ALFS1H-C010001H-AM LED Datasheet - SMD Ceramic Package - 450lm @ 1000mA - 3.3V - 120° Viewing Angle - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, surface-mount LED designed for demanding automotive lighting applications. The device is housed in a robust ceramic package, offering superior thermal management and reliability. Its primary design focus is on exterior automotive lighting systems where consistent performance, long life, and resilience to harsh environmental conditions are paramount.

1.1 Core Advantages

The LED offers several key advantages for automotive design engineers:

• High Luminous Output: Delivers a typical luminous flux of 450 lumens at a drive current of 1000mA, enabling bright and efficient light sources.
• Wide Viewing Angle: Features a 120-degree viewing angle, providing excellent spatial light distribution suitable for various lighting functions.
• Automotive Grade Reliability: Qualified according to the AEC-Q102 standard, ensuring it meets the stringent quality and reliability requirements for automotive electronic components.
• Environmental Robustness: Demonstrates high resistance to electrostatic discharge (ESD up to 8kV HBM) and sulfur corrosion (Class A1), critical for long-term operation in automotive environments.
• Compliance: The product is compliant with RoHS, REACH, and Halogen-Free directives, supporting global environmental regulations.

1.2 Target Market & Applications

This LED is specifically targeted at the automotive exterior lighting market. Its performance characteristics make it ideal for several key applications:

• Headlamps: Can be used in high-beam, low-beam, or adaptive driving beam systems.
• Daytime Running Lights (DRL): Provides high visibility and distinctive styling.
• Fog Lamps: Offers robust performance in adverse weather conditions.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Photometric & Electrical Characteristics

The core performance is defined under a test condition of IF=1000mA, with the thermal pad held at 25°C.

• Luminous Flux (Φv): The typical value is 450 lm, with a minimum of 400 lm and a maximum of 500 lm. An ±8% measurement tolerance applies. This parameter is highly dependent on junction temperature.
• Forward Voltage (VF): Typically 3.30V, ranging from 2.90V to 3.80V at 1000mA. The ±0.05V measurement tolerance is important for precise power supply design and binning consistency.
• Forward Current (IF): The device is rated for a continuous forward current up to 1500mA absolute maximum, with a typical operating point of 1000mA. Operation below 50mA is not recommended.
• Viewing Angle (φ): The nominal 120° angle has a tolerance of ±5°. This defines the angular spread where luminous intensity is at least half of its peak value.
• Correlated Color Temperature (CCT): The color temperature range is specified from 5391K to 6893K, classifying it as a cool white LED.

2.2 Thermal Characteristics

Effective thermal management is crucial for maintaining performance and longevity.

• Thermal Resistance (Rth JS): Two values are given: a "real" thermal resistance (junction to solder point) of 4.4 K/W max, and an "electrical" equivalent of 3.4 K/W max. The lower electrical value is typically used for junction temperature estimation in circuit simulations. This low resistance is enabled by the ceramic package.
• Junction Temperature (TJ): The maximum allowable junction temperature is 150°C.
• Operating & Storage Temperature: The device can operate and be stored within a wide temperature range of -40°C to +125°C.

2.3 Absolute Maximum Ratings

Stresses beyond these limits may cause permanent damage.

• Power Dissipation (Pd): 5700 mW maximum.
• Reverse Voltage (VR): The device is not designed for reverse bias operation.
• ESD Sensitivity (HBM): Withstands up to 8 kV, which is robust for automotive applications.
• Reflow Soldering Temperature: Can withstand a peak temperature of 260°C during assembly.

3. Binning System Explanation

The LED is sorted into bins based on key performance parameters to ensure consistency within a production lot.

3.1 Luminous Flux Binning

Luminous flux is grouped under "Group C" with four bins (6, 7, 8, 9). For example, Bin 7 covers a flux range from 425 lm to 450 lm. This allows designers to select LEDs based on the required brightness level.

3.2 Forward Voltage Binning

Forward voltage is binned into three codes: 1A (2.90V-3.20V), 1B (3.20V-3.50V), and 1C (3.50V-3.80V). Matching VF bins in an array helps achieve uniform current distribution when LEDs are connected in parallel.

3.3 Color Coordinate Binning

The cool white LEDs are binned on the CIE 1931 chromaticity diagram. Multiple bins are defined (e.g., 63M, 61M, 58M, 56M, 65L, 65H, 61L, 61H), each representing a small quadrilateral area on the x,y color space. A tight tolerance of ±0.005 ensures minimal color variation within a bin. The bin structure diagram shows the specific coordinate boundaries for each bin.

