LED Lamp 313-2UYD/S530-A3 Datasheet - Brilliant Yellow - 20mA - 2.0V - English Technical Document

1. Product Overview

This document provides the technical specifications for a high-brightness, Brilliant Yellow LED lamp. The device is designed using AlGaInP chip technology, encapsulated in a yellow diffused resin, making it suitable for applications requiring enhanced visibility and reliable performance. The series offers a choice of various viewing angles and is available in tape and reel packaging for automated assembly processes.

The product is engineered to be robust and reliable, complying with key environmental and safety standards including RoHS, EU REACH, and Halogen-Free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). Its primary design goal is to deliver higher brightness levels for a range of consumer and industrial electronic applications.

2. Technical Parameters Deep Objective Interpretation

2.1 Absolute Maximum Ratings

The device's operational limits are defined under conditions of Ta=25°C. Exceeding these ratings may cause permanent damage.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be applied continuously.
• Peak Forward Current (IFP): 60 mA. This rating applies under pulsed conditions with a duty cycle of 1/10 at 1 kHz.
• Reverse Voltage (VR): 5 V. Applying a reverse voltage beyond this limit can damage the LED junction.
• Power Dissipation (Pd): 60 mW. This is the maximum power the package can dissipate.
• Operating Temperature (Topr): -40 to +85 °C. The ambient temperature range for reliable operation.
• Storage Temperature (Tstg): -40 to +100 °C. The safe temperature range for storing the device when not in operation.
• Soldering Temperature (Tsol): 260 °C for 5 seconds. The maximum temperature and time tolerance for soldering processes.

2.2 Electro-Optical Characteristics

Key performance parameters are measured at Ta=25°C and a forward current (IF) of 20 mA, which is the typical operating point.

• Luminous Intensity (Iv): Typical value is 200 mcd, with a minimum of 100 mcd. This parameter indicates the perceived brightness of the yellow light output. Measurement uncertainty is ±10%.
• Viewing Angle (2θ1/2): Typical value is 50 degrees. This defines the angular spread where the luminous intensity is at least half of its peak value.
• Peak Wavelength (λp): Typical value is 591 nm. This is the wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λd): Typical value is 589 nm. This is the single wavelength perceived by the human eye, representing the color of the LED. Measurement uncertainty is ±1.0 nm.
• Spectrum Radiation Bandwidth (Δλ): Typical value is 15 nm. This indicates the spectral width of the emitted light.
• Forward Voltage (VF): Typical value is 2.0 V, ranging from a minimum of 1.7 V to a maximum of 2.4 V at 20 mA. Measurement uncertainty is ±0.1 V.
• Reverse Current (IR): Maximum value is 10 μA when a reverse voltage (VR) of 5 V is applied.

3. Binning System Explanation

The product utilizes a binning system to categorize devices based on key optical and electrical parameters, ensuring consistency in application design. The labels on the packaging indicate these bins.

• CAT (Ranks of Luminous Intensity): This code categorizes the LED based on its measured luminous intensity output.
• HUE (Ranks of Dominant Wavelength): This code categorizes the LED based on its dominant wavelength, which correlates to the precise shade of yellow.
• REF (Ranks of Forward Voltage): This code categorizes the LED based on its forward voltage drop at the test current.

This binning allows designers to select LEDs with tightly controlled characteristics for applications where color or brightness uniformity is critical.

4. Performance Curve Analysis

The datasheet includes several characteristic curves that illustrate the device's behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution of the emitted light, centered around the 591 nm peak wavelength with a typical bandwidth of 15 nm, confirming the Brilliant Yellow color.

4.2 Directivity Pattern

This plot visualizes the spatial distribution of light, corresponding to the 50-degree typical viewing angle, showing how intensity decreases from the center axis.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This graph depicts the exponential relationship between forward voltage and current. The typical VF of 2.0V at 20mA is a key point on this curve. It is essential for designing the current-limiting circuitry.

4.4 Relative Intensity vs. Forward Current

This curve shows how light output increases with forward current. It is generally linear within the operating range but will saturate at higher currents. Operating at the recommended 20mA ensures optimal efficiency and longevity.

4.5 Relative Intensity vs. Ambient Temperature

This curve demonstrates the negative temperature coefficient of luminous output. As ambient temperature (Ta) increases, the relative light output decreases. This is crucial for thermal management in the application.

4.6 Forward Current vs. Ambient Temperature

This graph likely illustrates the relationship between forward current and temperature under constant voltage or power conditions, informing de-rating practices.

5. Mechanical and Package Information

5.1 Package Dimension Drawing

The datasheet provides a detailed mechanical drawing of the LED package. Key dimensions include the overall body size, lead spacing, and epoxy lens shape. All dimensions are in millimeters (mm).

Critical Notes:

• The height of the flange must be less than 1.5mm (0.059\").
• Unless otherwise specified, the general tolerance for dimensions is ±0.25mm.

5.2 Polarity Identification

The cathode (negative) lead is typically identified in the dimension drawing, often by a flat spot on the lens, a notch in the package, or a shorter lead. Correct polarity must be observed during PCB mounting.

6. Soldering and Assembly Guidelines

Proper handling is critical to maintain device reliability and performance.

6.1 Lead Forming

• Bend leads at a point at least 3mm from the base of the epoxy bulb.
• Perform lead forming before soldering.
• Avoid stressing the LED package during forming to prevent internal damage or breakage.
• Cut lead frames at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

6.2 Storage

• Store at ≤30°C and ≤70% Relative Humidity (RH) after receipt. Shelf life under these conditions is 3 months.
• For storage beyond 3 months, use a sealed container with a nitrogen atmosphere and desiccant for up to one year.
• Avoid rapid temperature changes in high humidity to prevent condensation.

6.3 Soldering Process

General Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering:

• Iron tip temperature: Max 300°C (for a max 30W iron).
• Soldering time per lead: Max 3 seconds.

Wave (DIP) Soldering:

• Preheat temperature: Max 100°C (for max 60 seconds).
• Soldering bath temperature & time: Max 260°C for 5 seconds.

Critical Soldering Notes:

• Avoid stress on leads at high temperatures.
• Do not solder (dip or hand) more than once.
• Protect the epoxy bulb from shock/vibration until the LED cools to room temperature.
• Avoid rapid cooling from peak temperature.
• Use the lowest possible temperature that achieves a reliable solder joint.
• Follow the recommended soldering profile for wave soldering.

6.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Dry at room temperature before use.
• Avoid ultrasonic cleaning. If absolutely required, pre-qualify the process to ensure no damage occurs.

7. Thermal Management

Effective heat dissipation is essential for LED performance and lifetime.

• Consider thermal management during the initial application design stage.
• Appropriately de-rate the operating current based on the application's ambient temperature, referring to de-rating curves (implied in the performance graphs).
• Control the temperature surrounding the LED in the final application. Excessive junction temperature reduces light output and can accelerate degradation.

8. Electrostatic Discharge (ESD) Precautions

This LED product is sensitive to electrostatic discharge (ESD) and surge voltages, which can damage the semiconductor die and affect reliability.

• Always handle the devices in an ESD-protected environment (using grounded wrist straps, conductive mats, etc.).
• Use appropriate ESD-safe packaging and containers during transport and storage.

9. Packaging and Ordering Information

9.1 Packing Specification

The device is packaged to ensure protection from moisture and electrostatic discharge.

• Primary Packing: Anti-electrostatic bag.
• Secondary Packing: Inner carton.
• Tertiary Packing: Outside carton.

Packing Quantity:

1. Minimum 200 to 500 pieces per anti-static bag.
2. 6 bags are packed into 1 inner carton.
3. 10 inner cartons are packed into 1 outside carton.

9.2 Label Explanation

The packaging label contains the following codes for traceability and specification:

• CPN: Customer's Production Number.
• P/N: Production Number (manufacturer's part number).
• QTY: Packing Quantity.
• CAT: Ranks of Luminous Intensity (Binning).
• HUE: Ranks of Dominant Wavelength (Binning).
• REF: Ranks of Forward Voltage (Binning).
• LOT No: Manufacturing Lot Number for traceability.

10. Application Suggestions

10.1 Typical Application Scenarios

As indicated in the datasheet, this LED is suitable for backlighting and status indication in various electronic devices, including:

• Television Sets (TV)
• Computer Monitors
• Telephones
• General Computer Peripherals and Equipment

The high brightness and reliable yellow color make it ideal for power indicators, warning lights, and decorative backlighting where clear visibility is required.

10.2 Design Considerations

• Current Limiting: Always use a series current-limiting resistor or constant-current driver. Calculate the resistor value based on the supply voltage (Vs), the typical forward voltage (Vf ≈ 2.0V), and the desired operating current (e.g., 20mA): R = (Vs - Vf) / I_F.
• PCB Layout: Ensure adequate copper area or thermal vias around the LED pads to help dissipate heat, especially if operating near maximum ratings.
• Optical Design: The 50-degree viewing angle provides a broad emission pattern. Consider lens or diffuser requirements if a specific beam pattern is needed.
• ESD Protection: In applications prone to ESD events, consider adding transient voltage suppression (TVS) diodes or other protection circuitry on the LED lines.

