LED Lamp 523-2SURD/S530-A3 Datasheet - Brilliant Red - 20mA - 32mcd - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness, 5mm LED lamp designed for indicator and backlighting applications. The device utilizes an AlGaInP chip to produce a brilliant red color output with a diffused resin lens, ensuring a wide and uniform viewing angle. It is engineered for reliability and robustness in various electronic assemblies.

1.1 Core Features and Compliance

The LED series offers several key features and compliance certifications that make it suitable for modern electronic design:

• Viewing Angle Options: Available in various viewing angles to suit different application requirements.
• Packaging: Supplied on tape and reel for compatibility with automated pick-and-place assembly processes.
• Environmental Compliance: The product is compliant with the EU's RoHS (Restriction of Hazardous Substances) and REACH regulations. It is also classified as Halogen-Free, with Bromine (Br) and Chlorine (Cl) content each below 900 ppm and their combined total below 1500 ppm.
• High Brightness: Specifically designed for applications requiring higher luminous intensity.
• Color and Intensity Variants: The lamp series is available in different colors and intensity grades.

1.2 Target Applications

This LED is primarily intended for use as an indicator or backlight source in consumer and industrial electronics. Typical application areas include:

• Television Sets
• Computer Monitors
• Telephones
• General Computer Peripherals and Indicators

2. Technical Specifications and Objective Interpretation

This section details the absolute limits and standard operating characteristics of the LED. All parameters are specified at an ambient temperature (Ta) of 25°C unless otherwise noted.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for normal use.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be applied continuously.
• Peak Forward Current (IFP): 60 mA. This is permissible only under pulsed conditions with a duty cycle of 1/10 at 1 kHz.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in the reverse direction can cause junction breakdown.
• Power Dissipation (Pd): 60 mW. The maximum power the package can dissipate.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +100°C (storage).
• Soldering Temperature (Tsol): 260°C for 5 seconds. This defines the reflow soldering profile tolerance.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured under standard test conditions (IF=20mA).

• Luminous Intensity (Iv): 32 mcd (Typical), 16 mcd (Minimum). This is the perceived brightness in the direction of peak intensity.
• Viewing Angle (2θ1/2): 120° (Typical). The angle at which the luminous intensity is half of the peak value. The diffused lens creates this wide viewing pattern.
• Peak Wavelength (λp): 632 nm (Typical). The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λd): 624 nm (Typical). The single wavelength perceived by the human eye, defining the "brilliant red" color.
• Forward Voltage (VF): 2.0 V (Typical), ranging from 1.7 V (Min) to 2.4 V (Max) at 20mA. This parameter has a measurement uncertainty of ±0.1V.
• Reverse Current (IR): 10 μA (Maximum) at VR=5V.

Measurement Tolerances: Luminous Intensity: ±10%, Dominant Wavelength: ±1.0nm.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate device behavior under varying conditions. Understanding these is crucial for robust circuit design.

3.1 Spectral and Spatial Distribution

The Relative Intensity vs. Wavelength curve shows a typical narrow emission spectrum centered around 632 nm, characteristic of AlGaInP materials. The Directivity curve visually confirms the 120° wide, Lambertian-like emission pattern created by the diffused lens, ensuring good visibility from off-axis angles.

3.2 Electrical and Thermal Characteristics

The Forward Current vs. Forward Voltage (IV Curve) demonstrates the diode's exponential relationship. At the typical operating point of 20mA, the voltage is approximately 2.0V. The Relative Intensity vs. Forward Current curve shows that light output increases linearly with current up to the maximum rating, but designers must consider heat dissipation at higher currents.

The Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature curves are critical for thermal management. Luminous intensity decreases as ambient temperature rises. Conversely, for a fixed voltage, the forward current increases with temperature due to the negative temperature coefficient of the diode's forward voltage. This can lead to thermal runaway if not properly managed with a current-limiting circuit.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED features a standard 5mm radial leaded package. Key dimensional notes include:

• All dimensions are in millimeters (mm).
• The flange height must be less than 1.5mm (0.059 inches).
• Standard tolerance for unspecified dimensions is ±0.25mm.

The dimensional drawing specifies the lead spacing, body diameter, lens shape, and overall height, which are essential for PCB footprint design and mechanical fit.

4.2 Polarity Identification

The cathode is typically identified by a flat spot on the LED's plastic flange and/or by the shorter lead. Correct polarity must be observed during installation to prevent reverse bias damage.

5. Assembly, Soldering, and Handling Guidelines

Proper handling is essential to maintain device reliability and performance.

5.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy bulb to avoid stress on the seal.
• Form leads before soldering.
• Avoid stressing the package. Misaligned PCB holes causing forced insertion can degrade the epoxy resin.
• Cut leads at room temperature.

5.2 Storage

• Recommended storage: ≤30°C and ≤70% Relative Humidity for up to 3 months from shipment.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering: Iron tip temperature maximum 300°C (for 30W iron), soldering time maximum 3 seconds.

Wave/Dip Soldering: Preheat temperature maximum 100°C (for 60 seconds max). Solder bath temperature maximum 260°C for 5 seconds.

General Soldering Notes:

• Avoid stress on leads during high-temperature phases.
• Do not perform dip/hand soldering more than once.
• Protect the LED from mechanical shock until it cools to room temperature after soldering.
• Use the lowest effective soldering temperature.
• A recommended soldering profile graph is provided, showing time vs. temperature zones for preheat, soak, reflow, and cooling.

5.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Avoid ultrasonic cleaning. If absolutely required, pre-qualify the process parameters (power, time) to ensure no damage occurs.

5.5 Heat Management and ESD

Heat Management: The operating current must be de-rated appropriately based on the ambient temperature, as shown in the de-rating curve. Proper PCB layout and, if necessary, heatsinking should be considered during the application design phase to control the junction temperature.

ESD (Electrostatic Discharge): The LED is sensitive to ESD. Standard ESD precautions should be followed during handling and assembly, including the use of grounded workstations and wrist straps.

6. Packaging, Labeling, and Ordering Information

6.1 Packing Specification

The LEDs are packed to prevent damage during shipping and storage:

• Primary Packing: Anti-electrostatic bags.
• Secondary Packing: Inner cartons containing 5 bags.
• Tertiary Packing: Outside cartons containing 10 inner cartons.
• Packing Quantity: 200 to 500 pieces per bag. Therefore, one outside carton contains between 10,000 and 25,000 pieces (10 inner cartons * 5 bags * 200-500 pcs).

6.2 Label Explanation

Labels on the packaging contain several codes for traceability and binning:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 523-2SURD/S530-A3).
• QTY: Packing Quantity.
• CAT: Ranks of Luminous Intensity (Brightness bin).
• HUE: Ranks of Dominant Wavelength (Color bin).
• REF: Ranks of Forward Voltage (Voltage bin).
• LOT No: Manufacturing Lot Number for traceability.

7. Application Design Considerations and FAQs

7.1 Circuit Design

A current-limiting resistor is mandatory when driving this LED from a voltage source. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F. Use the maximum forward voltage (2.4V) from the datasheet for a conservative design to ensure the current does not exceed 20mA even with part-to-part variation. For example, with a 5V supply: R = (5V - 2.4V) / 0.020A = 130 Ohms. A standard 150 Ohm resistor would provide a safe margin.

7.2 Typical User Questions Answered

Q: Can I drive this LED at 25mA continuously?

A: While the absolute maximum rating is 25mA, the electro-optical characteristics are specified at 20mA. For reliable long-term operation and to account for temperature effects, it is advisable to design for 20mA or less, using the de-rating curves if the ambient temperature is high.

Q: What is the difference between Peak and Dominant Wavelength?

A> Peak Wavelength (632nm) is the physical peak of the light emission spectrum. Dominant Wavelength (624nm) is the single wavelength that the human eye would perceive as matching the LED's color. Dominant wavelength is more relevant for color indication applications.

Q: Is a heat sink needed?

A: For operation at 20mA in moderate ambient temperatures, a dedicated heat sink is typically not required for a single LED. However, thermal management becomes critical in high-density arrays, high ambient temperatures, or when driving near the maximum current. The PCB itself acts as a heat sink via the leads.

8. Technical Comparison and Differentiation

This LED differentiates itself through its specific material and construction choices:

• Chip Technology (AlGaInP): Compared to older technologies, AlGaInP offers higher efficiency and better color purity for red and amber LEDs, resulting in the specified "brilliant red" color with good luminous intensity.
• Diffused Lens vs. Water Clear: The diffused resin lens trades a small amount of peak axial intensity for a much wider and more uniform viewing angle (120°), eliminating the "hot spot" effect. This is ideal for indicators that need to be seen from various angles.
• Compliance: Full RoHS, REACH, and Halogen-Free compliance makes it suitable for global markets and environmentally conscious designs, differentiating it from non-compliant alternatives.

9. Operational Principles and Trends

9.1 Basic Operating Principle

This is a semiconductor photodiode operating in forward bias. When a voltage exceeding the forward voltage (V_F) is applied, electrons and holes recombine at the p-n junction within the AlGaInP semiconductor material. This recombination releases energy in the form of photons (light) with a wavelength corresponding to the bandgap energy of the material, which is in the red region of the visible spectrum. The diffused epoxy resin lens encapsulates the chip, provides mechanical protection, and shapes the light output beam.

9.2 Industry Context and Trends

The 5mm radial LED remains a fundamental and widely used component due to its simplicity, low cost, and ease of use for through-hole assembly. While surface-mount device (SMD) LEDs dominate high-volume automated production, through-hole LEDs like this one are still prevalent in prototyping, educational kits, repair work, and applications requiring higher single-point brightness or robustness against vibration. The trend within this segment is towards higher efficiency (more light output per mA), stricter environmental compliance, and more consistent binning for color and brightness uniformity in batch production.