T5C Series 5050 White LED Datasheet - Dimensions 5.0x5.0x1.9mm - Voltage 9.5V - Power 3.8W - English Technical Document

1. Product Overview

The T5C series represents a high-performance, top-view white LED designed for demanding general lighting applications. This device utilizes a thermally enhanced package design to manage heat effectively, enabling high luminous flux output and reliable operation under high current conditions. Its compact 5050 footprint (5.0mm x 5.0mm) makes it suitable for space-constrained designs while offering a wide 120-degree viewing angle for uniform light distribution.

Key advantages of this series include its high current capability, which allows for significant light output, and its compatibility with Pb-free reflow soldering processes, ensuring compliance with modern environmental standards. The product is designed to remain within RoHS compliant specifications.

2. Technical Parameter Deep Dive

2.1 Electro-Optical Characteristics

The primary performance metrics are defined at a junction temperature (Tj) of 25°C and a forward current (IF) of 400mA. The luminous flux varies with Correlated Color Temperature (CCT) and Color Rendering Index (Ra). For instance, a 4000K LED with Ra70 typically delivers 600 lumens (min. 550 lm), while an Ra90 version provides 485 lumens (min. 450 lm). The luminous flux measurement tolerance is ±7%, and the Ra tolerance is ±2.

2.2 Electrical and Thermal Parameters

The absolute maximum ratings define the operational limits: a continuous forward current (IF) of 480mA, a pulse forward current (IFP) of 720mA (pulse width ≤100μs, duty cycle ≤1/10), and a maximum power dissipation (PD) of 5040mW. The junction temperature must not exceed 120°C.

Under typical operating conditions (IF=400mA, Tj=25°C), the forward voltage (VF) ranges from 8.0V to 10.5V, with a typical value of 9.5V (±3% tolerance). The thermal resistance from the junction to the solder point (Rth j-sp) is typically 2.5°C/W, which is critical for thermal management design. The device also features an electrostatic discharge (ESD) withstand capability of 1000V (Human Body Model).

3. Binning System Explanation

3.1 Luminous Flux and CCT/CRI Binning

The LEDs are sorted into bins based on luminous flux output, CCT, and CRI to ensure color and brightness consistency. For example, a 4000K LED with Ra80 (code 82) is available in flux bins: GL (500-550 lm), GM (550-600 lm), and GN (600-650 lm). Each bin has defined minimum and maximum values.

3.2 Forward Voltage Binning

To aid in circuit design, LEDs are also binned by forward voltage. The available bins are: 1C (8-9V), 1D (9-10V), and 5X (10-12V), all measured at IF=400mA and Tj=25°C with a ±3% tolerance.

3.3 Chromaticity Binning

The color consistency is guaranteed by sorting LEDs into chromaticity ranges defined by a 5-step MacAdam ellipse. Center coordinates (x, y) and ellipse parameters (a, b, Φ) are specified for each CCT code (e.g., 27R5 for 2700K, 40R5 for 4000K). Energy Star binning standards are applied to all products within the 2600K to 7000K range. The tolerance for chromaticity coordinates is ±0.005.

4. Performance Curve Analysis

The datasheet includes several key graphs for design analysis. The Relative Luminous Flux vs. Forward Current (IF) curve shows how light output changes with drive current. The Forward Voltage vs. Forward Current graph is essential for designing the driver circuit. The Viewing Angle Distribution diagram illustrates the Lambertian-like emission pattern, confirming the wide 120-degree viewing angle.

Temperature dependency is shown in curves for Relative Luminous Flux vs. Solder Point Temperature (Ts) and Forward Voltage vs. Ts. The CIE x, y coordinate shift vs. Ambient Temperature (Ta) graph is crucial for applications where color stability over temperature is important. Finally, the Maximum Forward Current vs. Ambient Temperature curve defines the derating requirements to ensure reliable operation.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a compact package size of 5.00mm x 5.00mm with a height of approximately 1.90mm. The bottom view shows the solder pad layout, which is designed for a 3-series, 2-parallel internal chip configuration. The cathode and anode are clearly marked. All dimensions have a tolerance of ±0.1mm unless otherwise specified.

5.2 Polarity Identification

The soldering pattern diagram clearly indicates the cathode and anode pads, which is vital for correct PCB layout and assembly to prevent reverse bias connection.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Profile

The device is suitable for reflow soldering. The recommended profile includes: a preheat from 150°C to 200°C over 60-120 seconds, a maximum ramp-up rate of 3°C/second to the peak temperature, and a liquidous temperature (TL) time (tL) that must be controlled. The peak soldering temperature can be 230°C or 260°C, held for a maximum of 10 seconds. Adherence to this profile is necessary to prevent thermal damage to the LED package.

7. Model Numbering System

The part number follows a structured format: T [X1][X2][X3][X4][X5][X6]-[X7][X8][X9][X10]. Key elements include: X1 (Type code, e.g., 5C for 5050), X2 (CCT code, e.g., 40 for 4000K), X3 (CRI code, e.g., 8 for Ra80), X4 (Number of serial chips), X5 (Number of parallel chips), and X6 (Component code). This system allows precise identification of the LED's electrical and optical characteristics.

8. Application Suggestions

8.1 Typical Application Scenarios

This high-power LED is ideal for interior lighting fixtures, retrofit lamps designed to replace traditional light sources, general illumination applications, and architectural or decorative lighting where both high output and compact size are required.

8.2 Design Considerations

Designers must pay close attention to thermal management due to the high power dissipation (up to 5.04W). Using an appropriate Metal Core PCB (MCPCB) or heatsink is mandatory to maintain the junction temperature within safe limits, ensuring long-term reliability and stable light output. The driver circuit must be designed to provide a stable current up to 480mA (continuous) and account for the forward voltage binning. The wide viewing angle should be considered in optical design for the desired beam pattern.

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, the T5C series offers significantly higher luminous flux per package due to its high-current capability and thermally enhanced design. The explicit binning for flux, voltage, and chromaticity within 5-step MacAdam ellipses provides superior color consistency and predictability for lighting manufacturers, reducing the need for secondary sorting. The package is designed for robust reflow soldering, supporting high-volume automated assembly.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the typical power consumption of this LED?
A: At the typical operating point of 400mA and 9.5V, the power consumption is approximately 3.8 Watts (P = I*V).

Q: How does the light output change with temperature?
A: The Relative Luminous Flux vs. Ts curve shows that light output decreases as the solder point temperature increases. Proper heatsinking is crucial to minimize this drop.

Q: Can I drive this LED with a constant voltage source?
A: It is not recommended. LEDs are current-driven devices. A constant current driver is required to ensure stable light output and prevent thermal runaway, as the forward voltage has a negative temperature coefficient and varies from unit to unit.

Q: What is the meaning of the 5-step MacAdam ellipse binning?
A: It means that all LEDs within a specific CCT bin (e.g., 4000K) will have chromaticity coordinates so similar that the color difference is imperceptible to the human eye under standard viewing conditions, ensuring uniform white light in an array.

11. Practical Design and Usage Case

Consider designing a high-bay LED light fixture for industrial use. Using multiple T5C LEDs arranged on a thermally optimized MCPCB, a designer can achieve high lumen output. By selecting LEDs from the same luminous flux bin (e.g., GM) and CCT/CRI bin (e.g., 40R5, 82), consistent brightness and color temperature across the fixture are guaranteed. The driver is selected to provide a constant current of 400mA per LED string, with the total number of LEDs in series determined by the driver's output voltage range and the forward voltage bin (e.g., 1D: 9-10V). The wide 120-degree viewing angle helps reduce the number of secondary optics needed for broad illumination.

12. Operating Principle Introduction

A white LED typically uses a semiconductor chip that emits blue light when forward biased (electroluminescence). This blue light then excites a phosphor coating deposited on or around the chip. The phosphor down-converts a portion of the blue light into longer wavelengths (yellow, red), and the mixture of the remaining blue light and the phosphor-emitted light is perceived as white by the human eye. The specific blend of phosphors determines the Correlated Color Temperature (CCT) and Color Rendering Index (CRI) of the emitted white light.

13. Technology Trends

The solid-state lighting industry continues to focus on increasing luminous efficacy (lumens per watt), improving color rendering quality (especially R9 for red tones), and enhancing reliability and lifetime. There is a trend towards higher power density packages like the 5050 format, which require advanced thermal management materials and designs. Furthermore, standardization of chromaticity and flux binning, as seen with the adoption of Energy Star and other standards, is crucial for ensuring product consistency and simplifying design for lighting manufacturers. The drive for smarter, connected lighting is also influencing LED driver technology towards greater programmability and integration.