mA, with a measurement uncertainty of ±0.1V. This helps in designing consistent current drive circuits, especially in parallel arrays.

• Bin 0: 2.8V to 3.0V
• Bin 1: 3.0V to 3.2V
• Bin 2: 3.2V to 3.4V
• Bin 3: 3.4V to 3.6V

3.3 Color Binning

The white color point is controlled within specific regions on the CIE chromaticity diagram. The product groups multiple color ranks (B5-1 through B6-4) under a single group designation (Group 7). Each rank has defined boundaries for the x and y coordinates, with a measurement uncertainty of ±0.01. This grouping ensures the white light falls within an acceptable correlated color temperature (CCT) range for general applications.

4. Performance Curve Analysis

The provided characteristic curves offer insights into the device's behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution of the emitted white light. It typically features a primary blue peak from the InGaN chip and a broader yellow-green peak from the phosphor. The combined spectrum determines the Color Rendering Index (CRI) and the perceived color of the white light.

4.2 Directivity Pattern

The radiation pattern graph confirms the 30-degree viewing angle, showing how luminous intensity decreases as the angle from the central axis increases. This is a classic Lambertian or near-Lambertian pattern common for LED lamps.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This exponential curve is fundamental for LED drive circuit design. It shows the non-linear relationship between current and voltage. A small increase in voltage beyond the turn-on point causes a large increase in current, highlighting the necessity for current-limiting drivers, not voltage sources.

4.4 Relative Intensity vs. Forward Current

This curve demonstrates the light output's dependence on drive current. Luminous intensity generally increases with current but may become sub-linear at higher currents due to efficiency droop and increased junction temperature.

4.5 Chromaticity Coordinate vs. Forward Current

This graph is crucial for understanding color stability. It shows how the white point (x, y coordinates) may shift with changes in drive current. Stable coordinates across the operating current range are desirable for consistent color performance.

6.6 Forward Current vs. Ambient Temperature

This derating curve indicates the maximum allowable forward current as the ambient temperature increases. To prevent overheating and ensure reliability, the drive current must be reduced when operating at high ambient temperatures (approaching the maximum T_opr of +85°C).

5. Mechanical and Package Information

5.1 Package Dimensions

The LED features a standard radial leaded package (often referred to as a \"lamp\" package). Key dimensional notes include:

• All dimensions are in millimeters (mm).
• General tolerance is ±0.25 mm unless specified otherwise on the drawing.
• Lead spacing is measured at the point where the leads exit the package body.
• The maximum allowable protrusion of resin below the flange is 1.5 mm.
• The package drawing provides critical measurements for PCB footprint design, including lead diameter, body size, and overall height.

5.2 Polarity Identification

The cathode is typically indicated by a flat spot on the lens, a shorter lead, or other marking on the package body as shown in the dimension diagram. Correct polarity must be observed during assembly.

6. Soldering and Assembly Guidelines

Proper handling is essential to maintain LED performance and reliability.

6.1 Lead Forming

• Bending must occur at least 3 mm from the base of the epoxy bulb to avoid stress on the internal die and wire bonds.
• Form leads before the soldering process.
• Avoid applying mechanical stress to the package during forming.
• Cut leads at room temperature; high-temperature cutting can cause failure.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

6.2 Soldering Parameters

• Hand Soldering: Iron tip temperature ≤ 300°C (for a max. 30W iron), soldering time ≤ 3 seconds per lead. Maintain a minimum distance of 3 mm from the solder joint to the epoxy bulb.
• Wave/Dip Soldering: Pre-heat temperature ≤ 100°C (for max. 60 sec), solder bath temperature ≤ 260°C for a maximum immersion time of 5 seconds.

6.3 Storage Conditions

• Recommended storage after receipt: ≤ 30°C and ≤ 70% Relative Humidity (RH). Shelf life under these conditions is 3 months.
• For longer storage (up to 1 year), place LEDs in a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation on the devices.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged to prevent damage from electrostatic discharge (ESD) and moisture.

• Primary Packing: Anti-static bags containing 200 to 500 pieces.
• Secondary Packing: 5 bags are placed into one inner carton.
• Tertiary Packing: 10 inner cartons are packed into one master (outside) carton.

7.2 Label Explanation

The package label includes several key identifiers: Customer's Part Number (CPN), Production Number (P/N), Packing Quantity (QTY), combined rank for Luminous Intensity and Forward Voltage (CAT), Color Rank (HUE), Reference (REF), and Lot Number (LOT No).

7.3 Model Number Designation

The full part number is 334-15/T1C3-7TVA. The structure (334-15/T1C3-□ □ □ □) suggests that the trailing characters (represented by squares) likely specify the particular bins for luminous intensity (e.g., V), forward voltage (e.g., 1), and possibly other attributes, allowing for precise ordering of desired performance grades.

8. Application Design Considerations

8.1 Driver Circuit Design

Due to the exponential I-V characteristic, a constant-current driver is strongly recommended over a simple series resistor or voltage source for stable and efficient operation, especially over temperature variations. The driver should be designed to provide a maximum of 20mA DC. The integrated Zener diode offers basic protection but may not be sufficient for all transient events; additional external protection circuitry (like TVS diodes) should be considered for harsh electrical environments (e.g., automotive).

8.2 Thermal Management

Although the package has low thermal resistance, proper heat sinking is vital for maintaining performance and longevity. The maximum power dissipation is 110mW. At a typical V_F of 3.2V and I_F of 20mA, power dissipation is 64mW, providing a good margin. However, in high ambient temperature applications or when mounted on a PCB with poor thermal conductivity, the junction temperature may rise, leading to reduced light output, accelerated lumen depreciation, and potential color shift. Ensure adequate airflow or thermal vias in the PCB under the LED's flange.

8.3 Optical Integration

The 30-degree viewing angle provides a relatively focused beam. For applications requiring different beam patterns (wider or narrower), secondary optics such as lenses or reflectors must be used. The small package size facilitates integration into tight spaces and arrays.

9. Technical Comparison and Positioning

Compared to generic, non-binned LEDs, this device offers guaranteed performance parameters through its detailed binning system, which is critical for applications requiring consistent brightness and color across multiple units (e.g., indicator clusters, backlighting arrays). The inclusion of basic Zener protection is an advantage over LEDs without any protection, simplifying circuit design in environments with potential reverse voltage. The combination of high intensity (up to 14250 mcd) from a radial package makes it competitive for applications traditionally using incandescent lamps where high point brightness is needed.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED with a 3.3V power supply?
A: Not directly. The forward voltage ranges from 2.8V to 3.6V. A 3.3V supply might barely turn on some units (in Bin 0) but would severely overdrive others (in Bin 2 or 3) due to the steep I-V curve, leading to rapid failure. Always use a current-limiting circuit set to 20mA or less.

Q: What is the typical lifetime of this LED?
A: LED lifetime (often defined as L70 - time to 70% of initial light output) is not explicitly stated in this datasheet. It is heavily dependent on operating conditions, primarily junction temperature. Operating at or below the recommended 20mA with good thermal management can result in tens of thousands of hours of life.

Q: How do I select the right bin for my application?
A: Choose the luminous intensity bin (T, U, V) based on your minimum required brightness. Select the forward voltage bin based on your driver circuit design; using LEDs from the same voltage bin ensures uniform current sharing if placed in parallel. The color group (7) is fixed for this part number.

Q: Is this LED suitable for outdoor use?
A: The operating temperature range (-40°C to +85°C) supports many outdoor environments. However, the datasheet does not specify an Ingress Protection (IP) rating for the package itself. For outdoor use, the LED would need to be properly potted or housed within a sealed fixture to protect against moisture and contaminants.

11. Design and Usage Case Study

Scenario: Designing a Compact Status Indicator Panel
A designer needs 20 bright white indicators for a control panel. Consistency in brightness is critical for user experience.
Implementation:
1. The designer selects the 334-15/T1C3-7TVA LED in Bin V for maximum brightness and Bin 1 for a consistent forward voltage around 3.1V.
2. A single constant-current driver IC capable of sourcing 400mA (20mA x 20 LEDs) is chosen. The LEDs are connected in a series-parallel configuration, ensuring all strings have the same number of LEDs to maintain current balance, aided by using the same voltage bin.
3. The PCB layout includes thermal relief pads connected to a ground plane to help dissipate heat.
4. The 30-degree viewing angle is perfect for the panel's small aperture holes, providing clear, directed light without excessive spill.
This approach ensures a uniform, bright, and reliable indicator panel.

12. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor. The core is an InGaN (Indium Gallium Nitride) chip. When a forward voltage is applied, electrons and holes recombine in the active region of the chip, releasing energy in the form of photons. The specific composition of the InGaN alloy is tuned to emit blue light. This blue light is not emitted directly. Instead, it strikes a phosphor coating (typically YAG:Ce - Yttrium Aluminum Garnet doped with Cerium) filled inside the reflector cup of the package. The phosphor absorbs the high-energy blue photons and re-emits lower-energy photons across a broad spectrum in the yellow-green range. The mixture of the remaining blue light and the converted yellow light is perceived by the human eye as white light. This method is called phosphor-converted white LED technology.

13. Technology Trends and Context

The 334-15/T1C3-7TVA represents a mature, high-reliability LED technology. The radial leaded package, while less common in cutting-edge consumer electronics, remains vital in automotive, industrial, and specialty lighting where through-hole mounting is preferred for mechanical robustness or legacy design compatibility. The industry trend is towards higher efficiency (more lumens per watt), improved color rendering, and higher maximum junction temperatures. Surface-mount device (SMD) packages like 5050, 3535, or 2835 now dominate high-volume applications due to their suitability for automated assembly. However, the specific performance parameters, binning rigor, and reliability focus of this lamp-style LED ensure its continued relevance in niche markets that prioritize these attributes over the smallest possible form factor.