SMD LED 93-22SURSYGC/S530-A3/TR8 Technical Datasheet - 3.2x2.8x1.9mm - Voltage 2.0-2.4V - Brilliant Red/Yellow Green - English

1. Product Overview

This document details the specifications for a high-performance, surface-mount LED component featuring an integrated reflector. The device is designed for reliability and ease of assembly in automated manufacturing environments.

1.1 Core Advantages

• Packaged on 12mm tape for 7-inch reels, compatible with standard automated pick-and-place equipment.
• Designed for compatibility with infrared (IR) and vapor phase reflow soldering processes.
• Complies with EIA standard packaging.
• IC compatible input.
• Pb-free construction and RoHS compliant.
• Integrated reflector for enhanced light direction and intensity.

1.2 Target Applications

This LED is suitable for a wide range of indicator and backlighting functions, including:

• Telecommunication equipment (telephones, fax machines).
• Audio and video equipment.
• Battery-powered devices.
• Outdoor application indicators.
• Office equipment.
• Flat backlighting for switches, symbols, and other LEDs.
• General-purpose indication.

2. Device Selection and Technical Parameters

2.1 Device Selection Guide

The product is offered in two primary color variants based on the chip material:

• SUR: Utilizes an AlGaInP chip to emit a Brilliant Red color. The encapsulating resin is water clear.
• SYG: Utilizes an AlGaInP chip to emit a Brilliant Yellow Green color. The encapsulating resin is water clear.

2.2 Absolute Maximum Ratings

Stresses beyond these limits may cause permanent damage. All values are specified at an ambient temperature (Ta) of 25°C.

2.3 Electro-Optical Characteristics

Typical performance parameters measured at Ta=25°C and I_F=20mA, unless otherwise noted.

3. Performance Curve Analysis

3.1 Forward Current vs. Forward Voltage (IV Curve)

The provided curves for both SUR (Red) and SYG (Yellow Green) variants show a typical diode characteristic. The forward voltage (V_F) exhibits a positive temperature coefficient, meaning it decreases slightly as the ambient temperature increases. At the typical operating current of 20mA, V_F is approximately 2.0V, with a maximum specified value of 2.4V. This relatively low forward voltage is beneficial for battery-operated applications.

3.2 Relative Luminous Intensity vs. Forward Current

The light output (luminous intensity) increases with forward current. The curves are generally linear in the normal operating range but will saturate at higher currents. Operating beyond the absolute maximum rating of 25mA continuous current is not recommended, as it can lead to accelerated degradation and reduced lifetime. The pulsed current rating (60mA at 1/10 duty cycle) allows for brief periods of higher brightness.

3.3 Relative Luminous Intensity vs. Ambient Temperature

Like most LEDs, the luminous output of this device is temperature-dependent. The intensity decreases as the ambient temperature rises. The derating curve is crucial for design, especially in applications with high ambient temperatures or poor thermal management. The curve shows the permissible forward current must be reduced as temperature increases to stay within the power dissipation limits and ensure reliability.

3.4 Spectrum Distribution

The spectral plots confirm the monochromatic nature of the AlGaInP chips. The SUR variant has a dominant wavelength centered around 624nm (red), while the SYG variant is centered around 573nm (yellow-green). The spectral bandwidth (FWHM) is approximately 20nm for both, indicating good color purity.

3.5 Radiation Pattern

The polar diagram illustrates a wide, lambertian-like emission pattern with a typical half-intensity angle (2θ_1/2) of 130°. The integrated reflector helps shape this beam, providing a consistent viewing angle suitable for indicator applications where visibility from a wide range is important.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The SMD package has a compact footprint. Key dimensions include a body size of approximately 3.2mm x 2.8mm, with a height of about 1.9mm. The cathode is typically identified by a visual marker such as a notch or a green tint on the package. Detailed dimensional drawings with tolerances (generally ±0.1mm) are provided in the datasheet for PCB land pattern design.

4.2 Reel and Tape Packaging

The components are supplied in embossed carrier tape with a width of 12mm, wound onto 7-inch (178mm) diameter reels. Each reel contains 1000 pieces. The carrier tape dimensions (pocket size, pitch, etc.) are standardized to ensure compatibility with automated assembly equipment. The packaging includes moisture-resistant measures such as a desiccant and an aluminum moisture-proof bag to protect the components during storage and transport, especially important for non-hermetic SMD packages.

4.3 Label and Binning System Explanation

The label on the reel provides critical ordering and traceability information. More importantly, it indicates the device's performance binning:

• CAT (Luminous Intensity Rank): This code specifies the minimum luminous intensity bin for the LEDs on the reel, ensuring brightness consistency within a production batch.
• HUE (Dominant Wavelength Rank): This code specifies the wavelength bin, ensuring color consistency. This is particularly important for applications where multiple LEDs are used adjacent to each other.
• REF (Forward Voltage Rank): This code specifies the forward voltage bin, which can be useful for designs requiring tight current matching in parallel strings or specific driver voltage requirements.

5. Soldering and Assembly Guidelines

5.1 Reflow Soldering Profile

The device is rated for lead-free reflow soldering processes. The maximum recommended soldering temperature is 260°C at the package terminals, with the total time above 217°C not exceeding 60 seconds. A typical reflow profile with preheat, soak, reflow, and cooling stages should be followed. The use of infrared or vapor phase reflow is specified as compatible.

5.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken. The iron tip temperature should not exceed 350°C, and the contact time with any lead should be limited to 3 seconds or less. A heat sink may be used on the lead between the joint and the package body.

5.3 Storage and Handling

Components should be stored in their original, unopened moisture-barrier bags at conditions within the specified storage temperature range (-40°C to +100°C). Once the bag is opened, components should be used within a specified time frame (typically 168 hours at factory conditions) or rebaked according to the manufacturer's moisture sensitivity level (MSL) instructions to prevent "popcorning" during reflow.

6. Application Suggestions and Design Considerations

6.1 Current Limiting

An LED is a current-driven device. A series current-limiting resistor is mandatory when driving from a voltage source. The resistor value can be calculated using Ohm's Law: R = (V_source - V_F) / I_F. Always use the maximum V_F from the datasheet (2.4V) for a robust design to ensure the current does not exceed limits even with part-to-part variation.

6.2 Thermal Management

While the power dissipation is low (60mW max), effective thermal management on the PCB improves longevity and maintains brightness. Ensure the PCB land pattern has adequate thermal relief and, if possible, connect the thermal pad (if present) to a ground plane for heat sinking. Avoid operating at maximum current and temperature simultaneously.

6.3 ESD Precautions

Although the device has a 2000V HBM ESD rating, standard ESD handling precautions should be observed during assembly and handling to prevent latent damage.

6.4 Optical Design

The wide 130° viewing angle makes this LED suitable for direct viewing without secondary optics in many indicator applications. For backlighting, light guides or diffusers may be used to achieve uniform illumination. The reflector cup helps to minimize side emissions and direct light forward.

7. Technical Comparison and Differentiation

This LED family differentiates itself through several key features:

• Chip Technology: The use of AlGaInP semiconductor material provides high efficiency and excellent color saturation for red and yellow-green emissions compared to older technologies like GaAsP.
• Integrated Reflector: The built-in reflector cup enhances forward light output and provides a well-defined beam pattern without the need for an external component, saving space and cost.
• Robust Packaging: The package is designed for high-reliability soldering processes (lead-free reflow) and includes moisture protection, making it suitable for modern electronics manufacturing.
• Comprehensive Binning: The three-parameter binning (Intensity, Wavelength, Voltage) allows designers to select parts with tight performance tolerances for applications requiring consistency.

8. Frequently Asked Questions (Based on Technical Parameters)

8.1 What is the difference between peak wavelength and dominant wavelength?

Peak wavelength (λ_p) is the wavelength at which the spectral power distribution is maximum. Dominant wavelength (λ_d) is the single wavelength of monochromatic light that matches the perceived color of the LED. For LEDs with a symmetric spectrum, they are close. For designers, dominant wavelength is more relevant for color matching.

8.2 Can I drive this LED at 30mA for higher brightness?

No. The Absolute Maximum Rating for continuous forward current (I_F) is 25mA. Operating at 30mA exceeds this rating, which can cause irreversible damage, significantly reduce operational lifetime, and void reliability guarantees. For higher brightness, select an LED rated for a higher current or use the pulsed mode (60mA max at 1/10 duty cycle) if the application allows.

8.3 Why is the luminous intensity given as a minimum/typical value instead of a strict range?

Due to variations in the semiconductor manufacturing process, LED performance is binned. The datasheet provides a "Typical" value as a common reference. The actual guaranteed minimum for a specific order is defined by the CAT (Intensity Rank) code on the reel label. Engineers should design based on the minimum intensity of the bin they specify.

8.4 How critical is the HUE binning for my application?

It depends. For a single indicator LED, HUE binning may not be critical. However, if multiple LEDs are used next to each other in a panel, array, or backlight, noticeable color differences ("color binning") can occur if parts from different HUE bins are mixed. For such applications, specifying a tight HUE bin or ordering a full reel from the same batch is essential.

9. Practical Design and Usage Examples

9.1 Example 1: Status Indicator for a Consumer Device

Scenario: A power button indicator for a wireless speaker.
Design: Use the SYG (Yellow Green) variant for a neutral "power-on" indication. Drive it at 15mA (below the 20mA typical) using a 3.3V supply and a series resistor: R = (3.3V - 2.0V) / 0.015A ≈ 87Ω (use 82Ω or 100Ω standard value). This provides ample brightness while maximizing battery life and device longevity. The wide viewing angle ensures visibility from various angles.

9.2 Example 2: Backlighting for Membrane Switch Legends

Scenario: Illuminating symbols on a control panel.
Design: Use multiple SUR (Red) LEDs placed around the perimeter of the panel, facing inwards towards a light guide layer. The wide viewing angle helps couple light into the guide. Due to potential temperature rise inside the enclosure, consult the forward current derating curve. It may be prudent to drive the LEDs at 18-20mA instead of the full 25mA to ensure reliable operation over the product's lifetime. Uniformity can be improved by selecting LEDs from the same CAT and HUE bins.

10. Technical Principles and Trends

10.1 Operating Principle

This LED is based on a semiconductor p-n junction made from Aluminum Gallium Indium Phosphide (AlGaInP). When a forward voltage is applied, electrons and holes are injected into the active region where they recombine. The energy released during this recombination is emitted as photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—red and yellow-green in this case. The epoxy resin encapsulant protects the chip, acts as a lens to shape the light output, and contains phosphors if needed (not for these monochromatic types). The reflector cup, typically made of a highly reflective plastic or coated material, surrounds the chip to redirect side-emitted light forward, increasing the useful luminous intensity in the intended viewing direction.

10.2 Industry Trends

The development of SMD LEDs like this one follows several key industry trends:

• Miniaturization & Integration: Continuous reduction in package size while maintaining or improving light output. The integration of features like reflectors and electrostatic protection within the package is standard.
• Higher Efficiency: Ongoing improvements in internal quantum efficiency (IQE) and light extraction efficiency lead to higher luminous efficacy (more light per electrical watt), reducing power consumption and thermal load.
• Enhanced Reliability: Improvements in packaging materials (epoxy, silicone) and die attach technologies increase resistance to thermal cycling, moisture, and other environmental stresses, leading to longer operational lifetimes (often rated at L70/B50 for 50,000 hours or more).
• Standardization and Automation: Packaging (like the 12mm tape on 7" reel) and footprints are highly standardized to streamline automated assembly, reducing manufacturing costs.
• Focus on Color Consistency: Tighter binning tolerances for wavelength (HUE) and intensity (CAT) are increasingly demanded for applications in consumer electronics and displays where visual uniformity is critical.

This component represents a mature, reliable, and cost-effective solution within this evolving landscape, suitable for a vast array of mainstream indicator and backlighting applications.