4. Performance Curve Analysis

The graphs provide critical insight into the LED's behavior under varying operating conditions.

4.1 Spectral Distribution & Radiation Pattern

The Relative Spectral Distribution graph shows a peak in the blue wavelength region, typical for a phosphor-converted white LED. The Typical Diagram Characteristics of Radiation illustrates the spatial intensity distribution, confirming the 120° viewing angle where intensity falls to 50% of the peak.

4.2 Current vs. Voltage (I-V) and Efficacy

The Forward Current vs. Forward Voltage curve is non-linear, showing the typical exponential relationship for a diode. The Relative Luminous Flux vs. Forward Current curve shows that light output increases with current but may exhibit saturation or efficiency droop at very high currents (beyond 1000mA).

4.3 Temperature Dependence

The graphs clearly show the significant impact of temperature:

• Relative Forward Voltage vs. Junction Temperature: Forward voltage decreases linearly with increasing temperature (negative temperature coefficient), which can be used for junction temperature monitoring.
• Relative Luminous Flux vs. Junction Temperature: Light output decreases as temperature rises. Maintaining a low junction temperature is essential for stable light output.
• Chromaticity Shift vs. Junction Temperature: The color coordinates (CIE x, y) shift with temperature, which is important for applications requiring stable color points.
• Chromaticity Shift vs. Forward Current: Color also shifts slightly with drive current, emphasizing the need for constant current drivers.

4.4 Forward Current Derating Curve

This is a crucial graph for thermal design. It plots the maximum allowable forward current against the solder pad temperature (Ts). As Ts increases, the maximum permissible current must be reduced to prevent exceeding the 150°C junction temperature limit. For example, at Ts=125°C, the maximum current is 1200mA; at Ts=110°C, it is 1500mA.

5. Mechanical & Package Information

The SMD ceramic package provides mechanical stability and excellent thermal conduction.

5.1 Mechanical Dimensions

The datasheet includes a detailed mechanical drawing (Section 7) specifying the package's length, width, height, lead spacing, and tolerances. This information is vital for PCB footprint design and assembly clearance checks.

5.2 Recommended Soldering Pad Layout

Section 8 provides the recommended PCB land pattern (pad geometry and dimensions) to ensure reliable solder joint formation during reflow soldering and to optimize heat transfer from the LED's thermal pad to the PCB.

5.3 Polarity Identification

The mechanical drawing indicates the anode and cathode terminals. Correct polarity must be observed during assembly to prevent damage.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

Section 9 specifies the recommended reflow soldering temperature profile. The profile includes preheat, soak, reflow, and cooling stages, with a peak temperature not exceeding 260°C. Adhering to this profile prevents thermal shock and ensures reliable solder connections.

6.2 Precautions for Use

General handling and application notes are provided (Section 11), covering topics such as avoiding mechanical stress on the lens, preventing contamination, and ensuring proper ESD precautions during handling.

6.3 Storage Conditions

The device should be stored within the specified temperature range (-40°C to +125°C) and in a moisture-controlled environment. The Moisture Sensitivity Level (MSL) is rated at Level 2.

7. Packaging & Ordering Information

7.1 Packaging Information

Details on how the LEDs are supplied are found in Section 10. This typically includes the reel type, tape width, pocket dimensions, and orientation of components on the reel for automated pick-and-place machines.

7.2 Part Number & Ordering Information

Sections 5 and 6 detail the part number structure and ordering codes. The full part number "ALFS1H-C010001H-AM" encodes specific information such as the product series, flux bin, voltage bin, and color bin. Understanding this nomenclature is essential for procuring the exact device with the desired performance characteristics.

8. Application Design Suggestions

8.1 Typical Application Circuits

This LED requires a constant current driver for stable operation. The driver should be designed to provide the required current (e.g., 1000mA) while accommodating the forward voltage range of the selected bin. Thermal management is critical; the PCB should have a sufficient copper area or thermal via array under the LED's thermal pad to dissipate heat effectively, keeping the junction temperature as low as possible.

8.2 Design Considerations

• Thermal Design: Use the derating curve and thermal resistance to calculate the necessary heatsinking. The low Rth JS is an advantage but does not eliminate the need for a good thermal path to the ambient.
• Optical Design: The 120° viewing angle may require secondary optics (lenses, reflectors) to shape the beam for specific applications like headlamps.
• Electrical Design: Consider the forward voltage binning when designing for parallel strings to ensure current balance. Implement reverse polarity protection on the board.
• Reliability: The AEC-Q102 and sulfur robustness qualifications are key for automotive use, but the application's specific environmental tests (vibration, thermal cycling) must still be validated.

9. Technical Comparison & Differentiation

While a direct competitor comparison is not provided in the datasheet, key differentiators of this product can be inferred:

• Ceramic vs. Plastic Package: The ceramic package offers superior thermal conductivity and long-term reliability compared to standard plastic SMD packages, especially under high power and high temperature conditions.
• Automotive Focus: Full AEC-Q102 qualification and sulfur resistance (Class A1) are not always present in general-purpose high-power LEDs, making this device specifically suited for the harsh automotive environment.
• Performance Balance: The combination of high flux (450lm), relatively wide viewing angle (120°), and robust construction presents a balanced solution for exterior lighting.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 1500mA continuously?
A: Only if the solder pad temperature (Ts) is maintained at or below 110°C, as per the derating curve. At higher ambient temperatures, the current must be reduced (e.g., to 1200mA at Ts=125°C) to avoid exceeding the maximum junction temperature.

Q: What is the difference between Rth JS real and Rth JS el?
A: Rth JS real is the measured thermal resistance from the junction to the solder point. Rth JS el is an electrically derived equivalent value, often lower, which is commonly used in SPICE models for temperature simulation. For practical thermal design, the "real" value (4.4 K/W max) should be used for conservative calculations.

Q: How important is bin selection for my application?
A: Critical for consistency. For applications with multiple LEDs (e.g., a DRL strip), specifying the same flux, voltage, and color bin ensures uniform brightness, color, and electrical behavior across all units.

Q: Is a heatsink required?
A> Yes, absolutely. Despite the low package thermal resistance, the total power dissipation (up to ~3.3W at 1000mA) necessitates an effective thermal management system, usually involving a thermally enhanced PCB and possibly an external heatsink, to maintain performance and longevity.

11. Practical Design Case Study

Scenario: Designing a Daytime Running Light (DRL) module.
A designer selects this LED for its brightness and automotive-grade reliability. They choose Bin 7 for flux (425-450lm) and Bin 1B for voltage (3.20-3.50V) to ensure good yield. The module uses 6 LEDs in series. The driver is specified for 1000mA constant current with an output voltage range covering 6 * VF_max (approx. 21V). The PCB is a 2oz copper board with a large exposed pad area connected to an internal ground plane for heat spreading. Thermal vias under the LED pad transfer heat to the back side of the PCB, which is attached to the metal housing of the vehicle. Using the derating curve and estimating the thermal resistance of the system, the designer confirms the junction temperature will remain below 110°C in the worst-case ambient temperature, allowing the LEDs to be driven at the full 1000mA.

12. Operating Principle

This is a phosphor-converted white LED. The core is a semiconductor chip (typically based on InGaN) that emits blue light when forward biased (electroluminescence). This blue light strikes a phosphor layer deposited on or around the chip. The phosphor absorbs a portion of the blue light and re-emits it as a broader spectrum of longer wavelengths (yellow, red). The mixture of the remaining blue light and the phosphor-converted yellow/red light is perceived by the human eye as white light. The specific blend of phosphors determines the correlated color temperature (CCT), which for this device is in the cool white range (5391K-6893K).

13. Technology Trends

The automotive LED lighting market continues to evolve with clear trends:

• Increased Efficiency (lm/W): Ongoing improvements in chip technology and phosphor efficiency lead to higher luminous efficacy, allowing for brighter lights or lower power consumption.
• Higher Power Density: Devices are being developed to deliver more light from smaller packages, enabling more compact and stylized lamp designs.
• Advanced Functionality: Integration of control electronics (e.g., for adaptive beam patterning) directly with LED packages is an area of development.
• Color Tuning & Quality: There is a focus on improving color rendering index (CRI) and enabling dynamic color temperature adjustment, especially for interior lighting.
• Standardization & Reliability: Adherence to standards like AEC-Q102 becomes even more critical as LEDs penetrate safety-critical applications like headlights. Testing for novel stress factors (like laser light from LIDAR systems) may emerge.