LED Lamp 1003SURD/S530-A3 Datasheet - Brilliant Red - 20mA Forward Current - 2.0V Typical Forward Voltage - English Technical Document

1. Product Overview

The 1003SURD/S530-A3 is a through-hole LED lamp designed for applications requiring reliable performance and higher brightness levels. It utilizes an AlGaInP chip to produce a brilliant red color with a diffused red resin lens. This component is characterized by its robust construction, compliance with environmental standards, and suitability for automated assembly processes.

1.1 Core Features and Advantages

• High Brightness: Specifically engineered for applications demanding superior luminous intensity.
• Wide Viewing Angle: Offers a typical 110-degree viewing angle (2θ1/2) for broad light distribution.
• Environmental Compliance: The product is Pb-free and remains within RoHS compliant specifications.
• Packaging Flexibility: Available on tape and reel for efficient automated placement.
• Color Options: The series is available in different colors and intensity grades.

1.2 Target Applications

This LED is well-suited for various consumer and industrial electronics where indicator functionality is required. Typical applications include backlighting or status indication in television sets, computer monitors, telephones, and other desktop or portable computing devices.

2. Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters defined in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

• Continuous Forward Current (I_F): 25 mA. This is the maximum DC current that can be continuously applied.
• Peak Forward Current (I_FP): 60 mA. Permissible only under pulsed conditions (duty cycle 1/10 @ 1 kHz).
• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (P_d): 60 mW. The maximum power the package can dissipate at Ta=25°C.
• Operating & Storage Temperature: Ranges from -40°C to +85°C (operating) and -40°C to +100°C (storage).
• Soldering Temperature: Withstands 260°C for 5 seconds, compatible with standard lead-free soldering profiles.

2.2 Electro-Optical Characteristics (Ta=25°C)

These are the typical performance parameters measured under specified test conditions.

• Luminous Intensity (I_v): 25 mcd (Min), 50 mcd (Typ) at I_F=20mA. This quantifies the perceived brightness.
• Viewing Angle (2θ1/2): 110° (Typ). The angle at which luminous intensity is half the peak value.
• Peak Wavelength (λ_p): 632 nm (Typ). The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λ_d): 624 nm (Typ). The single wavelength perceived by the human eye.
• Forward Voltage (V_F): 1.7V (Min), 2.0V (Typ), 2.4V (Max) at I_F=20mA. Critical for driver design and power supply selection.
• Reverse Current (I_R): 10 μA (Max) at V_R=5V.

3. Performance Curve Analysis

The datasheet provides several characteristic curves essential for understanding device behavior under varying conditions.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, centered around the typical 632 nm peak. The spectrum is characteristic of AlGaInP material, producing a saturated red color. The typical spectral bandwidth (Δλ) is 20 nm.

3.2 Directivity Pattern

The polar plot illustrates the spatial distribution of light, confirming the wide 110-degree viewing angle. The intensity is relatively uniform across the central cone, typical of a diffused lens package.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This graph shows the exponential relationship between current and voltage, typical of a diode. The curve is essential for determining the operating point and the necessary current-limiting resistor value in a simple circuit. The "knee" voltage is around the typical 2.0V mark.

3.4 Relative Intensity vs. Forward Current

This curve demonstrates that light output is approximately proportional to forward current within the operating range. It highlights the importance of stable current control for consistent brightness.

3.5 Thermal Performance Curves

Relative Intensity vs. Ambient Temperature: Shows the decrease in light output as ambient temperature rises. This derating is crucial for designs operating in elevated temperature environments.
Forward Current vs. Ambient Temperature: Indicates how the maximum permissible forward current should be reduced at higher ambient temperatures to stay within the power dissipation limit, emphasizing the need for thermal management.

4. Mechanical and Packaging Information

4.1 Package Dimension Drawing

The LED features a standard radial leaded package. Key dimensions include the lead spacing, body diameter, and overall height. The drawing specifies that all dimensions are in millimeters, with a standard tolerance of ±0.25mm unless otherwise stated. A critical note specifies that the flange height must be less than 1.5mm (0.059").

4.2 Polarity Identification

The cathode is typically identified by a flat spot on the LED lens or by the shorter lead. The datasheet diagram should be consulted for the exact marking scheme of this specific part.

5. Soldering and Assembly Guidelines

Proper handling is critical to ensure reliability and prevent damage.

5.1 Lead Forming

• Bending must occur at least 3mm from the epoxy bulb base.
• Forming must be done before soldering and at room temperature.
• Avoid applying stress to the package; ensure PCB holes align perfectly with leads.

5.2 Soldering Process

Hand Soldering: Iron tip temperature maximum 300°C (for 30W max iron), soldering time maximum 3 seconds.
Wave/Dip Soldering: Preheat to 100°C max (60 sec max), solder bath at 260°C max for 5 seconds max.
Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb. Avoid multiple soldering cycles and rapid cooling. Apply the lowest possible temperature that achieves a reliable joint.

5.3 Storage Conditions

Store at ≤30°C and ≤70% Relative Humidity. Shelf life is 3 months from shipment. For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant. Avoid rapid temperature changes to prevent condensation.

5.4 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Do not use ultrasonic cleaning unless its effects have been thoroughly pre-qualified, as it can cause mechanical damage.

5.5 Heat and ESD Management

Heat Management: The operating current must be derated appropriately based on the ambient temperature, as shown in the derating curve. Control the temperature around the LED in the application.
ESD (Electrostatic Discharge): The device is sensitive to ESD. Standard ESD precautions should be observed during handling and assembly.

6. Packaging and Ordering Information

6.1 Packing Specification

• LEDs are packed in anti-static bags.
• Packing Quantity: 1,500 pieces per bag. 5 bags per inner carton. 10 inner cartons per master (outside) carton.
• Total: 75,000 pieces per master carton.

6.2 Label Explanation

Labels on packaging contain codes for traceability and specification:
CPN: Customer's Production Number
P/N: Production Number
QTY: Packing Quantity
CAT: Ranks (likely binning categories)
HUE: Dominant Wavelength
REF: Reference
LOT No: Lot Number

7. Application Notes and Design Considerations

7.1 Circuit Design

Always use a series current-limiting resistor. Calculate the resistor value using the formula: R = (V_supply - V_F) / I_F. Use the maximum forward voltage from the datasheet (2.4V) to ensure the current does not exceed the desired level even with part-to-part variation. For a 5V supply and 20mA target current: R = (5V - 2.4V) / 0.02A = 130 Ω. A standard 130Ω or 150Ω resistor would be appropriate, considering power rating (P = I²R).

7.2 Thermal Design

While this is a low-power device, thermal management is still important in high-density boards or high-ambient-temperature applications. Ensure adequate spacing between components and consider airflow. Adhere strictly to the current derating curve provided in the datasheet when the ambient temperature exceeds 25°C.

7.3 Optical Integration

The wide 110-degree viewing angle makes this LED suitable for applications requiring broad-area illumination or wide-angle visibility. For more focused light, external lenses or light pipes may be necessary. The diffused resin helps reduce glare and provides a more uniform appearance.

8. Technical Comparison and Positioning

The 1003SURD/S530-A3 belongs to a category of standard reliability, through-hole indicator LEDs. Its primary differentiators are its use of AlGaInP technology for efficient red light and its specific brightness/wavelength binning. Compared to older GaAsP-based red LEDs, AlGaInP offers higher luminous efficiency and better color saturation. Compared to surface-mount device (SMD) LEDs, the through-hole package offers mechanical robustness and ease of manual prototyping but requires more board space and is less suited to ultra-high-volume automated assembly.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λ_p): The wavelength at the highest point of the spectral power distribution curve (632 nm typical).
Dominant Wavelength (λ_d): The single wavelength that would produce the same color perception as the LED's light (624 nm typical). It is calculated based on human eye sensitivity (CIE chromaticity) and is more relevant for color specification.

9.2 Can I drive this LED without a current-limiting resistor?

No. An LED is a current-driven device. Connecting it directly to a voltage source will cause current to rise uncontrollably, quickly exceeding the Absolute Maximum Rating and destroying the device. A series resistor or constant-current driver is always required.

9.3 How do I interpret the "Pb free" and "RoHS" statements?

"Pb free" means the device does not contain lead in its solderable finishes or internal construction.
"RoHS compliant" means the device complies with the EU Restriction of Hazardous Substances directive, which restricts lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE). The datasheet states the product "will remain within RoHS compliant version," indicating ongoing compliance.

9.4 What happens if I exceed the 3mm distance rule during soldering?

Soldering closer than 3mm to the epoxy bulb can transfer excessive heat into the semiconductor die and the internal wire bonds. This can cause immediate failure (like an open circuit) or latent damage that reduces the LED's lifespan and reliability due to thermal stress on the epoxy and internal components.

10. Practical Application Example

Scenario: Designing a power status indicator for a 12V DC adapter.
Design Steps:
1. Choose Operating Point: Select I_F = 15 mA for good brightness and long life.
2. Calculate Resistor: Use max V_F for safety. R = (12V - 2.4V) / 0.015A = 640 Ω. Nearest standard value is 620 Ω or 680 Ω.
3. Check Resistor Power: P = (0.015A)² * 620Ω = 0.1395W. A standard 1/4W (0.25W) resistor is sufficient.
4. Consider Environment: If the adapter case internal temperature could reach 60°C, consult the derating curve. The maximum allowable current may be lower, requiring a higher resistor value to reduce I_F.
5. PCB Layout: Place holes with correct spacing. Ensure no stress is applied to leads after insertion. Follow the 3mm soldering distance rule.

11. Operational Principle

Light is generated through a process called electroluminescence within the AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected across the p-n junction. These charge carriers recombine in the active region, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, in the red spectrum (~624-632 nm). The diffused red epoxy resin package acts as both a protective encapsulant and a primary lens, shaping the light output and providing the characteristic wide viewing angle.

12. Technology Trends and Context

Through-hole LEDs like the 1003SURD/S530-A3 represent a mature and highly reliable packaging technology. The industry trend has strongly shifted towards Surface-Mount Device (SMD) packages (e.g., 0603, 0805, 1206, and dedicated LED packages like 2835, 3535) for most new designs due to their smaller footprint, suitability for high-speed automated pick-and-place assembly, and better thermal performance when mounted on the PCB. However, through-hole LEDs maintain significant relevance in several areas: educational kits and prototyping due to ease of hand-soldering; applications demanding extreme mechanical robustness and strain relief (where the through-board leads provide strong anchoring); high-voltage or high-reliability industrial controls where creepage/clearance distances are easier to manage; and as replacement parts for legacy equipment originally designed for through-hole components. The AlGaInP material system used in this LED remains the dominant technology for high-efficiency amber, red, and orange LEDs, though for deep red and infrared, other materials like InGaAlP or GaAs are also used.