LED Component Technical Datasheet - Revision 2 - Lifecycle Phase Documentation - Release Date 2014-12-05 - English Technical Document

1. Product Overview

This technical document provides comprehensive information regarding the lifecycle management and revision history of a specific LED component. The core focus is on the established revision control, ensuring traceability and consistency in component specifications over time. The document serves as a definitive reference for engineers, procurement specialists, and quality assurance personnel involved in the design, sourcing, and manufacturing of products utilizing this component. Its primary advantage lies in providing clear, version-controlled data, which is critical for maintaining product quality, reliability, and compliance in long-term production cycles.

The target market for this documentation includes industries requiring stable, long-lifecycle electronic components, such as automotive lighting, industrial control systems, signage, and general illumination applications where consistent performance and supply chain stability are paramount.

2. Lifecycle and Revision Management

2.1 Lifecycle Phase Definition

The component is currently in the Revision phase. This indicates that the product design and specifications have been finalized, released for production, and are now subject to controlled changes. A revision phase typically follows initial design release and precedes any potential end-of-life (EOL) or obsolete phases. It signifies a mature, stable product available for volume manufacturing.

2.2 Revision Control

The documented revision level for this component is Revision 2. This numerical identifier is crucial for tracking changes made to the product's specifications, materials, or manufacturing processes. Each revision increment implies a formal change has been implemented and documented. Engineers must ensure they are using the correct revision of the datasheet and component to guarantee that their designs align with the tested and qualified performance parameters.

2.3 Release and Validity Information

The official release date for Revision 2 of this document is 2014-12-05 at 13:11:36.0. This timestamp provides a precise point of reference for when this specific set of specifications became active. Furthermore, the document specifies an Expired Period: Forever. This is an unusual but critical notation, indicating that this revision of the datasheet does not have a predetermined expiration date. It will remain the valid reference indefinitely, or until a subsequent revision (e.g., Revision 3) is formally released and supersedes it. This "Forever" status underscores the component's intended longevity and stability in the market.

3. Technical Parameters and Specifications

While the provided PDF snippet focuses on administrative data, a complete technical datasheet for an LED component would contain the following sections. The values and specifics would be defined by the particular Revision 2 specifications.

3.1 Absolute Maximum Ratings

These parameters define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation.

• Reverse Voltage (V_R): The maximum allowable voltage applied in the reverse direction across the LED terminals.
• Forward Current (I_F): The maximum continuous forward current permissible.
• Peak Forward Current (I_FP): The maximum allowable surge or pulsed forward current, often specified with a duty cycle and pulse width.
• Power Dissipation (P_D): The maximum power the device can dissipate, typically calculated at a specific ambient temperature.
• Operating Temperature Range (T_opr): The range of ambient temperatures within which the device can be safely operated.
• Storage Temperature Range (T_stg): The range of temperatures within which the device can be safely stored without applied power.
• Soldering Temperature: The maximum temperature and duration the device can withstand during soldering processes (e.g., reflow or wave soldering).

3.2 Electro-Optical Characteristics

These parameters are measured under specified test conditions (typically I_F=20mA, T_a=25°C unless otherwise noted) and define the core performance of the LED.

• Forward Voltage (V_F): The voltage drop across the LED when a specified forward current is applied. It is typically binning into ranges (e.g., V_F1, V_F2, V_F3).
• Luminous Intensity (I_V) or Luminous Flux (Φ_v): The light output. For indicator LEDs, it's often given as millicandelas (mcd) at a specific viewing angle. For illumination LEDs, it's given in lumens (lm). This parameter is heavily binned.
• Dominant Wavelength (λ_D) or Chromaticity Coordinates (CIE x, y): Defines the perceived color of the LED. For white LEDs, the Correlated Color Temperature (CCT in Kelvin, e.g., 3000K, 5000K) and Color Rendering Index (CRI, Ra) are specified, both subject to binning.
• Viewing Angle (2θ_1/2): The angular span at which the luminous intensity is half of the peak intensity measured at 0 degrees.

3.3 Thermal Characteristics

• Thermal Resistance, Junction to Ambient (R_θJA): A measure of how effectively the package can transfer heat from the LED junction to the surrounding environment. A lower value indicates better thermal performance, which is critical for maintaining light output and longevity.

4. Binning System Explanation

Due to inherent variations in semiconductor manufacturing, LEDs are sorted (binned) based on key parameters to ensure consistency within a production lot. The binning criteria defined in Revision 2 are essential for design.

4.1 Wavelength / Color Temperature Binning

LEDs are grouped into specific wavelength ranges (for colored LEDs) or CCT ranges (for white LEDs). For example, white LEDs may be binned into 5000K ± 200K. Designers must select the appropriate bin to meet color consistency requirements for their application.

4.2 Luminous Flux / Intensity Binning

LEDs are sorted based on their light output at a standard test current. This allows designers to choose a brightness level and ensure uniformity across an array of LEDs.

4.3 Forward Voltage Binning

LEDs are grouped by their forward voltage drop. This is crucial for designing efficient driver circuits and ensuring consistent current distribution when multiple LEDs are connected in parallel.

5. Performance Curve Analysis

5.1 Current vs. Voltage (I-V) Characteristic Curve

This graph shows the relationship between forward current (I_F) and forward voltage (V_F). It is non-linear, exhibiting a threshold voltage (where conduction begins) after which the current increases rapidly with a small increase in voltage. Drivers must be current-regulated, not voltage-regulated, due to this characteristic.

5.2 Temperature Dependence

Graphs typically show how forward voltage decreases with increasing junction temperature, while luminous flux also decreases with rising temperature. Proper thermal management is critical to maintain performance and lifespan.

5.3 Spectral Power Distribution

For white LEDs, this curve shows the relative intensity across the visible spectrum. It helps in understanding the CCT and CRI. The presence and size of peaks from the blue pump LED and the phosphor conversion are visible.

6. Mechanical and Package Information

Detailed dimensional drawings (top view, side view, bottom view) with tolerances are provided. Key elements include:

• Package overall dimensions (Length, Width, Height).
• Pad layout and dimensions for PCB footprint design.
• Polarity identification mark (typically a cathode indicator, such as a notch, green dot, or shorter lead).
• Recommended PCB land pattern and stencil design.

7. Soldering and Assembly Guidelines

7.1 Reflow Soldering Profile

A recommended temperature vs. time profile is provided, including preheat, soak, reflow (peak temperature), and cooling zones. The maximum peak temperature (e.g., 260°C) and time above liquidus (TAL) are critical parameters to prevent thermal damage to the LED package or internal die attach.

7.2 Precautions

• Avoid applying mechanical stress to the LED lens.
• Use ESD precautions during handling.
• Do not clean with ultrasonic cleaners after soldering, as this can damage the package.
• Ensure the PCB is clean and free of ionic contamination.

7.3 Storage Conditions

Components should be stored in a dry, inert environment (typically <40°C and <60% relative humidity). If the moisture-sensitive devices are exposed to ambient air beyond their floor life, they must be baked before reflow to prevent "popcorning" (package cracking due to vapor pressure during soldering).

8. Packaging and Ordering Information

8.1 Packaging Specifications

Describes the tape and reel specifications (carrier tape width, pocket spacing, reel diameter, quantity per reel) or other packaging methods (e.g., tubes, trays).

8.2 Labeling and Part Numbering

Explains the information printed on the packaging labels, including part number, revision code, quantity, date code, and lot number. The part number structure itself encodes key attributes like color, brightness bin, voltage bin, and package type.

9. Application Notes and Design Considerations

9.1 Typical Application Circuits

Schematics for basic LED driving, typically using a series current-limiting resistor for low-power applications or constant-current drivers (linear or switching) for higher-power or precision applications. Considerations for series/parallel connections are discussed.

9.2 Thermal Management Design

Critical for high-power LEDs. Guidance on PCB layout (using thermal vias, large copper pads), heatsinking, and calculating the expected junction temperature based on drive current, ambient temperature, and thermal resistance.

9.3 Optical Design Considerations

Notes on the viewing angle, lens design for beam shaping, and potential interactions with secondary optics or light guides.

10. Technical Comparison and Differentiation

While direct competitor comparisons are not in a standard datasheet, the document's specified parameters (e.g., high luminous efficacy, low thermal resistance, tight color binning, robust ESD rating) implicitly define its competitive advantages. The "Forever" expiration period for Revision 2 is itself a significant differentiator, indicating long-term stability and supply commitment.

11. Frequently Asked Questions (FAQ)

Q: What does "Revision 2" mean for my existing designs using an older revision?
A: You must compare the Revision 2 datasheet with your previous version. If any electrical, optical, or mechanical specifications have changed, you may need to re-qualify your design or adjust circuit parameters (like driver current) to ensure continued performance and reliability.

Q: How should I interpret "Expired Period: Forever"?
A: It means this specific document revision has no planned obsolescence date. The specifications are fixed for the long term. However, the component itself may eventually reach an End-of-Life (EOL) phase, which would be communicated separately via a product change notice (PCN).

Q: Can I mix LEDs from different bins in the same product?
A: It is strongly discouraged. Mixing bins can lead to visible differences in color, brightness, or forward voltage, resulting in non-uniform appearance and potential current imbalance in parallel circuits. Always specify and use a single bin for a given production run.

12. Practical Use Cases

Case 1: Automotive Interior Lighting
A designer selects this LED for map reading lights. They use the tight CCT binning (e.g., 4000K ± 150K) to ensure a consistent white light color across all units in the vehicle. The robust temperature rating ensures operation in a hot car interior. The stable Revision 2 specification guarantees the same performance for replacement parts over the vehicle's 10+ year lifespan.

Case 2: Industrial Status Indicator Panel
An engineer designs a control panel with hundreds of indicator LEDs. Using the forward voltage binning information, they design a parallel driving circuit with appropriate ballast resistors for each voltage bin group to ensure uniform brightness. The "Forever" datasheet expiration supports the panel's expected 15-year service life without specification changes.

13. Operational Principle

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type region recombine with holes from the p-type region in the active layer. This recombination releases energy in the form of photons (light). The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used (e.g., InGaN for blue/green, AlInGaP for red/amber). White LEDs are typically created by coating a blue LED chip with a yellow phosphor; the combination of blue and yellow light produces white light. The specific mix of phosphors determines the Correlated Color Temperature (CCT).

14. Technology Trends

The solid-state lighting industry continues to evolve. General trends include increasing luminous efficacy (lumens per watt), enabling higher light output with lower power consumption and less heat. There is a strong focus on improving color quality, including higher Color Rendering Index (CRI) values and more precise color consistency (tighter binning). Miniaturization of packages while maintaining or increasing light output is ongoing. Furthermore, the integration of smart features, such as built-in drivers or color-tuning capabilities, is becoming more common. The emphasis on long-term reliability and datasheet stability, as evidenced by the "Forever" expiration in this document, aligns with the market's need for durable components in infrastructure and automotive applications.