LED Component Technical Datasheet - Revision 2 - Lifecycle Documentation - English Technical Document

1. Product Overview

This technical document provides comprehensive information regarding the lifecycle management and revision history of a specific LED component. The primary focus is on the established revision status and its permanent validity within the product lifecycle. The core advantage of this documentation is its clarity in defining the component's stable technical state, ensuring consistency for design and manufacturing processes. This information is critical for engineers, procurement specialists, and quality assurance teams involved in long-term product development and maintenance.

2. Lifecycle and Revision Information

The document consistently indicates a single, well-defined lifecycle state for the component.

2.1 Lifecycle Phase

The component is firmly in the Revision phase. This signifies that the product design and specifications have undergone updates and improvements from an initial version and are now at a stable, released state labeled as Revision 2. This phase indicates the component is actively supported and available for production use.

2.2 Revision History

The current documented revision is Revision 2. The repeated mention of this revision number throughout the document underscores its importance. While details of the changes from Revision 1 are not provided in this excerpt, the revision number is a key identifier for tracking component changes, ensuring that all parties are referencing the correct set of specifications.

2.3 Validity and Release

The Expired Period is stated as "Forever." This is a significant declaration, meaning that this particular revision (Revision 2) of the component's documentation does not have a planned obsolescence date. The specifications are intended to remain valid indefinitely, providing long-term stability for designs incorporating this part.

The Release Date for Revision 2 is precisely recorded as 2014-12-11 18:37:42.0. This timestamp provides an exact historical reference point for when this revision was formally issued and became the active specification.

3. Technical Parameters Deep Objective Interpretation

While the provided PDF excerpt focuses on lifecycle data, a complete technical datasheet for an LED component would typically include the following sections. The parameters below represent common categories that would be detailed based on the component's actual design.

3.1 Photometric Characteristics

This section would detail the light output properties. Key parameters include Luminous Flux (measured in lumens), which defines the total perceived power of light emitted. Luminous Intensity (measured in candelas) describes the light power per unit solid angle. The dominant wavelength or correlated color temperature (CCT) specifies the color of the light, such as cool white, neutral white, or warm white. Color Rendering Index (CRI) is a measure of how accurately the light source reveals the colors of objects compared to a natural light source. Viewing angle defines the angular range over which the luminous intensity is at least half of its maximum value.

3.2 Electrical Parameters

Critical for circuit design, this section outlines the voltage and current requirements. The Forward Voltage (Vf) is the voltage drop across the LED when it is emitting light at a specified test current. The Forward Current (If) is the recommended operating current. Maximum ratings for reverse voltage and absolute maximum forward current would also be specified to prevent device damage. Power dissipation is calculated from Vf and If.

3.3 Thermal Characteristics

LED performance and longevity are heavily influenced by temperature. The Junction-to-Ambient thermal resistance (RθJA) indicates how effectively heat is transferred from the LED chip (junction) to the surrounding environment. A lower value signifies better heat dissipation. The maximum junction temperature (Tj max) is the highest allowable temperature at the semiconductor junction. Operating the LED above this temperature will drastically reduce its lifespan and can cause immediate failure.

4. Binning System Explanation

Manufacturing variations necessitate sorting LEDs into performance bins to ensure consistency.

4.1 Wavelength / Color Temperature Binning

LEDs are sorted into narrow ranges of dominant wavelength (for monochromatic LEDs) or correlated color temperature (for white LEDs). This ensures color uniformity within a single production batch and across different batches. A typical binning structure might use alphanumeric codes to represent specific wavelength or CCT ranges.

4.2 Luminous Flux Binning

LEDs are categorized based on their measured light output at a standard test current. This allows designers to select components that meet specific brightness requirements. Bins are usually defined by a minimum and/or maximum luminous flux value.

4.3 Forward Voltage Binning

To aid in designing efficient driver circuits and ensuring consistent performance in parallel strings, LEDs are also binned by their forward voltage (Vf) at the test current. This helps in matching LEDs to minimize current imbalance in arrays.

5. Performance Curve Analysis

Graphical data is essential for understanding component behavior under various conditions.

5.1 Current-Voltage (I-V) Characteristic Curve

This curve plots the relationship between the forward current through the LED and the voltage across its terminals. It is non-linear, showing a threshold voltage below which very little current flows. The curve is crucial for selecting appropriate current-limiting circuitry.

5.2 Temperature Dependence

Graphs typically show how forward voltage decreases with increasing junction temperature. Another critical graph illustrates the relative luminous flux output as a function of junction temperature, showing the depreciation in light output as temperature rises.

5.3 Spectral Power Distribution

For white LEDs, this graph shows the relative intensity of light emitted at each wavelength across the visible spectrum. It reveals the peaks of the blue pump LED and the broad phosphor emission, providing insight into color quality and CRI.

6. Mechanical and Packaging Information

Physical specifications are vital for PCB design and assembly.

6.1 Dimensional Outline Drawing

A detailed diagram showing the component's exact dimensions, including length, width, height, and any critical tolerances. It defines the footprint required on the printed circuit board (PCB).

6.2 Pad Layout Design

The recommended copper pad pattern on the PCB for soldering the LED. This includes pad size, shape, and spacing to ensure reliable solder joints, proper thermal transfer, and mechanical stability.

6.3 Polarity Identification

Clear marking of the anode (+) and cathode (-) terminals on the LED package, often indicated by a notch, a dot, a cut corner, or different lead lengths. Correct polarity is essential for operation.

7. Soldering and Assembly Guidelines

7.1 Reflow Soldering Parameters

A recommended reflow profile specifying preheat, soak, reflow, and cooling stages. Key parameters include peak temperature, time above liquidus (TAL), and ramp rates. Adherence to this profile prevents thermal shock and ensures reliable solder connections without damaging the LED.

7.2 Precautions and Handling

Instructions for handling to avoid electrostatic discharge (ESD) damage. Guidelines on avoiding mechanical stress on the lens or leads. Recommendations for cleaning agents that are compatible with the LED package material.

7.3 Storage Conditions

Ideal storage environment to maintain solderability and prevent moisture absorption (which can cause "popcorning" during reflow). Typically involves storage in a dry, temperature-controlled environment, often with desiccant in moisture-barrier bags.

8. Packaging and Ordering Information

8.1 Packaging Specifications

Details on how the LEDs are supplied: reel type (e.g., 7-inch or 13-inch), tape width, pocket spacing, and orientation. Quantity per reel is also specified.

8.2 Labeling Explanation

Description of the information printed on the reel label, including part number, quantity, lot number, date code, and binning codes.

8.3 Part Number Nomenclature

A breakdown of the component's part number, explaining how the code indicates key attributes like color, flux bin, voltage bin, package type, and special features.

9. Application Recommendations

9.1 Typical Application Circuits

Schematics for basic constant current driver circuits, such as using a simple resistor for low-power applications or dedicated LED driver ICs for higher performance and efficiency. Considerations for series and parallel connections.

9.2 Design Considerations

Guidance on thermal management design: calculating the required heatsinking, PCB layout for heat spreading (using thermal vias, copper pours). Optical design considerations for achieving desired beam patterns and brightness uniformity.

10. Technical Comparison

An objective comparison highlighting where this component fits relative to alternatives. This could discuss efficiency (lumens per watt) compared to previous generations or competing technologies. It might highlight a superior color rendering index, a wider operating temperature range, or a more compact package size enabling new design possibilities.

11. Frequently Asked Questions (FAQ)

Answers to common technical queries. Examples: "What is the expected lifetime (L70/B50) of this LED under typical operating conditions?" "How does the forward voltage vary with temperature?" "Can multiple LEDs be connected in parallel directly?" "What is the recommended maximum drive current for pulsed operation?" "How should I interpret the binning codes on the label?"

12. Practical Use Cases

Detailed examples of how this LED is implemented. Case 1: Integration into a residential downlight, focusing on thermal interface material selection and driver compatibility. Case 2: Use in an automotive interior lighting module, emphasizing reliability testing and dimming performance. Case 3: Implementation in a horticultural lighting system, discussing the specific spectrum's efficacy for plant growth.

13. Principle of Operation

An objective explanation of the underlying technology. For a white LED, this describes electroluminescence in a semiconductor diode, where electrons recombine with holes, releasing energy as photons. In a phosphor-converted white LED, the primary blue or near-UV light from the chip excites a phosphor coating, which then emits a broader spectrum of yellow/red light. The mixture of blue and yellow/red light is perceived as white.

14. Technology Trends

An objective overview of the direction of LED technology. This includes the ongoing trend of increasing luminous efficacy (lumens per watt), reducing cost per lumen. The development of novel phosphors for improved color quality and higher CRI. Miniaturization of packages for high-density applications. The growth of smart lighting and human-centric lighting, where spectral tuning and connectivity are becoming important features. The integration of LEDs with sensors and drivers into more complete system-on-chip or system-in-package solutions.