LED Component Datasheet - Revision 2 - Lifecycle Information - Release Date 2013-08-02 - English Technical Document

1. Product Overview

This technical datasheet provides critical lifecycle and revision control information for a specific electronic component, likely an LED or related optoelectronic device. The core focus of this document is to establish the official status and versioning of the product specifications. The primary advantage offered by this document is the clear, standardized communication of the component's revision level and its permanent validity, which is crucial for design traceability, quality assurance, and long-term supply chain planning. This information is targeted at hardware design engineers, component engineers, quality assurance teams, and procurement specialists who require definitive data on the version of the component they are integrating into their products.

2. Lifecycle and Revision Information

The document repeatedly and consistently specifies a single, definitive state for the component.

2.1 Lifecycle Phase

The LifecyclePhase is explicitly stated as Revision. This indicates that the component is not in an initial design (Prototype) or end-of-life (Obsolete) phase. It is in a stable, production-ready state where the specifications have been reviewed and updated. This phase implies that the component is actively manufactured and supported, with any changes from previous versions formally documented under this revision control.

2.2 Revision Number

The revision level is clearly identified as 2. This is a key piece of information for ensuring that all parties in the design and manufacturing process are referencing the exact same set of specifications. Revision 2 supersedes any previous revisions (e.g., Revision 1 or initial release). Engineers must verify that their bill of materials (BOM) and assembly drawings reference this specific revision to avoid discrepancies in expected component performance or physical characteristics.

2.3 Release and Validity

The Release Date for this revision is 2013-08-02 14:06:09.0. This timestamp provides an exact point of origin for this document version. Furthermore, the Expired Period is declared as Forever. This is a significant declaration, meaning that this revision of the datasheet does not have a planned obsolescence date and is intended to remain the valid reference indefinitely, or until a subsequent revision (e.g., Revision 3) is officially released. This supports long-term product designs.

3. Technical Parameters and Specifications

While the provided PDF fragment focuses on administrative data, a complete datasheet for an electronic component would contain extensive technical parameters. The following sections detail the typical categories of information that would be included and should be cross-referenced with the official, full Revision 2 document.

3.1 Absolute Maximum Ratings

These parameters define the limits beyond which permanent damage to the component may occur. They are not intended for normal operation. Typical ratings include:

• Reverse Voltage (V_R): The maximum voltage that can be applied in the reverse direction.
• Forward Current (I_F): The maximum continuous forward current.
• Peak Forward Current (I_FP): The maximum allowable surge or pulsed current.
• Power Dissipation (P_D): The maximum power the device can dissipate.
• Operating and Storage Temperature Range (T_j, T_stg): The junction and ambient temperature limits.

Operating the component outside these ratings can lead to catastrophic failure.

3.2 Electro-Optical Characteristics

These parameters are measured under specific test conditions (typically at 25°C ambient temperature) and define the component's performance.

• Forward Voltage (V_F): The voltage drop across the device at a specified test current. This is crucial for driver circuit design.
• Luminous Intensity (I_V) or Luminous Flux (Φ_v): The light output, measured in millicandelas (mcd) or lumens (lm), at a specified current.
• Dominant Wavelength (λ_d) or Chromaticity Coordinates: Defines the color of the emitted light.
• Viewing Angle (2θ_½): The angular span where luminous intensity is at least half of the maximum intensity.

3.3 Thermal Characteristics

Thermal management is critical for LED performance and longevity.

• Thermal Resistance Junction-to-Ambient (R_θJA): Indicates how effectively heat is transferred from the semiconductor junction to the surrounding environment. A lower value signifies better thermal performance.
• Maximum Junction Temperature (T_{j max}): The highest allowable temperature at the semiconductor junction.

4. Binning and Classification System

Manufacturing variations lead to slight differences between individual components. A binning system categorizes parts based on key parameters to ensure consistency in application.

• Luminous Flux/Intensity Bin: Groups components based on their light output.
• Forward Voltage Bin: Groups components based on their V_F range.
• Chromaticity Bin: Groups components within a specific area on the CIE color chart to ensure color consistency, critical for multi-LED arrays.

The specific bin codes and their corresponding parameter ranges would be detailed in the full datasheet.

5. Performance Curves and Graphs

Graphical data provides insight into performance under varying conditions.

• Forward Current vs. Forward Voltage (I-V Curve): Shows the nonlinear relationship between current and voltage.
• Relative Luminous Flux vs. Forward Current: Shows how light output changes with drive current.
• Relative Luminous Flux vs. Junction Temperature: Demonstrates the thermal quenching effect; light output typically decreases as temperature increases.
• Spectral Distribution: A graph plotting relative intensity against wavelength, showing the purity and peak of the emitted color.

6. Mechanical and Package Information

This section includes dimensional drawings, which are essential for PCB layout.

• Package Outline Drawing: A diagram showing the component's exact dimensions (length, width, height) and tolerances.
• Land Pattern Design: The recommended PCB pad layout for soldering, ensuring proper mechanical attachment and thermal connection.
• Polarity Identification: Clear marking of the anode and cathode, often via a notch, cut corner, or marker on the package.
• Material and Finish: Information on the package material (e.g., PPA, PCT) and lead plating (e.g., matte tin).

7. Soldering and Assembly Guidelines

Proper handling is required to maintain reliability.

• Reflow Soldering Profile: A time-temperature graph specifying the recommended preheat, soak, reflow, and cooling phases. This includes peak temperature limits to avoid damaging the component or package.
• Hand Soldering Instructions: If applicable, guidelines for temperature and duration.
• Moisture Sensitivity Level (MSL): Indicates the packaging and baking requirements to prevent \"popcorning\" during reflow due to absorbed moisture.
• Storage Conditions: Recommended temperature and humidity ranges for storing unused components.

8. Packaging and Ordering Information

Details on how the component is supplied.

• Packaging Format: e.g., Tape and Reel (standard for automated assembly), dimensions of the reel, and orientation of parts in the tape.
• Quantity per Reel: e.g., 3000 pieces per 13-inch reel.
• Ordering Code / Part Number: The complete model number, which often encodes information like color, brightness bin, voltage bin, and packaging type. The full Revision 2 datasheet would provide the decoding for this part number.

9. Application Notes and Design Considerations

Guidance for implementing the component effectively.

• Current Driving: Recommendations for constant current drivers vs. resistor-based limiting to ensure stable light output and long life.
• Thermal Management: The importance of PCB thermal design, including the use of thermal vias, copper pours, and possibly heatsinks to keep the junction temperature low.
• ESD Precautions: Many optoelectronic devices are sensitive to electrostatic discharge. Proper ESD handling procedures should be followed during assembly.
• Optical Design: Considerations for lenses, diffusers, or reflectors when integrating the LED into a final product.

10. Technical Comparison and Differentiation

While not always in a single-component datasheet, this analysis is often done by engineers. Potential points of comparison with similar components could include higher luminous efficacy (more light per watt), lower thermal resistance for better high-current performance, a wider operating temperature range, or a more robust package material offering better resistance to humidity and UV exposure.

11. Frequently Asked Questions (FAQ)

Q: What does \"LifecyclePhase: Revision\" mean for my design?
A: It means the component is in a mature, stable production phase. The specifications are fixed under Rev. 2, providing a reliable foundation for a product with a long manufacturing lifespan.

Q: The Expired Period is \"Forever.\" Does this mean the component will never be discontinued?
A: It means this specific datasheet revision has no expiration. However, the component itself may eventually reach an \"Obsolete\" lifecycle phase in the future. The \"Forever\" status refers to the validity of the document's technical content, not an indefinite production guarantee.

Q: How critical is it to use the exact revision (Rev. 2) of the datasheet?
A: It is extremely critical. Different revisions may have changes in absolute maximum ratings, typical characteristics, binning structure, or mechanical drawings. Using an outdated revision can lead to design flaws, compliance issues, or manufacturing defects.

12. Practical Use Case Example

Consider an engineer designing a new indoor LED lighting panel. They select this component based on its photometric data from the Rev. 2 datasheet. They use the forward voltage (V_F) and thermal resistance (R_θJA) data to design an appropriate constant-current driver and calculate the necessary PCB copper area for heat sinking. The mechanical drawing is used to create the accurate land pattern in the PCB layout software. The engineer specifies the exact ordering code, including the desired luminous flux and chromaticity bin, on the BOM to ensure the panel has uniform brightness and color. The \"Forever\" expired period gives confidence that the specifications will not change unexpectedly during the product's multi-year production run.

13. Operating Principle

The component is based on solid-state electroluminescence. When a forward voltage exceeding the diode's threshold is applied, electrons recombine with holes within the semiconductor material (typically a compound like InGaN for blue/green or AlInGaP for red/amber). This recombination event releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor materials used in the active region. The package encapsulates the semiconductor die, provides electrical connections, and often includes a phosphor layer (for white LEDs) or a lens to shape the light output.

14. Industry Trends and Developments

The field of optoelectronics continues to advance rapidly. General trends observable in the industry include a continuous drive for higher luminous efficacy (lumens per watt), reducing the cost per lumen. There is also significant development in improved color rendering indices (CRI) for white LEDs, particularly for high-quality lighting applications. Miniaturization remains a trend, enabling new form factors. Furthermore, enhanced reliability and longer lifetime under higher operating temperatures are key research areas. The move towards smart, connected lighting systems is also driving the integration of control electronics alongside the LED emitter. The datasheet revision system, as seen in this document, is a fundamental part of managing these technological improvements and providing clear documentation for each product iteration.