ALFS2H-C010001H-AM LED Datasheet - SMD Ceramic Package - 900lm @ 1000mA - 6.6V Typ. - 120° Viewing Angle - Automotive Grade

1. Product Overview

The ALFS2H-C010001H-AM is a high-power, surface-mount LED designed specifically for demanding automotive exterior lighting applications. It is housed in a robust ceramic package, offering excellent thermal management and reliability under harsh environmental conditions. The device delivers a typical luminous flux of 900 lumens when driven at a forward current of 1000mA, making it suitable for high-intensity lighting functions.

Its core advantages include compliance with the stringent AEC-Q102 qualification standard for automotive discrete optoelectronic devices, ensuring performance and longevity in automotive environments. It also features sulfur robustness (Class A1), making it resistant to corrosive atmospheres, and meets key environmental regulations including RoHS, REACH, and halogen-free requirements.

The primary target market is the automotive industry, specifically for exterior lighting modules where high brightness, reliability, and compact form factor are critical.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The key operating parameters are defined under a standard test condition of a forward current (I_F) of 1000mA. The typical luminous flux (Φ_v) is 900 lm, with a specified minimum of 800 lm and a maximum of 1000 lm, subject to a measurement tolerance of ±8%. The typical forward voltage (V_F) is 6.60V, ranging from a minimum of 5.80V to a maximum of 7.60V, with a measurement tolerance of ±0.05V. The viewing angle is a wide 120 degrees, providing a broad emission pattern suitable for various lighting optics.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. The absolute maximum forward current is 1500 mA. The maximum power dissipation is 11.4 W. The device can operate and be stored within a temperature range of -40°C to +125°C, with a maximum junction temperature (T_J) of 150°C. It is not designed for reverse voltage operation. The ESD sensitivity (Human Body Model) is rated up to 8 kV, and the maximum soldering temperature during reflow is 260°C.

2.3 Thermal Characteristics

Effective thermal management is crucial for LED performance and lifetime. The thermal resistance from the junction to the solder point (R_{th JS}) is specified in two ways: the real thermal resistance has a typical value of 3.1 K/W (max 3.5 K/W), while the electrical method yields a typical value of 2.1 K/W (max 2.5 K/W). This parameter is critical for calculating the junction temperature during operation and designing an appropriate heatsink.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted into bins based on key performance parameters.

3.1 Luminous Flux Binning

Luminous flux is binned within Group D. The available bins are: D6 (800-850 lm), D7 (850-900 lm), D8 (900-950 lm), and D9 (950-1000 lm). This allows designers to select LEDs with a specific brightness range for their application.

3.2 Forward Voltage Binning

Forward voltage is binned to aid in driver design and current matching in multi-LED arrays. The bins are: 2A (5.80V - 6.40V), 2B (6.40V - 7.00V), and 2C (7.00V - 7.60V).

3.3 Color (Chromaticity) Binning

The LED is offered in cool white color temperatures. The datasheet provides a chromaticity diagram with specific bin coordinates defined by their CIE x and y values. Example bins include 63M, 61M, 58M, 56M, 65L, 65H, 61L, and 61H, each covering a small, defined area on the CIE 1931 color space to ensure color consistency. The measurement tolerance for color coordinates is ±0.005.

4. Performance Curve Analysis

The datasheet includes several graphs that illustrate the device's behavior under different operating conditions.

4.1 Wavelength Characteristics

The relative spectral distribution graph shows the emission spectrum of the LED, peaking in the blue region and utilizing a phosphor to produce white light. The shape of this curve determines the Color Rendering Index (CRI) and the correlated color temperature (CCT).

4.2 Forward Current vs. Forward Voltage (IV Curve)

This graph shows the exponential relationship between forward current and forward voltage. It is essential for selecting the appropriate driver topology (constant current vs. constant voltage) and for understanding the dynamic resistance of the LED.

4.3 Relative Luminous Flux vs. Forward Current

This curve demonstrates that light output increases with current but not linearly. It helps in determining the optimal drive current for balancing efficiency and light output.

4.4 Temperature Dependency Graphs

Several graphs show the impact of temperature on performance:

• Relative Forward Voltage vs. Junction Temperature: Forward voltage typically decreases as temperature increases, which can be used for indirect temperature monitoring.
• Relative Luminous Flux vs. Junction Temperature: Light output decreases as the junction temperature rises, highlighting the importance of thermal management.
• Chromaticity Shift vs. Junction Temperature: The color coordinates (CIE x, y) shift with temperature, which is critical for applications requiring stable color output.
• Chromaticity Shift vs. Forward Current: Color can also shift slightly with drive current.

4.5 Forward Current Derating Curve

This is one of the most critical graphs for reliable design. It shows the maximum allowable forward current as a function of the solder pad temperature (T_S). For example, at a pad temperature of 110°C, the maximum current is 1500mA, but at 125°C, it derates to 1200mA. The device should not be operated below 50mA. This curve is vital for ensuring the junction temperature does not exceed its maximum rating under all operating conditions.

5. Mechanical and Package Information

The LED uses a Surface-Mount Device (SMD) ceramic package. While the exact dimensions are not provided in the excerpt, the datasheet includes a dedicated \"Mechanical Dimension\" section (Section 7) which would contain a detailed drawing with length, width, height, and lead/pad positions. Ceramic packages offer superior thermal conductivity compared to plastic, aiding in heat dissipation from the LED chip.

6. Soldering and Assembly Guidelines

6.1 Recommended Soldering Pad

Section 8 provides a recommended land pattern (footprint) for PCB design. Following this recommendation ensures proper solder joint formation, good thermal connection to the PCB for heat sinking, and prevents tombstoning or other assembly defects.

6.2 Reflow Soldering Profile

Section 9 details the recommended reflow soldering temperature profile. Adhering to this profile, with a peak temperature not exceeding 260°C as per the absolute maximum ratings, is crucial to prevent damage to the LED package, internal die, or wire bonds. The profile typically includes preheat, soak, reflow, and cooling stages with specific time and temperature constraints.

7. Packaging and Ordering Information

Section 10 (Packaging Information) details how the LEDs are supplied, likely in tape-and-reel format suitable for automated pick-and-place assembly machines. Section 6 (Ordering Information) and Section 5 (Part Number) explain the part number structure, which likely encodes information such as flux bin, voltage bin, and color bin, allowing precise selection of device characteristics.

8. Application Recommendations

8.1 Typical Application Scenarios

As listed, this LED is designed for Automotive Exterior Lighting, including:

• Headlamp: Can be used in low-beam, high-beam, or adaptive driving beam systems, often in arrays.
• Daytime Running Light (DRL): Requires high visibility and reliability.
• Fog Lamp: Demands robust performance in moist and corrosive conditions.

8.2 Design Considerations

• Thermal Design: The high power dissipation necessitates an effective thermal path from the solder pads to a heatsink. PCB material (e.g., metal-core PCB), copper area, and possible external heatsinks must be carefully designed based on the thermal resistance (R_{th JS}) and the derating curve.
• Electrical Design: A constant-current driver is mandatory for stable operation. The driver must be capable of supplying up to 1500mA and withstand the forward voltage range of the selected bin. Consider inrush current protection.
• Optical Design: The 120° viewing angle requires secondary optics (lenses, reflectors) to shape the beam for specific applications like headlamps or DRLs.
• Environmental Robustness: While the LED itself is sulfur-resistant and qualified to AEC-Q102, the entire module (PCB, connectors, seals) must be designed for automotive environmental stresses (thermal cycling, humidity, vibration).

9. Technical Comparison and Differentiation

Compared to standard commercial-grade LEDs, the ALFS2H-C010001H-AM's key differentiators are its automotive-grade qualification (AEC-Q102) and sulfur robustness (Class A1). These are not typically required for consumer electronics but are essential for the harsh under-hood and exterior automotive environment. The ceramic package also offers better long-term reliability and higher maximum junction temperature compared to many plastic SMD packages used in non-automotive high-power LEDs.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the minimum drive current for this LED?
A: The datasheet specifies a minimum forward current of 50mA. Operation below this current is not recommended (as noted on the derating curve).

Q: How do I determine the junction temperature in my application?
A: The junction temperature (T_J) can be estimated using the formula: T_J = T_S + (R_{th JS} × P_D), where T_S is the measured solder pad temperature, R_{th JS} is the thermal resistance, and P_D is the power dissipation (V_F × I_F).

Q: Can I drive this LED with a constant voltage source?
A: No. LEDs are current-driven devices. A constant voltage source would lead to uncontrolled current due to the exponential IV characteristic and negative temperature coefficient of V_F, likely destroying the LED. Always use a constant-current driver.

Q: What does \"Sulfur Robustness Class A1\" mean?
A: It indicates the LED's resistance to sulfur-containing atmospheres. Class A1 is a specific performance level defined in industry tests (e.g., ASTM B809) where the device shows no significant degradation after exposure, making it suitable for environments with high sulfur pollution.

11. Practical Design and Usage Case

Case: Designing a DRL Module
A designer is creating a Daytime Running Light module. They select the ALFS2H-C010001H-AM for its high brightness and automotive pedigree. They choose LEDs from flux bin D8 (900-950 lm) and voltage bin 2B (6.4-7.0V) to ensure consistent brightness and simplify driver design. They design a metal-core PCB with a large copper area acting as a heatsink. Using the derating curve, they calculate that with their thermal design, the solder pad will stabilize at 85°C in the hottest ambient condition. At this pad temperature, the derating curve allows the full 1000mA drive current. They select a constant-current driver rated for 1000mA output and a voltage compliance range that covers the maximum V_F of their selected bin plus headroom. Secondary optics are designed to meet the specific beam pattern and photometric requirements for DRLs.

12. Operating Principle Introduction

This LED is a solid-state light source based on a semiconductor chip, typically made of indium gallium nitride (InGaN) for the blue-emitting region. When a forward voltage exceeding the diode's bandgap is applied, electrons and holes recombine within the active region, releasing energy in the form of photons (light) - a process called electroluminescence. The primary emission is in the blue spectrum. To create white light, a portion of this blue light is absorbed by a phosphor coating (e.g., YAG:Ce) which re-emits light across a broader spectrum, predominantly in the yellow range. The mixture of the remaining blue light and the phosphor-converted yellow light is perceived as white light by the human eye. The exact ratio of blue to yellow determines the correlated color temperature (CCT).

13. Technology Trends

The trend in automotive LED lighting is towards higher luminous efficacy (more lumens per watt), enabling brighter lights or lower power consumption and thermal load. There is also a push for smaller package sizes with higher power density, requiring ever-better thermal management solutions. Advanced functionalities like adaptive driving beams (ADB) and pixelated headlights are driving the integration of multiple individually addressable LED chips within a single package. Furthermore, color-tunable LEDs and lasers are being explored for specialized signaling and styling applications. The underlying technology continues to improve in terms of chip efficiency, phosphor stability at high temperatures, and package reliability.