11. Technical Comparison and Differentiation

While a direct comparison with other products is not provided in this standalone datasheet, key differentiating features of this LED can be inferred:

• Material Technology: Use of AlGaInP semiconductor material is typical for high-efficiency yellow and amber LEDs, offering good brightness.
• Compliance: Simultaneous compliance with RoHS, REACH, and Halogen-Free standards is a significant advantage for products targeting global markets with strict environmental regulations.
• Packaging: Availability on tape and reel facilitates high-speed, automated pick-and-place assembly, reducing manufacturing costs for volume production.
• Binning: The explicit binning system (CAT, HUE, REF) allows for tighter color and brightness matching in applications using multiple LEDs, a critical factor in display backlighting.

12. Frequently Asked Questions (Based on Technical Parameters)

12.1 What is the recommended operating current?

The electro-optical characteristics are specified at IF=20mA, which is the standard test condition and the recommended typical operating point for achieving the specified brightness and longevity.

12.2 Can I drive this LED at 25mA continuously?

While 25mA is the Absolute Maximum Rating for continuous current, it is not recommended for normal operation. Operating at the maximum rating reduces safety margins, increases junction temperature, and may shorten lifespan. Design for 20mA or lower for optimal reliability.

12.3 How do I interpret the luminous intensity value?

The typical luminous intensity is 200 millicandelas (mcd) at 20mA. This is a measure of perceived brightness in the direction of peak emission. The minimum guaranteed value is 100 mcd. The actual value for a specific unit will fall within the binned range indicated by the "CAT" code.

12.4 What does the viewing angle mean?

A 50-degree viewing angle (full width at half maximum) means the light intensity is at least half of its peak value within a 50-degree cone centered on the LED's axis. Light is visible outside this angle but at lower intensity.

12.5 Is a heat sink required?

For operation at 20mA in moderate ambient temperatures, a dedicated heat sink is usually not required for a single LED. However, proper thermal management on the PCB (adequate copper pads) is necessary. If multiple LEDs are clustered, or if the ambient temperature is high (>~60°C), thermal analysis and possible heatsinking are recommended.

13. Practical Application Case Study

Scenario: Status Indicator on a Network Router

A designer needs a bright, reliable yellow LED to indicate "Internet Connection Active" on a consumer router. The LED will be driven directly from a 3.3V microcontroller GPIO pin.

1. Component Selection: This LED is chosen for its high brightness (200 mcd typical), which ensures visibility in a well-lit room, and its compliance with environmental standards required for consumer electronics.
2. Circuit Design: A current-limiting resistor is calculated. Using V_supply = 3.3V, V_f = 2.0V, and I_f = 20mA: R = (3.3V - 2.0V) / 0.020A = 65 Ohms. The nearest standard value (68 Ohms) is selected, resulting in a slightly lower current (~19mA), which is acceptable.
3. PCB Layout: The LED is placed on the front panel. The PCB footprint matches the package dimensions. A small copper pour is connected to the cathode and anode pads to aid in heat dissipation.
4. Assembly: LEDs are supplied on tape and reel, compatible with the manufacturer's automated assembly line. The reflow soldering profile is adjusted to meet the specified 260°C peak for 5 seconds.
5. Result: The final product features a clear, uniform yellow indicator light that reliably shows network status, meeting all brightness and regulatory requirements.

14. Technology Principle Introduction

This LED is based on Aluminum Gallium Indium Phosphide (AlGaInP) semiconductor technology. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region. Their recombination releases energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light. In this case, the composition is tuned to produce photons in the yellow region of the spectrum (~589-591 nm). The yellow diffused resin encapsulant serves to protect the semiconductor die, shape the light output beam (contributing to the 50-degree viewing angle), and enhance light extraction from the chip.

15. Technology Development Trends

The field of LED technology continues to evolve. While this datasheet represents a mature product, general trends influencing such components include:

• Increased Efficiency: Ongoing material and structural improvements aim to produce more lumens per watt (higher efficacy), reducing power consumption for the same light output.
• Improved Color Consistency: Advances in epitaxial growth and binning processes lead to tighter wavelength and intensity distributions, allowing for better color uniformity in arrays.
• Enhanced Reliability and Lifetime: Research focuses on materials and packaging that better manage heat and resist environmental stressors, leading to longer operational lifespans under harsh conditions.
• Miniaturization: The drive for smaller electronic devices pushes for LEDs in ever-smaller package footprints while maintaining or improving optical performance.
• Smart Integration: A broader trend involves integrating control circuitry, sensors, or communication capabilities directly with the LED package, moving towards "smart" lighting solutions.