LED Lamp 7343-2SURD/S530-A3 Datasheet - 3.0x1.6x1.9mm - 2.0V - 40mW - Brilliant Red - English Technical Documentation

1. Product Overview

This document provides the complete technical specifications for the 7343-2SURD/S530-A3 LED lamp. This component is a surface-mount device (SMD) designed for applications requiring reliable performance and consistent light output. The primary design focus is on providing a stable brilliant red light source suitable for various electronic indicators and backlighting applications.

1.1 Core Advantages

The LED offers several key advantages that make it suitable for industrial and consumer electronics. It is available in a choice of various viewing angles to suit different application needs. The product is supplied on tape and reel for compatibility with automated pick-and-place assembly processes, enhancing manufacturing efficiency. It is designed to be reliable and robust, ensuring long-term performance. Furthermore, the device is compliant with major environmental regulations, including the EU RoHS directive, the EU REACH regulation, and is manufactured as halogen-free (with Bromine <900 ppm, Chlorine <900 ppm, and Br+Cl < 1500 ppm).

1.2 Target Market & Applications

This LED series is specially engineered for applications demanding higher brightness levels. The lamps are available with different colors and intensities. Typical application areas include television sets, computer monitors, telephones, and general computer peripherals where status indication or backlighting is required.

2. Technical Parameter Deep Dive

A thorough understanding of the device's limits and operating characteristics is crucial for reliable circuit design and ensuring product longevity.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed. All values are specified at an ambient temperature (Ta) of 25°C.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be continuously applied to the LED.
• Peak Forward Current (IFP): 60 mA. This is the maximum pulsed current, permissible under a duty cycle of 1/10 at a frequency of 1 kHz.
• Reverse Voltage (VR): 5 V. Applying a reverse voltage exceeding this value can cause breakdown.
• Power Dissipation (Pd): 60 mW. This is the maximum power the device can dissipate.
• Operating Temperature (Topr): -40°C to +85°C. The ambient temperature range for normal operation.
• Storage Temperature (Tstg): -40°C to +100°C. The temperature range for storing the device when not powered.
• Soldering Temperature (Tsol): 260°C for 5 seconds. The maximum temperature and time for soldering processes.

2.2 Electro-Optical Characteristics

These parameters define the typical performance of the LED under normal operating conditions (Ta=25°C, IF=20mA unless otherwise stated). The values are crucial for optical design.

• Luminous Intensity (Iv): 160 mcd (Min), 320 mcd (Typ). This is the measure of perceived light power emitted.
• Viewing Angle (2θ1/2): 40° (Typ). The angle at which the luminous intensity is half of the peak intensity.
• Peak Wavelength (λp): 632 nm (Typ). The wavelength at which the spectral emission is maximum.
• Dominant Wavelength (λd): 624 nm (Typ). The single wavelength perceived by the human eye, defining the color.
• Spectrum Radiation Bandwidth (Δλ): 20 nm (Typ). The width of the emitted spectrum at half the peak intensity.
• Forward Voltage (VF): 1.7V (Min), 2.0V (Typ), 2.4V (Max) at IF=20mA. The voltage drop across the LED when conducting.
• Reverse Current (IR): 10 μA (Max) at VR=5V. The small leakage current when the device is reverse-biased.

2.3 Device Selection and Binning

The LED uses an AlGaInP (Aluminum Gallium Indium Phosphide) chip material to produce a Brilliant Red emitted color. The resin color is red diffused. The datasheet indicates a binning system referenced by labels such as CAT (for ranks of Radiometric Intensity and Forward Voltage) and HUE (for color reference). Designers should consult specific binning information from the manufacturer for precise color and intensity matching in production.

3. Performance Curve Analysis

The provided characteristic curves offer deeper insight into the device's behavior under varying conditions.

3.1 Spectral and Angular Distribution

The Relative Intensity vs. Wavelength curve shows the typical emission spectrum centered around 632 nm with a bandwidth of approximately 20 nm, confirming the brilliant red color. The Directivity curve visually represents the 40-degree viewing angle, showing how light intensity decreases from the center axis.

3.2 Electrical and Thermal Relationships

The Forward Current vs. Forward Voltage (IV Curve) demonstrates the diode's exponential characteristic. At the typical operating point of 20mA, the forward voltage is around 2.0V. The Relative Intensity vs. Forward Current curve shows that light output increases with current but may become sub-linear at higher currents due to heating and efficiency droop. The Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature curves are critical for thermal management. They show that luminous intensity decreases as temperature rises, and the forward voltage has a negative temperature coefficient (decreases with increasing temperature).

4. Mechanical & Package Information

4.1 Package Dimensions

The LED is housed in a 7343 surface-mount package. Key dimensions include a body length of approximately 3.0 mm, a width of 1.6 mm, and a height of 1.9 mm. The flange height must be less than 1.5 mm. Standard dimensional tolerance is ±0.25 mm unless otherwise specified. The detailed mechanical drawing should be referenced for exact pad layout, lead spacing, and overall geometry for PCB footprint design.

4.2 Polarity Identification

The cathode is typically indicated by a visual marker on the package, such as a notch, a dot, or a green marking on the tape. Correct polarity must be observed during assembly to prevent damage.

5. Soldering & Assembly Guidelines

Proper handling is essential to maintain device integrity and performance.

5.1 Lead Forming (If Applicable)

If leads require forming, it must be done before soldering. The bend should be at least 3 mm from the base of the epoxy bulb to avoid stress. Avoid stressing the package, and cut leads at room temperature. PCB holes must align perfectly with LED leads to prevent mounting stress.

5.2 Soldering Process

Hand Soldering: Iron tip temperature should not exceed 300°C (for a max 30W iron), with soldering time limited to 3 seconds per lead. Maintain a minimum distance of 3 mm from the solder joint to the epoxy bulb.
Wave/DIP Soldering: Preheat temperature should not exceed 100°C for a maximum of 60 seconds. The solder bath temperature must not exceed 260°C, with a dwell time of 5 seconds maximum. Again, maintain a 3 mm distance from the joint to the bulb. A recommended soldering profile is provided, showing the temperature ramp-up, preheat, time above liquidus, and cooldown phases. Dip or hand soldering should not be performed more than once. Avoid stress on leads during high-temperature phases and allow the LED to cool gradually to room temperature after soldering.

5.3 Cleaning

If cleaning is necessary, use isopropyl alcohol at room temperature for no more than one minute, followed by air drying. Ultrasonic cleaning is not recommended as it can cause mechanical damage to the LED structure. If absolutely required, extensive pre-qualification is necessary.

5.4 Storage Conditions

LEDs should be stored at 30°C or less and 70% relative humidity or less. The recommended storage life after shipping is 3 months. For longer storage (up to one year), use a sealed container with a nitrogen atmosphere and moisture-absorbent material. Avoid rapid temperature transitions in humid environments to prevent condensation.

6. Thermal Management & Design Considerations

6.1 Heat Management

Effective heat dissipation is critical for LED performance and lifetime. The current should be de-rated appropriately based on the ambient operating temperature, as indicated by de-rating curves (refer to the specific product specification for the exact curve). The temperature surrounding the LED in the final application must be controlled. Designers must ensure adequate PCB copper area or other heat sinking methods to keep the junction temperature within safe limits.

6.2 ESD (Electrostatic Discharge) Precautions

LEDs are sensitive to electrostatic discharge. Standard ESD handling procedures should be followed during all stages of assembly and handling. This includes the use of grounded workstations, wrist straps, and conductive containers.

7. Packaging & Ordering Information

7.1 Packing Specification

The LEDs are packed using moisture-resistant, anti-static materials to protect against electrostatic and electromagnetic fields. The standard packing flow is: LEDs are placed in an anti-electrostatic bag. Multiple bags are placed in an inner carton. Multiple inner cartons are packed into an outside carton for shipment.

7.2 Label Explanation & Packing Quantity

Labels include: CPN (Customer's Product Number), P/N (Product Number), QTY (Packing Quantity), CAT (Ranks of Radiometric Intensity and Forward Voltage), HUE (Color Reference), and REF (General Reference).
Standard packing quantities are: Minimum 200 to 500 pieces per bag, 5 bags per inner carton, and 10 inner cartons per outside master carton.

8. Application Notes & Design Case Study

8.1 Typical Application Circuit

In a typical application, the LED is driven by a constant current source or through a current-limiting resistor connected in series with a voltage supply. The series resistor value (R_s) can be calculated using Ohm's Law: R_s = (V_supply - V_F) / I_F, where V_F is the forward voltage of the LED (use typical or max value for reliability) and I_F is the desired forward current (e.g., 20mA). For a 5V supply and a V_F of 2.0V, R_s = (5V - 2.0V) / 0.020A = 150 Ohms. A resistor with a power rating of at least I_F^2 * R_s = 0.06W should be selected.

8.2 Design Considerations for Monitor Backlighting

When used as a status indicator in a monitor, consider the required viewing angle (40° is suitable for many front-panel applications). The brilliant red color offers high contrast against typical bezel colors. Ensure the drive current does not exceed the continuous rating, especially in enclosed spaces where ambient temperature might rise. The long-term stability and RoHS compliance are key factors for consumer electronics manufacturing.

9. Technical Comparison & FAQs

9.1 Differentiation

Compared to older through-hole red LEDs, this SMD package offers a much smaller footprint, lower profile, and compatibility with automated assembly. The AlGaInP technology provides higher efficiency and more saturated color compared to older technologies like GaAsP.

9.2 Frequently Asked Questions

Q: Can I drive this LED at 30mA for higher brightness?
A: No. The Absolute Maximum Rating for continuous forward current is 25 mA. Exceeding this rating risks permanent damage and reduced lifetime. Always operate within the specified limits.
Q: What is the difference between Peak Wavelength and Dominant Wavelength?
A: Peak Wavelength is the physical peak of the emission spectrum. Dominant Wavelength is the single wavelength that would match the perceived color. For LEDs, they are often close but not identical.
Q: Is a heat sink required?
A: For operation at the maximum rated current (25mA) or in high ambient temperatures, proper thermal management via PCB design is necessary. Refer to the de-rating curves for guidance.