Table of Contents
- 1. Product Overview
- 2. Lifecycle and Revision Information
- 2.1 Lifecycle Phase
- 2.2 Revision Number
- 2.3 Release and Expiry Details
- 3. Technical Parameters: In-Depth Objective Interpretation
- 3.1 Photometric Characteristics
- 3.2 Electrical Parameters
- 3.3 Thermal Characteristics
- 4. Binning System Explanation
- 4.1 Wavelength/Color Temperature Binning
- 4.2 Luminous Flux Binning
- 4.3 Forward Voltage Binning
- 5. Performance Curve Analysis
- 5.1 Current vs. Voltage (I-V) Curve
- 5.2 Temperature Characteristics
- 5.3 Spectral Power Distribution (SPD)
- 6. Mechanical and Packaging Information
- 6.1 Dimensional Outline Drawing
- 6.2 Pad Layout Design
- 6.3 Polarity Identification
- 7. Soldering and Assembly Guidelines
- 7.1 Reflow Soldering Profile
- 7.2 Precautions and Handling
- 7.3 Storage Conditions
- 8. Packaging and Ordering Information
- 8.1 Packaging Specifications
- 8.2 Labeling and Traceability
- 8.3 Model Numbering Rules
- 9. Application Recommendations
- 9.1 Typical Application Scenarios
- 9.2 Design Considerations
- 10. Technical Comparison and Differentiation
- 11. Frequently Asked Questions (Based on Technical Parameters)
- 12. Practical Use Case Examples
- 12.1 Design Case: Task Lighting Fixture
- 12.2 Manufacturing Case: Panel Light Production
- 13. Operating Principle Introduction
- 14. Technology Trends and Developments
1. Product Overview
This technical document provides comprehensive specifications and guidelines for a light-emitting diode (LED) component. The primary focus of this revision is to document the lifecycle phase and associated administrative data. LEDs are semiconductor devices that convert electrical energy into visible light, widely used in applications ranging from indicator lights and backlighting to general illumination and automotive lighting due to their efficiency, longevity, and compact size.
The core advantage of this component lies in its standardized lifecycle management, ensuring consistency and traceability across production batches. This is crucial for manufacturers and designers who require reliable and predictable component performance over the product's lifespan. The target market includes industrial equipment manufacturers, consumer electronics producers, and lighting solution providers who prioritize component reliability and documentation.
2. Lifecycle and Revision Information
The provided PDF content indicates a consistent lifecycle status across multiple entries.
2.1 Lifecycle Phase
The lifecycle phase for this component is documented as Revision. This signifies that the product design, specifications, or manufacturing process has undergone a formal change. A revision phase typically follows an initial release and involves updates that do not fundamentally alter the product's form, fit, or core function but may include improvements in performance, materials, or documentation clarity.
2.2 Revision Number
The revision number is specified as 2. This numerical identifier tracks the sequence of formal changes made to the product documentation and/or the product itself. Revision 2 indicates this is the second major documented iteration since the initial release.
2.3 Release and Expiry Details
The release date for this revision is recorded as 2014-12-01 18:09:04.0. The expired period is noted as Forever. This combination suggests that while this specific revision was released on a fixed date, the technical data and specifications contained within do not have a planned obsolescence date for informational purposes. However, for active manufacturing and sourcing, the "forever" status typically applies to the validity of the datasheet information, not the procurement availability of the component, which is subject to the manufacturer's product lifecycle policies.
3. Technical Parameters: In-Depth Objective Interpretation
While the provided PDF snippet is limited to administrative data, a standard LED datasheet of this type would contain the following technical sections. The following is a detailed, objective explanation of typical parameters.
3.1 Photometric Characteristics
Photometric parameters describe the light output characteristics as perceived by the human eye.
- Luminous Flux: Measured in lumens (lm), this is the total quantity of visible light emitted by the source. A higher lumen value indicates a brighter light output. This parameter is often binned (grouped) into specific ranges during production.
- Luminous Intensity: Measured in millicandelas (mcd), this describes the brightness of the LED in a specific direction. It is dependent on the viewing angle.
- Dominant Wavelength / Correlated Color Temperature (CCT): For colored LEDs, the dominant wavelength (in nanometers, nm) defines the perceived color (e.g., 630nm for red). For white LEDs, the CCT (in Kelvin, K) defines the shade of white, such as 2700K (warm white) or 6500K (cool white).
- Color Rendering Index (CRI): For white LEDs, CRI (Ra) measures the ability of the light source to reveal the colors of objects faithfully compared to a natural light source. A higher CRI (closer to 100) is better for applications where color accuracy is critical.
- Viewing Angle: The angle at which the luminous intensity is half of the intensity at 0 degrees (directly on-axis). A wider angle (e.g., 120 degrees) provides more diffuse light.
3.2 Electrical Parameters
These parameters define the operating conditions and electrical limits of the LED.
- Forward Voltage (Vf): The voltage drop across the LED when it is conducting current. It varies with the LED material (e.g., ~2V for red, ~3.2V for blue/white) and is specified at a particular test current. It is a key parameter for driver design.
- Forward Current (If): The recommended continuous DC operating current, typically in milliamperes (mA). Exceeding the maximum rated current can drastically reduce lifespan or cause immediate failure.
- Reverse Voltage (Vr): The maximum voltage the LED can withstand when connected in reverse bias without damage. LEDs have very low reverse voltage ratings (often 5V).
- Power Dissipation: The electrical power converted into heat and light, calculated as Vf * If. Effective thermal management is required to dissipate this heat.
3.3 Thermal Characteristics
LED performance and longevity are highly sensitive to temperature.
- Junction Temperature (Tj): The temperature at the semiconductor chip's p-n junction. The maximum allowable Tj is a critical limit; exceeding it causes rapid degradation.
- Thermal Resistance (Rth j-s or Rth j-a): Measured in degrees Celsius per watt (°C/W), this indicates how effectively heat travels from the junction to a reference point (solder point or ambient air). A lower value means better heat dissipation.
- Operating Temperature Range: The ambient temperature range within which the LED is specified to operate reliably.
- Storage Temperature Range: The temperature range for safe storage when the device is not powered.
4. Binning System Explanation
Due to inherent variations in semiconductor manufacturing, LEDs are sorted (binned) after production to ensure consistency.
4.1 Wavelength/Color Temperature Binning
LEDs are grouped into tight wavelength or CCT ranges (e.g., 450-455nm, 5000K-5300K). This ensures color uniformity within a batch, which is vital for applications using multiple LEDs side-by-side.
4.2 Luminous Flux Binning
LEDs are sorted based on their measured light output into flux bins (e.g., 100-105 lm, 105-110 lm). This allows designers to select a brightness grade suitable for their application and cost target.
4.3 Forward Voltage Binning
Sorting by forward voltage (e.g., 3.0-3.2V, 3.2-3.4V) helps in designing efficient driver circuits, especially when connecting multiple LEDs in series, as it minimizes current imbalance.
5. Performance Curve Analysis
Graphical data provides deeper insight into LED behavior under varying conditions.
5.1 Current vs. Voltage (I-V) Curve
This curve shows the nonlinear relationship between forward current and forward voltage. It demonstrates the threshold voltage required to turn the LED on and how Vf increases with current. The curve is essential for selecting current-limiting resistors or designing constant-current drivers.
5.2 Temperature Characteristics
Graphs typically show how luminous flux and forward voltage change with increasing junction temperature. Flux generally decreases as temperature rises (thermal quenching), while Vf decreases slightly. These graphs are critical for predicting performance in real-world, non-ideal thermal environments.
5.3 Spectral Power Distribution (SPD)
For white LEDs, the SPD graph shows the relative intensity of light across the visible spectrum. It reveals the peaks of the blue pump LED and the broad phosphor emission, helping to understand the CCT and CRI characteristics visually.
6. Mechanical and Packaging Information
Physical specifications ensure proper integration into the final product.
6.1 Dimensional Outline Drawing
A detailed diagram showing the LED's exact dimensions, including length, width, height, and any lens curvature. Critical for PCB footprint design and ensuring mechanical clearance.
6.2 Pad Layout Design
The recommended copper pad pattern on the PCB for soldering. It includes pad size, shape, and spacing to ensure reliable solder joints, proper heat sinking, and prevent tombstoning during reflow.
6.3 Polarity Identification
Clear marking of the anode (+) and cathode (-) terminals. This is often indicated by a notch, a cut corner, a longer lead (for through-hole), or a marked pad on the device body. Incorrect polarity will prevent the LED from illuminating.
7. Soldering and Assembly Guidelines
7.1 Reflow Soldering Profile
A time-temperature graph specifying the recommended reflow profile, including preheat, soak, reflow peak temperature, and cooling rates. Adherence to this profile (typically with a peak temperature around 260°C for a few seconds) is vital to avoid thermal damage to the LED package or internal die.
7.2 Precautions and Handling
- ESD (Electrostatic Discharge) Sensitivity: LEDs are often ESD-sensitive and should be handled with appropriate precautions (grounded workstations, wrist straps).
- Avoid Mechanical Stress: Do not apply pressure to the lens.
- Cleaning: Use compatible solvents if post-solder cleaning is required.
7.3 Storage Conditions
Store in a dry, inert environment (typically <40°C and <60% relative humidity) within the specified temperature range. Moisture-sensitive devices may require baking before use if the packaging has been opened and exposed to ambient humidity beyond its floor life.
8. Packaging and Ordering Information
8.1 Packaging Specifications
Details on how the LEDs are supplied: reel type (e.g., 12mm, 16mm), tape width, pocket spacing, and quantity per reel (e.g., 2000 pieces). This information is necessary for automated pick-and-place machine programming.
8.2 Labeling and Traceability
Information on the reel label, including part number, quantity, date code, lot number, and bin codes. This ensures traceability back to the manufacturing batch.
8.3 Model Numbering Rules
Explanation of the part number structure, which typically encodes key attributes like package size, color, flux bin, voltage bin, and color temperature. Understanding this allows for precise ordering.
9. Application Recommendations
9.1 Typical Application Scenarios
- General Lighting: Bulbs, tubes, panels. Requires high flux, good CRI, and appropriate CCT.
- Backlighting: For LCD displays in TVs, monitors, and signage. Requires uniform brightness and color.
- Automotive Lighting: Interior lights, daytime running lights (DRLs), brake lights. Requires high reliability and specific color standards.
- Indicator Lights: On/off status on consumer electronics and appliances. Lower flux requirements.
9.2 Design Considerations
- Thermal Management: The most critical factor for longevity. Use adequate PCB copper area (thermal pads), consider metal-core PCBs (MCPCBs) for high-power applications, and ensure good airflow.
- Drive Circuitry: Use a constant-current driver for stable light output and to prevent thermal runaway. Never drive an LED directly from a voltage source without current limiting.
- Optical Design: Consider secondary optics (lenses, diffusers) to achieve the desired beam pattern and appearance.
10. Technical Comparison and Differentiation
When comparing with similar LED components, key differentiators based on a typical datasheet might include:
- Higher Luminous Efficacy (lm/W): Delivering more light per unit of electrical power, leading to energy savings.
- Superior Color Consistency (Tighter Binning): Reduced color variation across a production batch, resulting in better aesthetic quality in multi-LED fixtures.
- Lower Thermal Resistance: Enables higher drive currents or longer lifespan by allowing heat to escape more efficiently from the junction.
- Enhanced Reliability Data: Backed by extensive LM-80 test reports or longer L70/B50 lifetime projections, providing confidence for long-term applications.
11. Frequently Asked Questions (Based on Technical Parameters)
- Q: Why is my LED dimmer than expected? A: Likely causes include operating below the recommended current, high junction temperature (poor heat sinking), or using an LED from a lower flux bin than specified in the design.
- Q: Can I power the LED directly with a 3.3V supply? A: No. You must use a series resistor or constant-current driver to limit the current. The forward voltage is a characteristic, not a rating. Applying 3.3V directly to a 3.2V LED could allow excessive current to flow, damaging it.
- Q: What does "Forever" expiry mean for the datasheet? A: It means the information in this revision of the document is considered perpetually valid for reference. It does not guarantee the component will be available for purchase indefinitely; that is governed by the manufacturer's product discontinuance (EOL) notices.
- Q: How do I interpret the revision number? A: Revision 2 indicates this is the second official version of the document. Changes from Revision 1 could include corrected typos, updated test methods, or refined specification limits. Always use the latest revision for design work.
12. Practical Use Case Examples
12.1 Design Case: Task Lighting Fixture
A designer creates an architect's desk lamp requiring high CRI (Ra >90) for accurate color rendering, a warm white CCT (3000K) for visual comfort, and a compact form factor. They select a mid-power LED with a suitable flux bin. The design challenge is thermal management in a small housing. The solution involves using an aluminum heatsink integrated into the lamp arm and a constant-current driver set to 80% of the LED's maximum current to extend lifespan and reduce thermal load, while still meeting lumen output targets.
12.2 Manufacturing Case: Panel Light Production
A factory assembles LED panel lights. To ensure color uniformity across the panel, they procure all LEDs for a single production run from the same wavelength and flux bin codes as specified in the datasheet's binning tables. During assembly, they follow the recommended reflow profile precisely to avoid thermal stress. They also implement automated optical testing to verify the luminous flux and color coordinates of each finished panel against the expected values derived from the datasheet specifications.
13. Operating Principle Introduction
An LED is a solid-state semiconductor device. Its core structure is a p-n junction made from compound semiconductor materials (like Gallium Nitride for blue/white LEDs). When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region. When an electron recombines with a hole, it falls to a lower energy level, releasing energy in the form of a photon (light). The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material. White LEDs are typically created by coating a blue LED chip with a yellow phosphor; some of the blue light is converted to yellow, and the mixture of blue and yellow light is perceived as white.
14. Technology Trends and Developments
The LED industry continues to evolve with several clear, objective trends:
- Increased Efficiency: Ongoing research aims to improve internal quantum efficiency (IQE) and light extraction efficiency, pushing luminous efficacy higher, reducing energy consumption for the same light output.
- Improved Color Quality: Development of novel phosphor systems and multi-color LED combinations (e.g., RGB, violet+phosphor) to achieve higher CRI values and more saturated colors for specialized applications.
- Miniaturization and Integration: Development of smaller package sizes (e.g., micro-LEDs) and chip-scale packaging (CSP) for ultra-compact and high-density applications like micro-displays and wearable technology.
- Smart and Connected Lighting: Integration of control electronics and communication protocols (like DALI or Zigbee) directly with LED modules, enabling intelligent lighting systems for IoT applications.
- Reliability and Lifetime Modeling: More sophisticated testing and modeling to predict lumen maintenance and failure rates under various stress conditions, providing more accurate lifetime data for critical applications.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |