SMD Mid-Power LED 67-22ST Datasheet - PLCC-2 Package - 19.0V Max - 50mA - White Light - English Technical Document

1. Product Overview

The 67-22ST is a surface-mount device (SMD) mid-power LED housed in a PLCC-2 package. It is designed as a white LED, offering a combination of high luminous efficacy, high color rendering index (CRI), low power consumption, and a wide viewing angle. Its compact form factor makes it suitable for a broad range of lighting applications where space efficiency and good light quality are important.

1.1 Core Advantages

The key features that define this product include its high luminous intensity output, which ensures bright illumination. The wide viewing angle provides uniform light distribution over a large area. It is constructed using lead-free (Pb-free) materials and is compliant with major environmental and safety regulations including RoHS, EU REACH, and halogen-free standards (with Bromine <900ppm, Chlorine <900ppm, Br+Cl <1500ppm). The product utilizes ANSI standard binning for consistent color and performance classification.

1.2 Target Market and Applications

This LED is an ideal solution for various lighting applications. Its primary uses include general lighting for residential and commercial spaces. It is also well-suited for decorative and entertainment lighting, where color quality and reliability are key. Furthermore, it can be used for indicator lights and general illumination purposes in electronic devices and fixtures.

2. In-Depth Technical Parameter Analysis

This section provides a detailed breakdown of the LED's operational limits and performance characteristics under specified conditions.

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the limits beyond which permanent damage to the device may occur. These ratings are specified at a soldering point temperature (T_Soldering) of 25°C.

• Forward Current (I_F): 60 mA (continuous).
• Peak Forward Current (I_FP): 120 mA, permissible under pulsed conditions with a duty cycle of 1/10 and a pulse width of 10ms.
• Power Dissipation (P_d): 1080 mW.
• Operating Temperature (T_opr): -40°C to +85°C.
• Storage Temperature (T_stg): -40°C to +100°C.
• Thermal Resistance (R_{th J-S}): 17 °C/W (junction to soldering point).
• Junction Temperature (T_j): 115 °C (maximum).
• Soldering Temperature: For reflow soldering, 260°C for 10 seconds is specified. For hand soldering, 350°C for 3 seconds is the limit.

Important Note: This component is sensitive to electrostatic discharge (ESD). Proper ESD handling procedures must be followed during assembly and handling to prevent damage.

2.2 Electro-Optical Characteristics

The typical performance is measured at a forward current (I_F) of 50mA and a soldering point temperature of 25°C.

• Luminous Flux (Φ): The minimum luminous flux starts from 118 lumens, depending on the specific product bin (see Section 3). Typical values for mass production are 133 lm and 145 lm series. Tolerance is ±11%.
• Forward Voltage (V_F): Maximum forward voltage is 19.0V at 50mA. The typical range is between 17.0V and 19.0V, binned accordingly. Tolerance is ±0.1V.
• Color Rendering Index (Ra / CRI): Minimum CRI is 80 for the standard series, with R9 value of 0. Tolerance is ±2.
• Viewing Angle (2θ_1/2): The typical half-intensity viewing angle is 120 degrees, providing a very wide beam of light.

3. Binning System Explanation

To ensure consistency in application, the LEDs are sorted into bins based on key performance parameters.

3.1 Color Rendering Index (CRI) Binning

The product uses a single-letter symbol to denote the minimum Color Rendering Index. For the 67-22ST series listed, the symbol 'M' is used, which corresponds to a minimum CRI of 60. Other potential bins include N (65), L (70), Q (75), K (80), P (85), H (90), and R (90 with R9 >50).

3.2 Forward Current Index

The symbol 'Z5' indicates the operating forward current is 50mA.

3.3 Forward Voltage Index

The code '190' in the part number signifies a maximum forward voltage of 19.0V.

3.4 Luminous Flux Binning

Two main luminous flux series are defined relative to a 4000K color temperature: a 133 Lumen (min) series and a 145 Lumen (min) series. Each series is further divided into bins with 5-lumen steps. For example, the 133Lm series includes bins like 118L5 (118-123 lm), 123L5 (123-128 lm), up to 148L5 (148-153 lm).

3.5 Forward Voltage Binning

The forward voltage is binned in 0.5V steps from 17.0V to 20.0V. Bin codes are like 170E (17.0-17.5V), 175E (17.5-18.0V), up to 195E (19.5-20.0V).

3.6 Chromaticity (Color) Binning

The LEDs are binned according to the ANSI C78.377 standard for white LEDs, using a MacAdam 5-step ellipse system. This ensures that LEDs within the same bin are visually indistinguishable in color. Bin codes are provided for Correlated Color Temperatures (CCT) including 2700K, 3000K, 3500K, 4000K, 5000K, 5700K, 6000K, and 6500K, along with their target chromaticity coordinates (Cx, Cy) on the CIE 1931 diagram.

4. Performance Curve Analysis

Graphical data helps understand the LED's behavior under varying conditions.

4.1 Spectrum Distribution

The datasheet includes a spectrum distribution curve, which shows the relative intensity of light emitted across different wavelengths. For a white LED based on a blue chip with a phosphor coating, this curve typically shows a strong blue peak from the chip and a broader yellow/green/red emission from the phosphor, combining to produce white light. The exact shape determines the color temperature and color rendering properties.

4.2 Typical Electro-Optical Characteristic Curves

Two key curves are presented:

Figure 1: Forward Voltage Shift vs. Junction Temperature. This curve shows how the forward voltage (V_F) decreases as the junction temperature (T_j) increases. This is a negative temperature coefficient behavior typical of semiconductor LEDs. Understanding this is crucial for thermal management and constant-current driver design.

Figure 2: Relative Luminous Intensity vs. Forward Current. This curve illustrates the relationship between the drive current and light output. Luminous intensity typically increases with current but may become sub-linear at higher currents due to efficiency droop and increased heat.

5. Device Selection and Ordering Information

5.1 Product Number Explanation

The part number 67-22ST/KKES-5MXXXXX190Z5/2T is structured to convey key specifications:

- 67-22ST/KKES: Base product series and package code.

- 5M: Likely relates to flux/performance level and CRI bin (M=CRI 80 min).

- XX: Represents the Correlated Color Temperature (CCT) code (e.g., 40 for 4000K).

- XX: Represents the minimum luminous flux code (e.g., 133 for 133 lm).

- XXX: Placeholder for other potential codes.

- 190: Maximum forward voltage index (19.0V).

- Z5: Forward current index (50mA).

- /2T: Likely indicates packaging type (tape and reel) and quantity or other variant information.

5.2 Mass Production List

The datasheet provides a detailed table of available products within the 133 lm and 145 lm series across eight CCTs (2700K to 6500K). Each listing includes the full part number, minimum CRI (80), minimum R9 (0), minimum luminous flux, and maximum forward voltage (19.0V). This allows designers to select the exact combination of color temperature and brightness for their application.

6. Application Guidelines and Design Considerations

6.1 Thermal Management

With a thermal resistance of 17°C/W from junction to solder point, effective heat sinking is essential for maintaining performance and longevity. Operating at or near the maximum forward current will generate significant heat. The PCB design must incorporate adequate copper pads or thermal vias to dissipate heat away from the LED solder points, keeping the junction temperature well below the maximum rating of 115°C.

6.2 Electrical Drive

This LED should be driven with a constant current source, not a constant voltage source. The recommended operating current is 50mA. Due to the negative temperature coefficient of V_F, a constant-current driver ensures stable light output regardless of minor temperature fluctuations. The driver must be capable of supplying the required voltage, which can be up to 19.0V per LED. For designs using multiple LEDs in series, the driver voltage must be sized accordingly.

6.3 Optical Design

The wide 120-degree viewing angle makes this LED suitable for applications requiring broad, diffuse illumination without secondary optics. For more focused beams, external lenses or reflectors can be used. Designers should account for the typical spatial radiation pattern when planning light distribution.

6.4 Soldering and Assembly

Adherence to the specified soldering profiles is critical. For reflow soldering, the peak temperature must not exceed 260°C for more than 10 seconds. For hand soldering, the iron tip temperature should be controlled to 350°C maximum, with contact time limited to 3 seconds. Always follow standard SMD assembly and ESD protection practices.

7. Technical Comparison and Market Context

The 67-22ST, as a mid-power LED in a PLCC-2 package, occupies a specific niche. Compared to high-power LEDs, it offers lower thermal density and often simpler drive requirements, making it suitable for cost-sensitive, high-volume applications like light panels, troffers, and bulb replacements. Compared to smaller, low-power LEDs, it provides significantly higher luminous flux, enabling fewer devices to achieve the same total light output, which can simplify optical and mechanical design. Its key differentiators in its class are the combination of a relatively high voltage (enabling easier string configuration with mains-derived drivers), good CRI (80), and compliance with modern environmental standards.

8. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the actual power consumption of this LED?

A: Power (P) is calculated as Forward Voltage (V_F) × Forward Current (I_F). At the typical operating point of 50mA and an approximate V_F of 18V, the power is about 0.9W (900mW).

Q: Can I drive this LED at 60mA continuously?

A: While the absolute maximum rating is 60mA, the recommended operating condition and all performance data are specified at 50mA. Operating at 60mA may reduce lifetime, increase junction temperature, and potentially shift color parameters. It is advisable to design for 50mA or lower for optimal reliability.

Q: Why is the R9 value 0 in the specifications?

A: An R9 value of 0 indicates that the LED has minimal deep red spectral content. This is common for standard white LEDs with a CRI of 80. For applications requiring excellent color rendering, especially for red objects, LEDs from bins with higher CRI and R9 values (e.g., 'R' bin) should be selected.

Q: How do I interpret the luminous flux bin code, e.g., 133L5?

A: The '133' indicates the minimum luminous flux in lumens for that bin. The 'L5' likely denotes the bin step size (5 lumens) and series. Therefore, 133L5 means the LED's flux will be between 133 lm (min) and 138 lm (max of the next lower bin).

9. Practical Application Example

Scenario: Designing a 4000K, 1000-lumen LED panel light.

1. LED Selection: Choose the 67-22ST/KKES-5M40145190Z5/2T from the mass production list. This gives 4000K CCT, minimum 145 lm flux, CRI 80, V_Fmax 19.0V at 50mA.

2. Quantity Calculation: Target flux / LED flux = 1000 lm / 145 lm ≈ 6.9 LEDs. To account for binning and tolerances, use 8 LEDs. This provides a design margin.

3. Electrical Design: Drive the 8 LEDs in series. The required driver voltage is 8 × 19.0V = 152V maximum. Select a constant-current driver rated for ~150V output and 50mA.

4. Thermal Design: Design the metal-core PCB (MCPCB) or standard PCB with sufficient thermal relief to keep the solder point temperature low. Calculate expected T_j based on ambient temperature, thermal resistance, and total power (8 × 0.9W = 7.2W).

5. Optical Design: The native 120-degree beam may be sufficient for a panel diffuser. A diffuser sheet is placed over the LEDs to blend the individual sources into uniform panel illumination.

10. Operating Principle and Technology Trends

10.1 Basic Operating Principle

A white SMD LED like the 67-22ST typically uses a semiconductor chip made of indium gallium nitride (InGaN) that emits blue light when electrical current passes through it (electroluminescence). This blue light then strikes a phosphor coating (YAG:Ce or similar) deposited inside the package. The phosphor absorbs a portion of the blue light and re-emits it as yellow light. The combination of the remaining blue light and the converted yellow light is perceived by the human eye as white light. The exact ratio of blue to yellow, and the use of multi-component phosphors, determines the correlated color temperature (CCT) and color rendering index (CRI).

10.2 Industry Trends

The mid-power LED segment continues to evolve with several clear trends: Increased Efficacy: Ongoing improvements in chip technology and phosphor efficiency lead to higher lumens per watt (lm/W), reducing energy consumption for the same light output. Improved Color Quality: There is a market shift towards higher CRI values (90+) and better specific color saturation (e.g., R9), especially in commercial and residential lighting. Miniaturization and Integration: Packages are becoming smaller and more integrated, sometimes combining multiple LED chips or including driver ICs within the package (COB - Chip-on-Board, or integrated modules). Smart and Tunable Lighting: LEDs are increasingly being designed to work with control systems that allow dimming and tuning of CCT (warm to cool white). Sustainability Focus: Compliance with stringent environmental regulations (RoHS, REACH, halogen-free) is now a standard requirement, driving material science innovations in packaging and phosphors.