1. Product Overview
The 513UYD/S530-A3 is a high-brightness, through-hole LED lamp designed for applications requiring superior luminous output and reliability. It belongs to a series specifically engineered for enhanced brightness performance. The device utilizes AlGaInP chip technology to produce a Super Yellow emitted color, encapsulated in a yellow diffused resin package. This combination is optimized for applications where clear visibility and robust performance are critical.
1.1 Core Advantages
The LED offers several key advantages that make it suitable for demanding electronic applications. It provides a choice of various viewing angles to suit different design requirements. The product is available on tape and reel for automated assembly processes, improving manufacturing efficiency. It is designed to be reliable and robust, ensuring long-term performance stability. Furthermore, the device complies with major environmental and safety standards, including RoHS, EU REACH, and is Halogen Free, with Bromine (Br) and Chlorine (Cl) content strictly controlled below 900 ppm each and their sum below 1500 ppm.
1.2 Target Market & Applications
This LED is targeted at the consumer electronics and display industries. Its primary applications include backlighting and indicator functions in television sets, computer monitors, telephones, and general computer peripherals. The high brightness and diffused yellow output make it ideal for status indicators, power lights, and backlighting where a warm, visible signal is required.
2. Technical Parameters & Specifications
This section provides a detailed, objective analysis of the LED's technical specifications as defined in its datasheet.
2.1 Absolute Maximum Ratings
The Absolute Maximum Ratings define the limits beyond which permanent damage to the device may occur. These ratings are specified at an ambient temperature (Ta) of 25°C. The continuous forward current (IF) must not exceed 25 mA. The device can withstand an electrostatic discharge (ESD) of up to 2000V (Human Body Model). The maximum allowable reverse voltage (VR) is 5V. The total power dissipation (Pd) is rated at 60 mW. The operating temperature range (Topr) is from -40°C to +85°C, while the storage temperature (Tstg) extends from -40°C to +100°C. The soldering temperature (Tsol) is specified as 260°C for a maximum duration of 5 seconds.
2.2 Electro-Optical Characteristics
The Electro-Optical Characteristics are measured under standard test conditions of Ta=25°C and a forward current (IF) of 20mA, unless otherwise noted. The luminous intensity (Iv) has a typical value of 32 millicandelas (mcd), with a minimum of 20 mcd. The viewing angle (2θ1/2), defined as the full angle at half intensity, is typically 150 degrees. The peak wavelength (λp) is typically 591 nanometers (nm), and the dominant wavelength (λd) is typically 589 nm. The spectrum radiation bandwidth (Δλ) is typically 20 nm. The forward voltage (VF) typically measures 2.0V, with a maximum of 2.4V at 20mA. The reverse current (IR) has a maximum value of 10 microamperes (μA) when a reverse voltage (VR) of 5V is applied. Important measurement uncertainties are noted: ±0.1V for forward voltage, ±10% for luminous intensity, and ±1.0nm for dominant wavelength.
2.3 Thermal Characteristics
While not explicitly listed in a separate table, thermal management is a critical aspect inferred from the maximum ratings and handling notes. The power dissipation rating of 60 mW and the operating temperature range up to +85°C define the thermal operating envelope. Proper heat sinking or current derating is essential when operating near the upper limits of current or ambient temperature to ensure longevity and maintain optical performance.
3. Binning System Explanation
The datasheet indicates the use of a binning system to categorize LEDs based on key performance parameters. This ensures consistency within a production lot and allows designers to select parts that meet specific application needs. The labeling explanation defines three primary binning ranks: CAT for ranks of Luminous Intensity, HUE for ranks of Dominant Wavelength, and REF for ranks of Forward Voltage. By purchasing LEDs within specific bin codes, designers can achieve uniform brightness, color, and electrical characteristics across their products.
4. Performance Curve Analysis
The datasheet includes several typical characteristic curves that provide deeper insight into the LED's behavior under varying conditions.
4.1 Relative Intensity vs. Wavelength
This curve plots the spectral power distribution of the emitted light. It shows the relative intensity across different wavelengths, centering around the typical peak wavelength of 591 nm. The shape and width of this curve (related to the 20 nm bandwidth) determine the color purity and visual appearance of the yellow light.
4.2 Directivity Pattern
The directivity curve illustrates how the luminous intensity varies with the viewing angle relative to the LED's central axis. For a device with a 150° viewing angle, this curve will show a broad, rounded profile, confirming the wide, diffused light emission characteristic of the yellow diffused resin package.
4.3 Forward Current vs. Forward Voltage (IV Curve)
This fundamental electrical curve shows the relationship between the current flowing through the LED and the voltage drop across it. It is non-linear, typical of a diode. The curve allows designers to determine the operating point and necessary current-limiting resistor values for a given supply voltage.
4.4 Relative Intensity vs. Forward Current
This curve demonstrates how the light output (relative intensity) changes with increasing forward current. It generally shows a sub-linear relationship, where efficiency may decrease at very high currents due to increased heat generation.
4.5 Temperature Dependency Curves
Two key curves show the effect of ambient temperature: Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature (likely at a constant voltage). Typically, LED luminous output decreases as ambient temperature rises. The forward voltage also has a negative temperature coefficient, meaning it decreases slightly as temperature increases. These curves are crucial for designing stable circuits over the specified operating temperature range.
5. Mechanical & Package Information
5.1 Package Dimensions
The LED is housed in a standard 3mm or 5mm round through-hole package (specific size to be determined from the dimension drawing). The drawing provides all critical mechanical dimensions including lead spacing, body diameter, overall height, and the position of the epoxy lens. Key notes specify that all dimensions are in millimeters, the height of the flange must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise stated.
5.2 Lead/Polarity Identification
For through-hole LEDs, polarity is typically indicated by lead length (the longer lead is the anode) or by a flat spot on the rim of the plastic lens. The cathode is usually connected to the lead adjacent to this flat. Correct polarity must be observed during circuit board assembly.
6. Soldering & Assembly Guidelines
Proper handling is essential to prevent damage to the LED.
6.1 Lead Forming
Leads should be bent at a point at least 3mm from the base of the epoxy bulb. Forming must be done before soldering, at room temperature, and with care to avoid stressing the package or leads, which can cause breakage or degraded performance. PCB holes must align perfectly with the LED leads to avoid mounting stress.
6.2 Soldering Parameters
For hand soldering, the iron tip temperature should not exceed 300°C (for a maximum 30W iron), and soldering time per lead should be 3 seconds maximum. For dip soldering, preheat temperature should be 100°C max for 60 seconds max, and the solder bath should be at 260°C max for 5 seconds max. In both cases, the solder joint must be at least 3mm away from the epoxy bulb. A recommended soldering profile is provided, emphasizing the importance of preheat, controlled peak temperature, and controlled cooling. Dip or hand soldering should not be performed more than once. Stress should not be applied to the leads while the LED is hot, and the bulb should be protected from shock until it cools to room temperature.
6.3 Storage Conditions
LEDs should be stored at 30°C or less and 70% relative humidity or less after shipment. The recommended storage life is 3 months. For longer storage up to one year, they should be kept in a sealed container with a nitrogen atmosphere and moisture absorbent. Rapid temperature transitions in high humidity environments must be avoided to prevent condensation.
6.4 Cleaning
If cleaning is necessary, use isopropyl alcohol at room temperature for no more than one minute, then air dry. Ultrasonic cleaning is not recommended as it can damage the LED package. If absolutely required, the process must be carefully pre-qualified.
7. Packaging & Ordering Information
7.1 Packing Specification
The LEDs are packaged in anti-electrostatic bags to prevent ESD damage. These are placed in inner cartons, which are then packed into outside cartons for shipment. The packing quantity is typically a minimum of 200 to 500 pieces per bag, with 5 bags per box, and 10 boxes per carton.
7.2 Label Explanation
Packing labels contain several codes: CPN (Customer's Production Number), P/N (Production Number), QTY (Packing Quantity), CAT (Luminous Intensity Rank), HUE (Dominant Wavelength Rank), REF (Forward Voltage Rank), and LOT No (Lot Number for traceability).
8. Application Notes & Design Considerations
8.1 Typical Application Circuits
The most common application is as an indicator light driven by a DC voltage source through a current-limiting resistor. The resistor value is calculated using Ohm's Law: R = (V_supply - VF_LED) / I_desired. For example, with a 5V supply, a typical VF of 2.0V, and a desired current of 20mA, the resistor would be (5V - 2.0V) / 0.020A = 150 Ohms. A slightly higher value (e.g., 180 Ohms) is often used for margin and to reduce power dissipation.
8.2 Heat Management
Effective heat management is critical for LED longevity and stable light output. The current should be derated appropriately if the ambient temperature exceeds 25°C. Designers must ensure adequate ventilation or heat sinking in the final application, especially if multiple LEDs are used or if they are operated near their maximum current rating. The temperature surrounding the LED must be controlled within the specified operating range.
9. Technical Comparison & Differentiation
Compared to standard yellow LEDs, the 513UYD/S530-A3's use of AlGaInP technology typically offers higher efficiency and brightness. The wide 150° viewing angle provided by the diffused lens is a key differentiator for applications requiring broad visibility. Its compliance with stringent environmental standards (RoHS, REACH, Halogen-Free) makes it suitable for modern electronics with strict material requirements. The availability on tape and reel supports high-volume, automated manufacturing.
10. Frequently Asked Questions (FAQ)
Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λp) is the wavelength at which the emitted optical power is maximum. Dominant wavelength (λd) is the single wavelength of monochromatic light that matches the perceived color of the LED's output. For a narrow spectrum LED, they are often very close, as seen here (591 nm vs 589 nm).
Q: Can I drive this LED with a constant voltage source without a resistor?
A: No. LEDs are current-driven devices. Their forward voltage has a tolerance and a negative temperature coefficient. Connecting directly to a voltage source will cause excessive current to flow, potentially destroying the LED. Always use a series current-limiting resistor or a constant-current driver.
Q: Why is the storage life limited to 3 months?
A> This is a precaution against moisture absorption by the plastic package, which can cause \"popcorning\" or delamination during the high-temperature soldering process. For longer storage, the nitrogen-packed, dry environment mitigates this risk.
Q: How do I interpret the viewing angle of 150°?
A: The viewing angle (2θ1/2) is the full angular width where the luminous intensity is at least half of the intensity measured at 0° (directly on-axis). A 150° angle means the LED emits usable light over a very wide area, making it good for omnidirectional indicators.
11. Practical Design & Usage Examples
Example 1: Front Panel Power Indicator: A single 513UYD/S530-A3 LED, driven at 15-20mA via a resistor from a 3.3V or 5V rail on the main PCB, can serve as a highly visible power-on indicator. The wide viewing angle ensures visibility from various positions.
Example 2: Backlighting for Membrane Switches: Several of these LEDs can be arranged behind a translucent membrane switch panel. The diffused yellow light provides even, soft illumination for legends or icons in low-light conditions.
Example 3: Status Indicator Array: Multiple LEDs can be used in a cluster to indicate different system states (e.g., standby, active, fault) on equipment like monitors or telephones. Using parts from the same intensity (CAT) and color (HUE) bins ensures visual consistency.
12. Technology & Operating Principle
The LED is based on an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied, electrons and holes recombine in the active region of the semiconductor, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light, in this case, yellow. The yellow diffused resin encapsulant serves to protect the chip, shape the light output beam, and diffuse the light to create a wide, uniform viewing angle.
13. Industry Trends & Context
While surface-mount device (SMD) LEDs dominate new designs for their small size and suitability for reflow soldering, through-hole LEDs like the 513UYD/S530-A3 remain relevant in applications requiring higher single-point brightness, easier manual prototyping, or replacement in legacy equipment. The trend towards higher efficiency and stricter environmental compliance is reflected in this product's specifications. The move towards wider viewing angles and consistent color binning are also standard expectations in the industry for indicator-type LEDs.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |