Table of Contents
- 1. Product Overview
- 2. Lifecycle and Revision Information
- 3. Technical Parameters: Objective Interpretation
- 3.1 Photometric Characteristics
- 3.2 Electrical Parameters
- 3.3 Thermal Characteristics
- 4. Binning System Explanation
- 4.1 Wavelength/Color Temperature Binning
- 4.2 Luminous Flux Binning
- 4.3 Forward Voltage Binning
- 5. Performance Curve Analysis
- 5.1 Current-Voltage (I-V) Characteristic Curve
- 5.2 Temperature Dependency Characteristics
- 5.3 Spectral Power Distribution
- 6. Mechanical and Package Information
- 6.1 Dimensional Outline Drawing
- 6.2 Pad Layout Design
- 6.3 Polarity Identification
- 7. Soldering and Assembly Guidelines
- 7.1 Reflow Soldering Profile
- 7.2 Precautions and Handling
- 7.3 Storage Conditions
- 8. Packaging and Ordering Information
- 8.1 Packaging Specifications
- 8.2 Labeling Information
- 8.3 Part Numbering System
- 9. Application Recommendations
- 9.1 Typical Application Circuits
- 9.2 Design Considerations
- 10. Technical Comparison
- 11. Frequently Asked Questions (FAQ)
- 12. Practical Use Cases
- 13. Operating Principle Introduction
- 14. Technology Trends
1. Product Overview
This technical datasheet provides comprehensive information for an LED component, focusing on its lifecycle management and revision control. The document is structured to offer engineers and procurement specialists clear, actionable data for integration and sourcing decisions. The core advantage of this component lies in its documented and controlled lifecycle, ensuring consistency and reliability for long-term projects. It is targeted at applications requiring stable, well-documented components in sectors such as industrial lighting, consumer electronics, and automotive subsystems where traceability and version control are critical.
2. Lifecycle and Revision Information
The provided PDF content centers on the component's lifecycle status. The key data point repeated throughout is the declaration of the Lifecycle Phase as "Revision : 1". This indicates the component is in an active revision state, specifically the first major revision of its documentation or specifications. The "Expired Period" is listed as "Forever," which typically signifies that this revision of the datasheet has no planned expiration date and remains valid indefinitely unless superseded by a newer revision. The "Release Date" is consistently noted as "2014-05-28 16:43:29.0," providing a precise timestamp for when this specific revision (Revision 1) was officially issued. This structured approach to versioning is essential for quality control and avoiding discrepancies in manufacturing or design.
3. Technical Parameters: Objective Interpretation
While the provided text snippet does not list specific photometric, electrical, or thermal parameters, a complete datasheet for an LED component would typically include the following sections with detailed, objective data.
3.1 Photometric Characteristics
This section would contain absolute ratings and typical performance data for light output. Key parameters include dominant wavelength or correlated color temperature (CCT), which defines the color of the emitted light. Luminous flux, measured in lumens (lm), indicates the total perceived power of light. Luminous intensity, often given in millicandelas (mcd) at a specific viewing angle, describes the spatial distribution of light. Chromaticity coordinates (e.g., CIE x, y) provide a precise, numerical definition of color point on the standard color space diagram. All values should be presented with clear test conditions (forward current, junction temperature).
3.2 Electrical Parameters
This section details the electrical behavior of the LED. The forward voltage (Vf) is a critical parameter, specifying the voltage drop across the LED at a given test current. It is essential for driver design and power supply selection. Reverse voltage (Vr) indicates the maximum voltage the LED can withstand in the non-conducting direction without damage. The absolute maximum ratings for forward current (If) and pulsed forward current define the operational limits to prevent catastrophic failure. Typical current-voltage (I-V) characteristics would also be described here.
3.3 Thermal Characteristics
LED performance and longevity are heavily influenced by temperature. Key thermal parameters include the junction-to-ambient thermal resistance (RθJA), which quantifies how effectively heat is dissipated from the semiconductor junction to the surrounding environment. A lower value indicates better thermal performance. The maximum junction temperature (Tj max) is the highest temperature the LED chip can safely endure. Operating and storage temperature ranges define the environmental limits for the device. Proper heat sinking is crucial to maintain Tj within safe limits, ensuring rated luminous output and long operational life.
4. Binning System Explanation
LED manufacturing yields natural variations. A binning system categorizes components based on key parameters to ensure consistency in end products.
4.1 Wavelength/Color Temperature Binning
LEDs are sorted into bins according to their dominant wavelength (for monochromatic LEDs) or correlated color temperature (for white LEDs). This ensures that all LEDs used in a single fixture or product have nearly identical color output, preventing visible color mismatch. Bins are defined by small ranges on the CIE chromaticity diagram.
4.2 Luminous Flux Binning
Components are also binned based on their light output (luminous flux) at a standard test current. This allows designers to select LEDs that meet specific brightness requirements and maintain uniform illumination levels across an array.
4.3 Forward Voltage Binning
Sorting by forward voltage (Vf) helps in designing efficient driver circuits. Using LEDs from the same or similar Vf bin ensures more uniform current distribution in parallel configurations and can simplify power supply design.
5. Performance Curve Analysis
Graphical data provides deeper insight into component behavior under varying conditions.
5.1 Current-Voltage (I-V) Characteristic Curve
This curve plots the relationship between the forward current through the LED and the voltage across its terminals. It is non-linear, showing a threshold voltage below which very little current flows. The slope of the curve in the operating region relates to the dynamic resistance of the LED. This graph is fundamental for selecting current-limiting circuitry.
5.2 Temperature Dependency Characteristics
Graphs typically show how key parameters like forward voltage and luminous flux change with junction temperature. Vf generally decreases with increasing temperature (negative temperature coefficient), while luminous flux typically degrades as temperature rises. Understanding these relationships is vital for thermal management and predicting performance in real-world environments.
5.3 Spectral Power Distribution
For white LEDs, this graph shows the relative intensity of light across the visible spectrum. It reveals the peaks of the blue pump LED and the broader emission of the phosphor. The shape of the curve determines the Color Rendering Index (CRI), which measures how accurately the light source renders colors compared to a reference source.
6. Mechanical and Package Information
Precise physical specifications are necessary for PCB design and assembly.
6.1 Dimensional Outline Drawing
A detailed diagram showing the LED package's exact dimensions, including length, width, height, and any tolerances. It will indicate the location of the optical center and the orientation of the emitting surface.
6.2 Pad Layout Design
The recommended footprint for the PCB lands (pads). This includes pad size, shape, and spacing (pitch). Adhering to these recommendations ensures proper solder joint formation, electrical connection, and thermal transfer during reflow soldering.
6.3 Polarity Identification
Clear marking of the anode (+) and cathode (-) terminals on the package, often via a notch, a dot, a cut corner, or differently shaped leads. Correct polarity is essential for device operation.
7. Soldering and Assembly Guidelines
Proper handling ensures reliability and prevents damage during manufacturing.
7.1 Reflow Soldering Profile
A detailed temperature vs. time graph specifying the preheat, soak, reflow, and cooling stages. Critical parameters include peak temperature (which must not exceed the LED's maximum soldering temperature), time above liquidus, and ramp rates. Following this profile prevents thermal shock and solder defects.
7.2 Precautions and Handling
Instructions typically include warnings against applying mechanical stress to the lens, using ESD (Electrostatic Discharge) precautions, avoiding contamination of the optical surface, and not touching the solder pads with bare hands to prevent oxidation.
7.3 Storage Conditions
Recommended storage environment, usually in a dry, inert atmosphere (e.g., in a moisture barrier bag with desiccant) within specified temperature and humidity ranges to prevent moisture absorption (which can cause "popcorning" during reflow) and lead oxidation.
8. Packaging and Ordering Information
8.1 Packaging Specifications
Describes how the LEDs are supplied: on tape and reel (standard for automated assembly), in tubes, or in trays. Details include reel dimensions, pocket spacing, and orientation.
8.2 Labeling Information
Explanation of the information printed on the packaging labels, which may include part number, bin code, quantity, lot number, and date code for traceability.
8.3 Part Numbering System
A breakdown of the component's model number, showing how different fields within the code represent specific attributes like color, flux bin, voltage bin, package type, and special features. This allows precise ordering of the required specification.
9. Application Recommendations
9.1 Typical Application Circuits
Schematics for basic drive circuits, such as using a simple current-limiting resistor for low-power applications or constant current drivers for higher-power or precision applications. May include considerations for series/parallel connections.
9.2 Design Considerations
Key advice for successful implementation: ensuring adequate heat sinking, maintaining proper clearance and creepage distances, protecting against electrical transients (ESD, surge), and considering optical design elements like secondary optics or diffusers.
10. Technical Comparison
An objective comparison would highlight this component's features against a generic or previous-generation baseline. Based on the lifecycle data provided, a key differentiator is the formalized and "Forever" valid revision control (Revision 1), which offers stability and clear reference for long-term designs compared to components with less documented or frequently changing specifications. Other potential advantages, inferred from standard LED practice, could include higher efficacy (lumens per watt), better color consistency due to tight binning, or a more robust package design leading to higher reliability under thermal cycling.
11. Frequently Asked Questions (FAQ)
Q: What does "LifecyclePhase: Revision : 1" mean?
A: It indicates this is the first official revision of the component's technical datasheet. The specifications contained within are stable and controlled under this revision number.
Q: The "Expired Period" is "Forever." Does this mean the LED never fails?
A: No. "Forever" refers to the validity period of this specific revision of the documentation. The component itself has a finite operational lifetime (L70, L50 ratings typically given in hours), which is a separate parameter found in the reliability data section of a full datasheet.
Q: How should I use the Release Date information?
A: The Release Date (2014-05-28) allows you to confirm you are using the correct version of the datasheet. It is crucial for ensuring all team members and manufacturing partners reference the same specifications, especially during engineering change orders (ECOs).
Q: What if I need a different flux or color bin?
A: You must specify the desired bin codes when ordering. The part numbering system typically incorporates bin information. Using unbinned or mixed-bin components can lead to inconsistent performance in the final product.
12. Practical Use Cases
Case 1: Long-Term Industrial Lighting Project
A manufacturer is designing an industrial high-bay lighting fixture with a required product lifecycle of 10 years. Using a component with a clearly defined and non-expiring datasheet revision (Revision 1, Forever valid) ensures that the technical specifications remain fixed. This allows for consistent driver design, thermal management, and optical design over the entire production run and for future spare parts, avoiding requalification due to spec changes.
Case 2: Consumer Electronics Backlighting
For an LCD TV backlight unit requiring uniform color and brightness, the designer utilizes the detailed binning information. By specifying tight bins for chromaticity coordinates and luminous flux, they can achieve a homogeneous white field across the screen without visible color or brightness patches, directly impacting product quality and customer satisfaction.
13. Operating Principle Introduction
An LED (Light Emitting Diode) is a semiconductor device that emits light when an electric current passes through it. This phenomenon, called electroluminescence, occurs when electrons recombine with electron holes within the device, releasing energy in the form of photons. The specific wavelength (color) of the light is determined by the energy band gap of the semiconductor material used (e.g., InGaN for blue/green, AlInGaP for red/amber). White LEDs are typically created by coating a blue or ultraviolet LED chip with a phosphor material, which absorbs some of the blue/UV light and re-emits it as a broader spectrum of longer wavelengths (yellow, red), combining to produce white light.
14. Technology Trends
The LED industry continues to evolve with several clear, objective trends. Efficiency (lumens per watt) is steadily increasing, reducing energy consumption for the same light output. Color quality metrics, such as Color Rendering Index (CRI) and more recently, TM-30 (Rf, Rg), are receiving greater focus to improve light quality in applications like retail and museums. Miniaturization persists, enabling ever-smaller and higher-resolution displays and lighting elements. There is also a strong trend towards intelligent, connected lighting systems where LEDs are integrated with sensors and communication protocols (e.g., DALI, Zhaga). Furthermore, the push for sustainability drives developments in recyclable materials and manufacturing processes with lower environmental impact.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |