Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. Technical Parameter Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 2.3 Measurement Tolerances
- 3. Binning System Explanation The product uses a binning system to categorize units based on key optical and electrical parameters. This ensures consistency within a production lot and allows designers to select LEDs that meet specific application requirements. 3.1 Wavelength and Luminous Intensity Binning LEDs are sorted into ranks for Dominant Wavelength (HUE) and Luminous Intensity (CAT). The typical dominant wavelength is 624nm, but actual units will fall within a specified bin range around this value. Similarly, while the typical luminous intensity is 20mcd, actual units are binned into categories (CAT) based on measured output. Designers must consult the manufacturer's specific bin code documentation to select the appropriate HUE and CAT codes for their application's color and brightness consistency needs. 3.2 Forward Voltage Binning Units are also binned by Forward Voltage (REF). The typical VF is 2.0V with a maximum of 2.4V. Binning by voltage helps in designing efficient driver circuits and ensuring uniform current distribution when multiple LEDs are connected in parallel. 4. Performance Curve Analysis
- 4.1 Spectral Distribution and Directivity
- 4.2 Electrical and Thermal Characteristics
- 5. Mechanical and Package Information
- 5.1 Package Dimensions and Drawing
- 5.2 Polarity Identification and Pad Design
- 6. Soldering and Assembly Guidelines
- 6.1 Lead Forming and Storage
- 6.2 Soldering Parameters and Profile
- 6.3 Cleaning and Heat Management
- 7. Packaging and Ordering Information
- 7.1 Packing Specification
- 7.2 Label Explanation and Model Number
- 8. Application Recommendations
- 8.1 Typical Application Scenarios
- 8.2 Design Considerations
- 9. Technical Comparison and Differentiation Compared to standard red LEDs, this Hyper Red AlGaInP device offers higher luminous efficiency, resulting in greater brightness for the same drive current. The 180-degree viewing angle is significantly wider than many SMD LEDs, which often have viewing angles of 120-140 degrees. This makes it a superior choice for applications requiring omnidirectional visibility. Its compliance with modern environmental standards (RoHS, Halogen-Free) is a key differentiator in regulated markets. 10. Frequently Asked Questions (Based on Technical Parameters)
- 10.1 What is the difference between peak wavelength and dominant wavelength?
- 10.2 Can I drive this LED at 25mA continuously?
- 10.3 How critical is the 3mm minimum distance rule for soldering?
- 11. Practical Design and Usage Case
- 12. Operating Principle Introduction
- 13. Technology Trends and Context
1. Product Overview
The 513SURD/S530-A3 is a surface-mount LED lamp designed for applications requiring high brightness and reliable performance. It utilizes an AlGaInP chip to produce a Hyper Red color with a typical dominant wavelength of 624nm. This component is characterized by its wide 180-degree viewing angle, making it suitable for backlighting and indicator applications where broad visibility is essential.
1.1 Core Advantages and Target Market
The primary advantages of this LED include its robust construction, compliance with environmental regulations such as RoHS, REACH, and Halogen-Free standards, and availability on tape and reel for automated assembly. It is specifically targeted at the consumer electronics market, including applications in television sets, computer monitors, telephones, and general computing equipment where consistent and bright red indication or backlighting is required.
2. Technical Parameter Deep Dive
This section provides a detailed, objective analysis of the key technical parameters specified in the datasheet.
2.1 Absolute Maximum Ratings
The device is rated for a continuous forward current (IF) of 25 mA. Exceeding this value may cause permanent damage. The maximum reverse voltage (VR) is 5V. The device can withstand an electrostatic discharge (ESD) of 2000V (Human Body Model), which is a standard level for basic component handling. The power dissipation (Pd) is limited to 60 mW. The operating temperature range (Topr) is from -40°C to +85°C, and storage temperature (Tstg) extends to +100°C. The soldering temperature rating is 260°C for 5 seconds, which is compatible with standard lead-free reflow processes.
2.2 Electro-Optical Characteristics
All measurements are specified at a junction temperature (Tj) of 25°C and a forward current of 20 mA. The typical luminous intensity (Iv) is 20 millicandelas (mcd). The viewing angle (2θ1/2), defined as the angle where intensity drops to half its peak value, is a full 180 degrees. The peak wavelength (λp) is typically 632 nm, while the dominant wavelength (λd) is typically 624 nm. The spectrum radiation bandwidth (Δλ) is 20 nm. The forward voltage (VF) has a typical value of 2.0V and a maximum of 2.4V at 20mA. The reverse current (IR) is specified with a maximum of 10 µA at a reverse voltage of 5V.
2.3 Measurement Tolerances
The datasheet notes important measurement uncertainties: ±0.1V for forward voltage, ±10% for luminous intensity, and ±1.0nm for dominant wavelength. These tolerances must be considered during circuit design and binning selection to ensure system performance meets specifications.
3. Binning System Explanation
The product uses a binning system to categorize units based on key optical and electrical parameters. This ensures consistency within a production lot and allows designers to select LEDs that meet specific application requirements.
3.1 Wavelength and Luminous Intensity Binning
LEDs are sorted into ranks for Dominant Wavelength (HUE) and Luminous Intensity (CAT). The typical dominant wavelength is 624nm, but actual units will fall within a specified bin range around this value. Similarly, while the typical luminous intensity is 20mcd, actual units are binned into categories (CAT) based on measured output. Designers must consult the manufacturer's specific bin code documentation to select the appropriate HUE and CAT codes for their application's color and brightness consistency needs.
3.2 Forward Voltage Binning
Units are also binned by Forward Voltage (REF). The typical VF is 2.0V with a maximum of 2.4V. Binning by voltage helps in designing efficient driver circuits and ensuring uniform current distribution when multiple LEDs are connected in parallel.
4. Performance Curve Analysis
The datasheet includes several characteristic curves that illustrate the device's behavior under varying conditions.
4.1 Spectral Distribution and Directivity
The Relative Intensity vs. Wavelength curve shows the emission spectrum, centered around 632nm (peak) with a bandwidth of approximately 20nm. The Directivity curve visually confirms the very wide 180-degree viewing angle, showing a near-Lambertian emission pattern where intensity decreases gradually from the center.
4.2 Electrical and Thermal Characteristics
The Forward Current vs. Forward Voltage (IV Curve) demonstrates the diode's exponential relationship. The Relative Intensity vs. Forward Current curve shows that light output increases with current but may become sub-linear at higher currents due to heating effects. The Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature curves are crucial for thermal management. They show that luminous output decreases as ambient temperature rises, and the forward voltage has a negative temperature coefficient (decreases with increasing temperature).
5. Mechanical and Package Information
5.1 Package Dimensions and Drawing
The LED is housed in a surface-mount package. The dimensional drawing specifies the length, width, and height of the component, as well as the lead spacing and size. Key notes include: all dimensions are in millimeters, the flange height must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise specified. Precise adherence to these dimensions is critical for PCB footprint design and automated pick-and-place assembly.
5.2 Polarity Identification and Pad Design
The cathode is typically identified by a visual marker on the package, such as a notch, dot, or shortened lead. The PCB land pattern (footprint) must be designed according to the recommended pad layout in the dimensional drawing to ensure proper soldering and mechanical stability. Sufficient clearance between the solder joint and the epoxy lens (minimum 3mm) is mandatory to prevent thermal damage during soldering.
6. Soldering and Assembly Guidelines
Proper handling and assembly are vital for reliability.
6.1 Lead Forming and Storage
If leads require forming, it must be done before soldering. The bend should be at least 3mm from the epoxy bulb to avoid stress on the seal. Cutting should be done at room temperature. LEDs should be stored at ≤30°C and ≤70% RH. For long-term storage beyond 3 months, a nitrogen atmosphere with desiccant is recommended. Avoid rapid temperature changes in humid environments to prevent condensation.
6.2 Soldering Parameters and Profile
Recommended soldering conditions are provided for both hand and wave/dip soldering. For hand soldering: iron tip temperature ≤300°C (30W max), time ≤3 seconds, with a minimum 3mm distance from the joint to the bulb. For wave soldering: preheat ≤100°C for ≤60 seconds, solder bath at ≤260°C for ≤5 seconds, with the same 3mm distance rule. A soldering profile graph is recommended, showing a gradual temperature ramp-up, a peak of 260°C, and a controlled cooldown. Avoid rapid cooling. Soldering (dip or hand) should not be performed more than once.
6.3 Cleaning and Heat Management
Cleaning, if necessary, should use isopropyl alcohol at room temperature for ≤1 minute. Ultrasonic cleaning is not recommended unless pre-qualified, as it can cause damage. Effective heat sinking is crucial. The operating current should be derated based on the ambient temperature, referring to the derating curve. Controlling the temperature around the LED in the final application is essential for maintaining luminous output and long-term reliability.
7. Packaging and Ordering Information
7.1 Packing Specification
The LEDs are packed in anti-static bags for ESD protection. The packing hierarchy is: 200-500 pieces per bag, 5 bags per inner box, and 10 inner boxes per master carton. The packaging materials are moisture-resistant.
7.2 Label Explanation and Model Number
The packaging labels include several codes: CPN (Customer Part Number), P/N (Manufacturer Part Number: 513SURD/S530-A3), QTY (Quantity), CAT (Luminous Intensity Rank), HUE (Dominant Wavelength Rank), REF (Forward Voltage Rank), and LOT No. (Traceability Lot Number).
8. Application Recommendations
8.1 Typical Application Scenarios
This LED is ideal for status indicators, backlighting for buttons or panels, and general illumination in consumer electronics. Its wide viewing angle makes it particularly suitable for applications where the LED may be viewed from various angles, such as on the front panel of a monitor or TV.
8.2 Design Considerations
When designing the driver circuit, use a constant current source or a current-limiting resistor in series with the LED to maintain stable brightness and prevent thermal runaway. Account for the forward voltage binning and temperature coefficient. Ensure the PCB layout provides adequate thermal relief, especially if operating near maximum ratings. Always respect the minimum distance (3mm) between the solder pad and the epoxy lens in the PCB footprint design.
9. Technical Comparison and Differentiation
Compared to standard red LEDs, this Hyper Red AlGaInP device offers higher luminous efficiency, resulting in greater brightness for the same drive current. The 180-degree viewing angle is significantly wider than many SMD LEDs, which often have viewing angles of 120-140 degrees. This makes it a superior choice for applications requiring omnidirectional visibility. Its compliance with modern environmental standards (RoHS, Halogen-Free) is a key differentiator in regulated markets.
10. Frequently Asked Questions (Based on Technical Parameters)
10.1 What is the difference between peak wavelength and dominant wavelength?
Peak wavelength (λp=632nm) is the wavelength at which the spectral power distribution is maximum. Dominant wavelength (λd=624nm) is the single wavelength of monochromatic light that matches the perceived color of the LED. Designers concerned with color perception should focus on dominant wavelength.
10.2 Can I drive this LED at 25mA continuously?
While 25mA is the absolute maximum rating, the electro-optical characteristics are specified at 20mA. For reliable long-term operation and to account for temperature rise, it is advisable to drive the LED at or below 20mA, applying appropriate derating if the ambient temperature is high.
10.3 How critical is the 3mm minimum distance rule for soldering?
It is very critical. Soldering closer than 3mm to the epoxy bulb can transfer excessive heat to the internal die and wire bonds, potentially causing immediate failure or long-term degradation of the epoxy seal, leading to reduced reliability and premature failure.
11. Practical Design and Usage Case
Case: Designing a Status Indicator Panel for a Network Router
A designer needs multiple bright red status LEDs visible from all sides of the router. The 513SURD/S530-A3 is selected for its 180° viewing angle and Hyper Red color. A constant current driver circuit is designed to provide 18mA to each LED (derated from 20mA for margin). The PCB footprint is created exactly per the dimensional drawing, ensuring a 3.5mm gap between the solder pad edge and the LED placement location. LEDs from the same HUE and CAT bin are ordered to ensure uniform color and brightness across the panel. After assembly using the recommended reflow profile, the indicators provide consistent, wide-angle visibility.
12. Operating Principle Introduction
This LED is based on an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied, electrons and holes are injected into the active region of the semiconductor. They recombine, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the wavelength of the emitted light, in this case, in the Hyper Red spectrum (~624nm). The epoxy lens encapsulates the chip, provides mechanical protection, and shapes the light output to achieve the desired 180-degree viewing angle.
13. Technology Trends and Context
AlGaInP technology is mature and highly efficient for producing red, orange, and yellow LEDs. The trend in indicator and backlight LEDs is towards higher efficiency (more light output per watt), smaller packages, and broader viewing angles. This device aligns with the trend for wide viewing angles. Furthermore, the industry-wide push for environmental compliance is reflected in its RoHS, REACH, and Halogen-Free qualifications. Future developments may focus on even higher efficiency and integration with intelligent drivers, but for standard indicator applications, reliable components like this remain fundamental.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |