Table of Contents
- 1. Product Overview
- 2. Lifecycle and Revision Information
- 2.1 Lifecycle Phase
- 2.2 Revision Number
- 2.3 Release Date
- 2.4 Expiration Period
- 3. Technical Parameters and Interpretation While the provided text snippet does not contain explicit technical parameters like voltage, wavelength, or dimensions, the presence of a formal revision datasheet implies the existence of such detailed specifications in the full document. Based on standard industry practice for such datasheets, the following sections would be critically analyzed. 3.1 Photometric and Color Characteristics A complete datasheet would detail photometric properties. For an LED, this includes dominant wavelength or correlated color temperature (CCT), which defines the color of light emitted. Luminous flux, measured in lumens (lm), indicates the perceived brightness. Chromaticity coordinates (e.g., on the CIE 1931 diagram) provide a precise color point. Color rendering index (CRI) may be included for white LEDs, indicating how naturally colors appear under its light. The revision number ensures that any binning or sorting of LEDs by these characteristics is consistent for this version of the product. 3.2 Electrical Parameters Key electrical specifications are fundamental. The forward voltage (Vf) at a specified test current is crucial for circuit design, affecting driver selection and power dissipation. The forward current (If) rating defines the maximum continuous current the device can handle. Reverse voltage (Vr) specifies the maximum voltage that can be applied in the non-conducting direction. These parameters ensure the component operates within its safe operating area (SOA). 3.3 Thermal Characteristics Thermal management is vital for LED performance and longevity. The thermal resistance, junction-to-ambient (RθJA) or junction-to-case (RθJC), quantifies how easily heat can escape from the semiconductor junction. A lower thermal resistance is better. The maximum junction temperature (Tj max) is the absolute highest temperature the LED chip can withstand before risk of catastrophic failure or accelerated degradation. Proper heatsinking is calculated using these values. 4. Binning and Sorting System
- 4.1 Wavelength or Color Temperature Binning
- 4.2 Luminous Flux Binning
- 4.3 Forward Voltage Binning
- 5. Performance Curve Analysis
- 5.1 Current vs. Voltage (I-V) Curve
- 5.2 Temperature Dependence
- 5.3 Spectral Power Distribution
- 6. Mechanical and Package Information
- 6.1 Package Dimensions
- 6.2 Pad Layout and Solderability
- 6.3 Polarity Identification
- 7. Soldering and Assembly Guidelines
- 7.1 Reflow Soldering Profile
- 7.2 Handling and Storage Precautions
- 8. Packaging and Ordering Information
- 8.1 Packaging Specifications
- 8.2 Labeling and Part Numbering
- 9. Application Notes and Design Considerations
- 9.1 Typical Application Circuits
- 9.2 Thermal Management Design
- 9.3 Optical Design Considerations
- 10. Technical Comparison and Differentiation
- 11. Frequently Asked Questions (FAQ)
- 12. Practical Use Case Examples
- 13. Operational Principle Introduction
- 14. Industry Trends and Developments
1. Product Overview
This technical document provides the lifecycle and revision control information for a specific electronic component, likely an LED or similar semiconductor device. The core purpose of this datasheet is to establish the official version and status of the component's technical specifications. The document indicates a finalized revision that is intended for permanent reference, signifying a stable and mature product definition. The target market includes engineers, procurement specialists, and quality assurance personnel involved in electronic design and manufacturing who require definitive version control for component selection and bill of materials (BOM) management.
2. Lifecycle and Revision Information
The provided content exclusively details the administrative and control aspects of the component's documentation.
2.1 Lifecycle Phase
The lifecycle phase is explicitly stated as Revision. This indicates that the component and its associated datasheet have progressed beyond initial design and prototyping phases. The "Revision" phase typically signifies that the product is in mass production, with its specifications frozen and any changes being carefully controlled through formal revision updates. This status provides assurance to designers that the part is stable for long-term production cycles.
2.2 Revision Number
The revision number is specified as 2. This is a critical piece of information for version control. Engineers must reference Revision 2 of this datasheet to ensure they are working with the correct set of specifications. Differences may exist between Revision 1 and Revision 2, which could include updates to electrical parameters, mechanical drawings, recommended operating conditions, or packaging information. Always confirming the revision number prevents errors in design and manufacturing.
2.3 Release Date
The official release date for this revision is 2014-12-05 at 13:03:47.0. The timestamp provides a precise point of reference for when this specific document version was authorized and published. This allows for traceability and helps in situations where multiple document versions may be in circulation. It establishes a baseline for when the specifications contained within became effective.
2.4 Expiration Period
The expiration period is marked as Forever. This is an unusual but significant designation in technical documentation. It means this revision of the datasheet is considered perpetually valid and will not be automatically superseded by a time-based policy. The "Forever" status implies that the information contained herein is the definitive and final specification for this particular revision of the component, and it will remain the authoritative reference unless explicitly replaced by a new revision notice. This is common for mature products that are no longer under active development.
3. Technical Parameters and Interpretation
While the provided text snippet does not contain explicit technical parameters like voltage, wavelength, or dimensions, the presence of a formal revision datasheet implies the existence of such detailed specifications in the full document. Based on standard industry practice for such datasheets, the following sections would be critically analyzed.
3.1 Photometric and Color Characteristics
A complete datasheet would detail photometric properties. For an LED, this includes dominant wavelength or correlated color temperature (CCT), which defines the color of light emitted. Luminous flux, measured in lumens (lm), indicates the perceived brightness. Chromaticity coordinates (e.g., on the CIE 1931 diagram) provide a precise color point. Color rendering index (CRI) may be included for white LEDs, indicating how naturally colors appear under its light. The revision number ensures that any binning or sorting of LEDs by these characteristics is consistent for this version of the product.
3.2 Electrical Parameters
Key electrical specifications are fundamental. The forward voltage (Vf) at a specified test current is crucial for circuit design, affecting driver selection and power dissipation. The forward current (If) rating defines the maximum continuous current the device can handle. Reverse voltage (Vr) specifies the maximum voltage that can be applied in the non-conducting direction. These parameters ensure the component operates within its safe operating area (SOA).
3.3 Thermal Characteristics
Thermal management is vital for LED performance and longevity. The thermal resistance, junction-to-ambient (RθJA) or junction-to-case (RθJC), quantifies how easily heat can escape from the semiconductor junction. A lower thermal resistance is better. The maximum junction temperature (Tj max) is the absolute highest temperature the LED chip can withstand before risk of catastrophic failure or accelerated degradation. Proper heatsinking is calculated using these values.
4. Binning and Sorting System
Manufacturing variations necessitate sorting components into performance bins.
4.1 Wavelength or Color Temperature Binning
LEDs are typically sorted into tight wavelength or CCT bins (e.g., 2700K, 3000K, 4000K, 5000K for white LEDs) to ensure color consistency within a single production batch or application. The datasheet for Revision 2 will define the exact bin boundaries and codes used.
4.2 Luminous Flux Binning
Components are also binned by their light output at a standard test current. This allows designers to select parts that meet specific brightness requirements and maintain uniformity across a lighting assembly.
4.3 Forward Voltage Binning
Sorting by forward voltage helps in designing efficient driver circuits and in parallel LED configurations to ensure current sharing is balanced.
5. Performance Curve Analysis
Graphical data reveals performance under varying conditions.
5.1 Current vs. Voltage (I-V) Curve
The I-V curve shows the relationship between forward voltage and current. It is non-linear, with a characteristic "knee" voltage. This curve is essential for selecting the appropriate drive current and understanding power consumption.
5.2 Temperature Dependence
Graphs typically show how forward voltage decreases and how luminous flux degrades as the junction temperature increases. This information is critical for designing systems that maintain performance over the intended operating temperature range.
5.3 Spectral Power Distribution
For colored or white LEDs, a spectral distribution plot shows the relative intensity of light at each wavelength. This determines the color quality and can be used to calculate chromaticity coordinates and CRI.
6. Mechanical and Package Information
The physical form factor is defined here.
6.1 Package Dimensions
A detailed mechanical drawing provides all critical dimensions: length, width, height, lead spacing, and overall tolerances. This is necessary for PCB footprint design and ensuring proper fit within the assembly.
6.2 Pad Layout and Solderability
The recommended PCB land pattern (pad geometry and size) is provided to ensure reliable solder joints during reflow or wave soldering. Surface finish and solder plating information may also be included.
6.3 Polarity Identification
Clear markings (such as a cathode indicator, a notch, or a shaped lead) are specified to prevent incorrect orientation during assembly.
7. Soldering and Assembly Guidelines
Proper handling ensures reliability.
7.1 Reflow Soldering Profile
A recommended temperature profile for reflow soldering is provided, including preheat, soak, reflow peak temperature, and cooling rates. Adhering to this profile prevents thermal damage to the LED package.
7.2 Handling and Storage Precautions
Instructions typically include protection from electrostatic discharge (ESD), recommendations for moisture sensitivity level (MSL) and baking procedures if needed, and general handling to avoid mechanical stress on the leads or lens.
8. Packaging and Ordering Information
8.1 Packaging Specifications
Details on how components are supplied: reel type (e.g., 7-inch or 13-inch), tape width, pocket spacing, and quantity per reel.
8.2 Labeling and Part Numbering
The full part number structure is explained, which often encodes information like color, flux bin, voltage bin, and package type. The label on the packaging will correspond to this part number and include the revision code (e.g., Rev. 2).
9. Application Notes and Design Considerations
9.1 Typical Application Circuits
Schematics for constant current driver circuits, appropriate for powering the LED, may be suggested. This includes considerations for series/parallel configurations and dimming methods.
9.2 Thermal Management Design
Guidance on PCB layout for heat dissipation, such as using thermal vias, adequate copper area, and possibly attaching to a heatsink. Calculations for estimating junction temperature based on applied power and thermal resistance are crucial.
9.3 Optical Design Considerations
Notes on the viewing angle, lens characteristics, and recommendations for secondary optics (like diffusers or reflectors) to achieve the desired light distribution.
10. Technical Comparison and Differentiation
While not explicitly stated in the snippet, a product's position can be inferred. A component with a "Revision 2" and "Forever" status is likely a mature, widely adopted part. Its advantages may include proven reliability, extensive field history, wide availability from distributors, and a stable specification that reduces design risk compared to newly introduced components. It may offer a favorable cost-performance ratio for established applications.
11. Frequently Asked Questions (FAQ)
Q: What does "Lifecycle Phase: Revision" mean for my design?
A: It means the component is in a stable production state. Its specifications are fixed for this revision, making it a low-risk choice for long-term or high-volume products, as you will not encounter unannounced changes.
Q: Why is the expiration "Forever"?
A: This indicates the datasheet for Revision 2 is considered a permanent reference document. The manufacturer commits to this specification indefinitely for this revision, even if the product is eventually discontinued. Future changes would require a new revision number (e.g., Revision 3).
Q: How critical is it to use Revision 2 of the datasheet?
A: It is essential. Always verify you have the correct revision. Using an older revision could mean your design is based on outdated electrical, optical, or mechanical data, potentially leading to performance issues or manufacturing defects.
Q: The release date is 2014. Is this product obsolete?
A: Not necessarily. A 2014 release date for a revision suggests a mature product. Many fundamental electronic components remain in production for decades. You should check the manufacturer's product status notification (PCN) or distributor stock for active/obsolete status.
12. Practical Use Case Examples
Case 1: Retrofit Lighting Design
An engineer designing an LED bulb to replace a 60W incandescent needs consistent color and brightness. By specifying components from a single, tight flux and CCT bin as defined in Revision 2 of this datasheet, they can ensure every bulb produced meets the same performance criteria, maintaining brand quality.
Case 2: Automotive Interior Lighting
An automotive tier-1 supplier requires components with proven long-term reliability and stable specifications. Selecting a part with a "Revision" lifecycle and "Forever" datasheet status reduces qualification risk. The precise mechanical drawings ensure the LED fits correctly into the housing, and the thermal data guides the design of the mounting to manage heat in a confined space.
13. Operational Principle Introduction
Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. This phenomenon, called electroluminescence, occurs when electrons recombine with electron holes within the device, releasing energy in the form of photons. The color of the light is determined by the energy band gap of the semiconductor material used. The structure typically involves a p-n junction housed in a package that includes a lead frame for electrical connection, a bond wire, a phosphor coating (for white LEDs), and a primary optic (lens). The datasheet provides the specific performance metrics and limits of this physical implementation.
14. Industry Trends and Developments
The electronics industry, including the LED sector, is characterized by continuous advancement. While this specific datasheet reflects a stable product from 2014, broader trends continue. These include increases in luminous efficacy (more lumens per watt), enabling higher brightness with lower power consumption and heat. There is a push towards higher color rendering indexes (CRI) and more precise color tuning for human-centric lighting. Miniaturization remains a trend, with components becoming smaller while maintaining or improving output. Integration is another key trend, with LED packages incorporating drivers, sensors, and control circuitry. Furthermore, the industry is increasingly focused on sustainability, with improvements in manufacturing processes and materials to reduce environmental impact. A component with a permanent revision status often represents a successful, optimized design within a particular technological generation.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |