Table of Contents
- 1. Product Overview
- 1.1 Core Features and Advantages
- 1.2 Product Description
- 1.3 Target Applications
- 2. Technical Specifications and In-Depth Analysis
- 2.1 Device Selection and Material
- 2.2 Absolute Maximum Ratings
- 2.3 Electro-Optical Characteristics (Ta=25°C)
- 3. Performance Curve Analysis
- 3.1 Relative Intensity vs. Wavelength
- 3.2 Directivity Pattern
- 3.3 Forward Current vs. Forward Voltage (I-V Curve)
- 3.4 Relative Intensity vs. Forward Current
- 3.5 Temperature Dependence
- 4. Mechanical and Packaging Information
- 4.1 Package Dimensions
- 4.2 Polarity Identification
- 5. Binning and Ordering Information
- 5.1 Label Explanation
- 5.2 Packing Specification
- 6. Assembly, Handling, and Application Guidelines
- 6.1 Lead Forming
- 6.2 Storage Conditions
- 6.3 Soldering Instructions
- 6.4 Cleaning
- 6.5 Heat Management
- 7. Application Suggestions and Design Considerations
- 7.1 Driving Circuit Design
- 7.2 PCB Layout and Mounting
- 7.3 Long-Term Reliability
- 8. Frequently Asked Questions (Based on Technical Parameters)
- 8.1 What is the difference between Peak Wavelength and Dominant Wavelength?
- 8.2 Can I drive this LED with a 3.3V supply?
- 8.3 Why is the viewing angle so wide (130°)?
- 8.4 How does temperature affect brightness?
- 9. Technical Principles and Trends
- 9.1 Operating Principle
- 9.2 Industry Context and Trends
1. Product Overview
This document provides the complete technical specifications and application guidelines for the 484-10SURT/S530-A3 series LED lamp. This component is a discrete light-emitting diode designed for applications requiring reliable illumination with specific color and intensity characteristics.
1.1 Core Features and Advantages
The LED offers several key features that make it suitable for a variety of electronic applications:
- Viewing Angle Options: Available with various viewing angles to suit different application needs.
- Packaging: Supplied on tape and reel for compatibility with automated assembly processes.
- Robustness: Designed to be reliable and robust under standard operating conditions.
- Environmental Compliance: The product complies with RoHS (Restriction of Hazardous Substances), EU REACH regulations, and is Halogen Free, with limits for Bromine (Br) and Chlorine (Cl) as specified.
1.2 Product Description
This LED series is specially engineered to deliver higher brightness levels. The lamps are available in different colors and luminous intensities, allowing designers to select the optimal component for their visual indicator or backlighting needs. The specific model covered here emits a Brilliant Red color.
1.3 Target Applications
Typical applications for this LED include, but are not limited to:
- Television sets
- Computer monitors
- Telephones
- General computer and electronic equipment
2. Technical Specifications and In-Depth Analysis
2.1 Device Selection and Material
The light-emitting chip is constructed from AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. This material system is known for producing high-efficiency red, orange, and yellow LEDs. The resin encapsulant is red and transparent, optimized for the Brilliant Red emitted color.
2.2 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.
- Continuous Forward Current (IF): 25 mA
- Peak Forward Current (IFP): 60 mA (at 1/10 duty cycle, 1 kHz)
- Reverse Voltage (VR): 5 V
- Power Dissipation (Pd): 60 mW
- Operating Temperature (Topr): -40°C to +85°C
- Storage Temperature (Tstg): -40°C to +100°C
- Soldering Temperature (Tsol): 260°C for 5 seconds (wave or reflow)
2.3 Electro-Optical Characteristics (Ta=25°C)
These are the typical performance parameters measured under standard test conditions (IF = 20 mA).
- Luminous Intensity (Iv): Typical 20 mcd (Minimum 10 mcd). This quantifies the perceived brightness of the red light.
- Viewing Angle (2θ1/2): Typical 130 degrees. This is the full angle at which the luminous intensity is half of the peak intensity.
- Peak Wavelength (λp): Typical 632 nm. The wavelength at which the spectral emission is strongest.
- Dominant Wavelength (λd): Typical 624 nm. The single wavelength perceived by the human eye, defining the color.
- Spectrum Radiation Bandwidth (Δλ): Typical 20 nm. The width of the emitted spectrum.
- Forward Voltage (VF): Typical 2.0 V (Range: 1.7 V to 2.4 V). The voltage drop across the LED when operating.
- Reverse Current (IR): Maximum 10 μA at VR=5V.
Note: Measurement uncertainties are provided for key parameters: VF (±0.1V), Iv (±10%), λd (±1.0nm).
3. Performance Curve Analysis
The datasheet includes several characteristic curves that illustrate device behavior under varying conditions. These are crucial for circuit design and thermal management.
3.1 Relative Intensity vs. Wavelength
This curve shows the spectral power distribution, peaking around 632 nm (red) with a typical bandwidth of 20 nm, confirming the Brilliant Red color.
3.2 Directivity Pattern
A polar plot illustrating the 130-degree typical viewing angle, showing how light intensity decreases at angles off the central axis.
3.3 Forward Current vs. Forward Voltage (I-V Curve)
This graph shows the exponential relationship between current and voltage. The typical forward voltage of 2.0V at 20mA is a key parameter for calculating series resistor values in driving circuits.
3.4 Relative Intensity vs. Forward Current
This curve demonstrates that light output (intensity) increases with forward current, but not necessarily linearly across the entire range. It helps in selecting an appropriate drive current for desired brightness.
3.5 Temperature Dependence
Two critical curves are provided:
- Relative Intensity vs. Ambient Temperature: Shows how light output typically decreases as the ambient temperature rises. This is a key consideration for applications in high-temperature environments.
- Forward Current vs. Ambient Temperature: May illustrate how the forward voltage characteristic shifts with temperature, affecting the drive circuit's behavior.
4. Mechanical and Packaging Information
4.1 Package Dimensions
A detailed mechanical drawing is provided specifying the physical size of the LED lamp. Key notes include:
- All dimensions are in millimeters (mm).
- The flange height must be less than 1.5mm (0.059\").
- The default tolerance is ±0.25mm unless otherwise specified.
4.2 Polarity Identification
The cathode is typically indicated by a flat spot on the lens, a shorter lead, or other marking as shown in the dimension diagram. Correct polarity must be observed during installation.
5. Binning and Ordering Information
5.1 Label Explanation
Product labels contain several codes for traceability and specification:
- CPN: Customer's Production Number
- P/N: Production Number (e.g., 484-10SURT/S530-A3)
- QTY: Packing Quantity
- CAT: Ranks of Luminous Intensity (Brightness bin)
- HUE: Ranks of Dominant Wavelength (Color bin)
- REF: Ranks of Forward Voltage (Voltage bin)
- LOT No: Manufacturing Lot Number
5.2 Packing Specification
The LEDs are packed to prevent damage from electrostatic discharge (ESD) and moisture:
- Primary Packing: Anti-electrostatic bags.
- Secondary Packing: Inner cartons.
- Tertiary Packing: Outside cartons for shipping.
- Packing Quantity: Typically 200 to 1000 pieces per bag, 5 bags per inner carton, and 10 inner cartons per outside carton.
6. Assembly, Handling, and Application Guidelines
6.1 Lead Forming
If leads need to be bent for through-hole mounting:
- Bend at a point at least 3mm from the base of the epoxy bulb.
- Perform bending before soldering.
- Avoid stressing the LED package; stress can damage internal connections or crack the epoxy.
- Cut leads at room temperature.
- Ensure PCB holes align perfectly with LED leads to avoid mounting stress.
6.2 Storage Conditions
To preserve solderability and performance:
- Store at ≤30°C and ≤70% Relative Humidity.
- Standard storage life is 3 months from shipment.
- For longer storage (up to 1 year), use a sealed container with nitrogen atmosphere and desiccant.
- Avoid rapid temperature changes in humid environments to prevent condensation.
6.3 Soldering Instructions
Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
Hand Soldering:
- Iron tip temperature: 300°C Max. (30W Max. iron)
- Soldering time per lead: 3 seconds Max.
Wave/Dip Soldering:
- Preheat temperature: 100°C Max. (60 seconds Max.)
- Solder bath temperature & time: 260°C Max., 5 seconds Max.
A recommended soldering temperature profile graph is provided, showing preheat, soak, reflow, and cooling phases. Key additional notes:
- Avoid mechanical stress on leads while the LED is hot.
- Do not solder (dip or hand) more than once.
- Protect the LED from shock/vibration until it cools to room temperature after soldering.
- Do not use rapid cooling processes.
- Use the lowest possible soldering temperature that achieves a reliable joint.
6.4 Cleaning
- If cleaning is necessary, use isopropyl alcohol at room temperature for no more than one minute.
- Dry at room temperature before use.
- Avoid ultrasonic cleaning. If absolutely required, pre-qualify the process parameters (power, time) to ensure no damage occurs.
6.5 Heat Management
The datasheet emphasizes that thermal management must be considered during the application design phase. The operating current should be derated appropriately if the LED is used in high ambient temperatures or on a PCB with poor heat dissipation to ensure longevity and maintain light output. Exceeding the maximum junction temperature will accelerate light output degradation and can lead to premature failure.
7. Application Suggestions and Design Considerations
7.1 Driving Circuit Design
To operate this LED, a current-limiting device (usually a resistor) is mandatory. The resistor value (Rs) can be calculated using Ohm's Law: Rs = (Vsupply - VF) / IF. Use the maximum VF from the datasheet (2.4V) for a conservative design to ensure the current does not exceed 20mA even with component tolerances. For example, with a 5V supply: Rs = (5V - 2.4V) / 0.020A = 130 Ohms. A standard 130Ω or 150Ω resistor would be suitable.
7.2 PCB Layout and Mounting
Ensure the PCB footprint matches the package dimensions. Provide adequate clearance around the LED body. For through-hole mounting, hole sizes should accommodate the lead diameter without excessive force. For best optical performance, consider the viewing angle when positioning the LED on the board relative to the intended viewer or light guide.
7.3 Long-Term Reliability
Operating the LED significantly below its maximum ratings (current, temperature) will enhance its long-term reliability and maintain stable luminous intensity over time. Consider using a constant-current driver for applications requiring precise and stable brightness.
8. Frequently Asked Questions (Based on Technical Parameters)
8.1 What is the difference between Peak Wavelength and Dominant Wavelength?
Peak Wavelength (632 nm) is the physical wavelength where the spectral emission is strongest. Dominant Wavelength (624 nm) is the psychophysical single wavelength that the human eye perceives as matching the color of the LED. They often differ, especially for saturated colors.
8.2 Can I drive this LED with a 3.3V supply?
Yes. Using the calculation above: Rs = (3.3V - 2.4V) / 0.020A = 45 Ohms. A 47Ω resistor would be appropriate. Ensure the power rating of the resistor is sufficient (P = I2R = 0.022 * 47 = 0.0188W, so a 1/8W or 1/10W resistor is fine).
8.3 Why is the viewing angle so wide (130°)?
A wide viewing angle is beneficial for applications where the indicator needs to be visible from a broad range of positions, such as status lights on consumer electronics placed on a desk. The lens design diffuses the light to create this wide pattern.
8.4 How does temperature affect brightness?
As shown in the performance curves, the relative luminous intensity typically decreases as the ambient temperature increases. For high-temperature applications, you may need to select an LED from a higher brightness bin initially or implement thermal management to keep the junction temperature lower.
9. Technical Principles and Trends
9.1 Operating Principle
This LED operates on the principle of electroluminescence in a semiconductor p-n junction. When a forward voltage is applied, electrons and holes are injected into the active region (the AlGaInP layer) where they recombine. This recombination releases energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn dictates the wavelength (color) of the emitted light—in this case, Brilliant Red.
9.2 Industry Context and Trends
Discrete LED lamps like this one represent a mature and highly reliable technology for indicator and simple lighting functions. While high-power LEDs for illumination and advanced packages like chip-scale LEDs (CSP) are areas of rapid development, through-hole and low-power SMD LEDs continue to be essential for cost-effective, reliable signaling in countless electronic products. Trends in this segment focus on increasing efficiency (more light output per mA), improving color consistency through tighter binning, and enhancing reliability under harsh conditions. The drive for miniaturization also continues, though packages like the 484 series offer a good balance of size, ease of handling, and optical performance.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |