1. Product Overview
The 6324-15SURC/S400-A9 is a high-brightness, brilliant red LED lamp designed for through-hole mounting. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) chip material encapsulated in a water-clear resin, delivering a dominant wavelength of 624 nm. This component is engineered for applications requiring reliable performance and consistent luminous output.
1.1 Core Features and Advantages
- High Brightness: Offers a typical luminous intensity of 320 millicandelas (mcd) at a standard drive current of 20mA.
- Wide Viewing Angle: Features a 100-degree half-intensity viewing angle (2θ1/2), providing a broad emission pattern suitable for indicator applications.
- Compliance and Reliability: The product is compliant with RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm), ensuring environmental safety and robust construction.
- Packaging Options: Available on tape and reel for automated assembly processes.
1.2 Target Applications
This LED is specifically designed for backlighting and status indication in consumer electronics and computing devices. Typical applications include:
- Television sets (TV)
- Computer monitors
- Telephones
- Desktop computers and peripherals
2. Technical Parameter Analysis
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.
- Continuous Forward Current (IF): 25 mA
- Peak Forward Current (IFP): 60 mA (at 1/10 duty cycle, 1 kHz)
- Reverse Voltage (VR): 5 V
- Power Dissipation (Pd): 60 mW
- Operating Temperature (Topr): -40°C to +85°C
- Storage Temperature (Tstg): -40°C to +100°C
- Soldering Temperature (Tsol): 260°C for 5 seconds maximum.
2.2 Electro-Optical Characteristics (Ta=25°C)
The following parameters are measured under standard test conditions (IF = 20mA) and represent the device's typical performance.
- Luminous Intensity (Iv): Minimum 160 mcd, Typical 320 mcd.
- Viewing Angle (2θ1/2): Typical 100 degrees.
- Peak Wavelength (λp): Typical 632 nm.
- Dominant Wavelength (λd): Typical 624 nm. This is the wavelength perceived by the human eye.
- Spectrum Radiation Bandwidth (Δλ): Typical 20 nm, defining the spectral purity.
- Forward Voltage (VF): Minimum 1.7 V, Typical 2.0 V, Maximum 2.4 V.
- Reverse Current (IR): Maximum 10 μA at VR = 5V.
Note: Measurement uncertainties are specified for forward voltage (±0.1V), luminous intensity (±10%), and dominant wavelength (±1.0nm).
3. Performance Curve Analysis
The datasheet provides several characteristic curves that are crucial for design engineers.
3.1 Relative Intensity vs. Wavelength
This curve shows the spectral power distribution, peaking at 632 nm with a typical bandwidth of 20 nm, confirming the brilliant red color output.
3.2 Directivity Pattern
The radiation pattern illustrates the 100-degree viewing angle, showing how light intensity decreases from the center axis.
3.3 Forward Current vs. Forward Voltage (I-V Curve)
This graph demonstrates the exponential relationship between current and voltage, typical for a diode. The typical forward voltage is 2.0V at 20mA.
3.4 Relative Intensity vs. Forward Current
Shows that luminous output increases with drive current. It is essential for determining the required current to achieve a desired brightness level.
3.5 Temperature Dependence
Two key graphs are provided:
Relative Intensity vs. Ambient Temperature: Shows that luminous output typically decreases as ambient temperature rises. Proper heat management is critical to maintain brightness.
Forward Current vs. Ambient Temperature: Can be used to understand how the device's electrical behavior changes with temperature.
4. Mechanical and Package Information
4.1 Package Dimensions
The LED features a standard 3mm radial leaded package. Key dimensional notes include:
- All dimensions are in millimeters (mm).
- The height of the flange must be less than 1.5mm (0.059\").
- Standard tolerance is ±0.25mm unless otherwise specified.
(Note: The exact numerical dimensions from the PDF drawing are not provided in the text, but the drawing would show lead spacing, body diameter, and overall height.)
5. Assembly and Handling Guidelines
5.1 Lead Forming
- Bend leads at a point at least 3mm from the epoxy bulb base.
- Perform forming before soldering to avoid stress on the solder joint.
- Avoid stressing the package; improper handling can damage internal connections or crack the epoxy.
- Cut leads at room temperature.
- Ensure PCB holes align perfectly with LED leads to prevent mounting stress.
5.2 Storage Conditions
- Recommended storage: ≤30°C and ≤70% Relative Humidity (RH).
- Shelf life after shipment: 3 months under these conditions.
- For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
- Avoid rapid temperature changes in humid environments to prevent condensation.
5.3 Soldering Recommendations
Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
Hand Soldering:
- Iron tip temperature: Maximum 300°C (for a 30W max iron).
- Soldering time: Maximum 3 seconds per lead.
Wave (DIP) Soldering:
- Preheat temperature: Maximum 100°C (for 60 seconds max).
- Solder bath temperature & time: Maximum 260°C for 5 seconds.
- Follow the recommended soldering profile (preheat, laminar wave, cooling).
Critical Soldering Notes:
- Avoid stress on leads during high-temperature operations.
- Do not solder (dip or hand) more than once.
- Protect the LED from mechanical shock until it cools to room temperature after soldering.
- Avoid rapid cooling from peak temperature.
- Always use the lowest effective soldering temperature.
5.4 Cleaning
- If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
- Dry at room temperature before use.
- Avoid ultrasonic cleaning. If absolutely required, pre-qualify the process to ensure no damage occurs, as power and assembly conditions significantly affect risk.
5.5 Heat Management
- Thermal management must be considered during the application design phase.
- De-rate the operating current appropriately by referring to the derating curve (implied in the datasheet).
- Control the ambient temperature around the LED within the application.
5.6 ESD (Electrostatic Discharge) Sensitivity
The device is sensitive to electrostatic discharge and surge voltage. ESD can damage the semiconductor junction. Proper ESD handling procedures (use of grounded workstations, wrist straps, etc.) must be followed during assembly and handling.
6. Packaging and Ordering Information
6.1 Packing Specification
- Primary Packing: Anti-electrostatic bags.
- Secondary Packing: Inner cartons.
- Tertiary Packing: Outside cartons.
- Packing Quantities:
1. Minimum 200 to 500 pieces per bag. 5 bags per inner carton.
2. 10 inner cartons per outside carton.
6.2 Label Explanation
Labels on packaging contain the following information codes:
- CPN: Customer's Production Number
- P/N: Production Number (Part Number)
- QTY: Packing Quantity
- CAT: Ranks of Luminous Intensity (Brightness bin)
- HUE: Ranks of Dominant Wavelength (Color bin)
- REF: Ranks of Forward Voltage (Voltage bin)
- LOT No: Manufacturing Lot Number for traceability.
7. Application Design Considerations
7.1 Circuit Design
Always use a current-limiting resistor in series with the LED. The resistor value can be calculated using Ohm's Law: R = (Vsupply - VF) / IF. Use the maximum forward voltage (2.4V) from the datasheet for a robust design that ensures the current does not exceed the maximum rating even with component tolerances.
7.2 Thermal Design
For continuous operation at high ambient temperatures or near maximum current, consider the derating of luminous intensity and the increase in forward voltage. Ensure adequate ventilation or heat sinking if the LED is driven at or near its maximum ratings to maintain longevity and performance.
7.3 Optical Design
The 100-degree viewing angle makes this LED suitable for wide-area illumination or indicators that need to be visible from various angles. For focused beams, external lenses or reflectors would be required.
8. Technical Comparison and Differentiation
Compared to older technology red LEDs (e.g., using GaAsP substrates), this AlGaInP-based LED offers significantly higher luminous efficiency, resulting in greater brightness (mcd/mA) and a more saturated, brilliant red color. Its compliance with modern environmental standards (RoHS, Halogen-Free) also makes it suitable for contemporary electronic products with strict material requirements.
9. Frequently Asked Questions (FAQ)
9.1 What is the difference between peak wavelength and dominant wavelength?
Peak wavelength (632 nm) is the point of maximum radiant power in the emission spectrum. Dominant wavelength (624 nm) is the single wavelength perceived by the human eye that matches the color of the LED. Designers typically refer to dominant wavelength for color specification.
9.2 Can I drive this LED at 25mA continuously?
While the absolute maximum continuous current is 25mA, for reliable long-term operation and to account for temperature effects, it is advisable to design for a lower drive current, such as the typical test condition of 20mA. Always refer to the derating curves for high-temperature operation.
9.3 Why is the soldering distance (3mm) from the bulb so important?
This distance prevents excessive heat from traveling up the lead and damaging the internal semiconductor die or the epoxy encapsulation, which could lead to premature failure or reduced light output.
10. Practical Application Example
Scenario: Designing a power indicator for a device using a 5V supply rail.
Calculation: To achieve typical brightness, target IF = 20mA. Using the maximum VF for safety (2.4V).
R = (5V - 2.4V) / 0.020A = 130 Ohms.
The nearest standard resistor value is 130Ω or 120Ω. A 120Ω resistor would result in a slightly higher current: I = (5V-2.4V)/120Ω ≈ 21.7mA, which is still within the safe operating area. The power dissipated in the resistor is P = I²R = (0.0217)² * 120 ≈ 0.056W, so a standard 1/8W (0.125W) resistor is sufficient.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |