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LED Component Datasheet - Lifecycle Phase Revision 6 - Release Date 2015-12-11 - English Technical Document

Technical datasheet detailing the lifecycle phase, revision history, and release information for an LED component. Includes specifications for revision management and product documentation standards.
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PDF Document Cover - LED Component Datasheet - Lifecycle Phase Revision 6 - Release Date 2015-12-11 - English Technical Document

1. Product Overview

This technical document provides comprehensive specifications and lifecycle management information for a light-emitting diode (LED) component. The primary focus of this datasheet is to establish the formal revision status and release parameters for the product documentation. The core advantage of this standardized approach is ensuring consistency, traceability, and clarity in technical communication across the product's lifespan. It is targeted at engineers, procurement specialists, quality assurance personnel, and documentation managers involved in the design, sourcing, and manufacturing of electronic assemblies utilizing this component.

2. Lifecycle and Revision Management

The provided PDF content exclusively details the formal lifecycle and revision control status of the component's datasheet. This is a critical aspect of component management, ensuring all stakeholders reference the correct and current version of technical specifications.

2.1 Lifecycle Phase Definition

The Lifecycle Phase is explicitly stated as Revision. This indicates that the document is not in an initial draft or prototype status but represents a formally released and subsequently updated version of the specifications. The phase "Revision" implies that changes have been made to a previous release, and this document supersedes it.

2.2 Revision Number

The Revision Number is specified as 6. This is a sequential identifier that increments with each formal change to the document. Revision 6 signifies that this is the sixth officially released version of this datasheet. Tracking revision numbers is essential for version control and for identifying which set of specifications a particular batch of components or a design was based upon.

2.3 Release and Validity Information

The document includes key temporal metadata governing its validity and release.

3. Technical Parameters and Specifications

While the provided PDF snippet focuses on document metadata, a complete LED datasheet would contain extensive technical parameters. The following sections detail the typical specifications that would be associated with such a component, based on industry standards. Engineers must consult the full, official datasheet for absolute values.

3.1 Photometric and Color Characteristics

These parameters define the light output and color of the LED.

3.2 Electrical Parameters

These parameters define the electrical operating conditions of the LED.

3.3 Thermal Characteristics

LED performance and longevity are highly sensitive to temperature.

4. Binning and Sorting System

Due to manufacturing variations, LEDs are sorted into performance bins.

5. Performance Curve Analysis

Graphical data is essential for understanding component behavior under varying conditions.

6. Mechanical and Package Information

Physical specifications are crucial for PCB design and assembly.

7. Soldering and Assembly Guidelines

Proper handling ensures reliability.

8. Packaging and Ordering Information

Information for logistics and procurement.

9. Application Notes and Design Considerations

Guidance for implementing the component effectively.

10. Technical Comparison and Differentiation

While not always present in a single datasheet, engineers often compare components. Potential advantages could include higher efficacy (lumens per watt), better color uniformity, lower thermal resistance, or a more robust package design compared to previous generations or competitor parts.

11. Frequently Asked Questions (FAQ)

Answers to common queries based on technical parameters.

12. Practical Use Case Examples

Based on typical LED specifications, here are potential applications:

13. Operating Principle Introduction

An LED is a semiconductor p-n junction diode. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region. When these charge carriers recombine, energy is released in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material used (e.g., InGaN for blue/green, AlInGaP for red/amber). White LEDs are typically created by coating a blue LED chip with a yellow phosphor; the mixture of blue and yellow light produces white light.

14. Technology Trends

The LED industry continues to evolve with several clear, objective trends:

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.