T3C Series 3030 Monochromatic LED Datasheet - Size 3.0x3.0mm - Voltage 1.8-3.6V - Power 1.04-1.44W - English Technical Documentation

1. Product Overview

The T3C Series represents a line of high-performance monochromatic light-emitting diodes (LEDs) designed for general and specialized lighting applications. The primary model discussed in this document is the 3030 package variant, characterized by its compact form factor and robust thermal management design. These LEDs are engineered to deliver high luminous flux output while maintaining reliable operation under demanding conditions.

The core advantages of this series include a thermally enhanced package design that improves heat dissipation, a high current capability allowing for brighter output, and a wide viewing angle ensuring uniform light distribution. The product is compliant with Pb-free reflow soldering processes and adheres to RoHS environmental standards, making it suitable for modern electronic manufacturing.

The target market for these LEDs is broad, encompassing interior lighting solutions, retrofit projects for replacing older light sources, general illumination purposes, and architectural or decorative lighting where specific monochromatic colors are required.

2. Technical Parameter Deep Dive

2.1 Electro-Optical Characteristics

The electro-optical performance is specified at a junction temperature (Tj) of 25\u00b0C and a forward current (IF) of 350mA. Key parameters vary by color:

• Forward Voltage (VF): Ranges from 1.8V (min, Red/Yellow) to 3.6V (max, Blue). The typical values are 3.4V for Blue, 3.0V for Green, and 2.2V for Red/Yellow. A measurement tolerance of \u00b10.1V applies.
• Luminous Flux: Output varies significantly by color. Typical values are 20 lm for Blue, 82 lm for Green, and 44 lm for Red and Yellow, with a \u00b17% measurement tolerance.
• Viewing Angle (2\u03b81/2): The half-intensity angle is 120 degrees, providing a wide beam pattern.
• Thermal Resistance (Rth j-sp): This parameter, measured from the LED junction to the solder point on an MCPCB, is 17 \u00b0C/W for Blue, 15 \u00b0C/W for Green, and 10 \u00b0C/W for Red/Yellow.
• Electrostatic Discharge (ESD): All colors have a Human Body Model (HBM) rating of 1000V, indicating a standard level of ESD protection.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage may occur. All values are specified at Tj=25\u00b0C.

• Forward Current (IF): 400 mA (continuous).
• Pulse Forward Current (IFP): 600 mA, with conditions of pulse width \u2264100\u03bcs and duty cycle \u22641/10.
• Power Dissipation (PD): Varies by color: 1440 mW for Blue, 1360 mW for Green, and 1040 mW for Red/Yellow.
• Reverse Voltage (VR): 5 V.
• Operating Temperature (Topr): -40\u00b0C to +105\u00b0C.
• Storage Temperature (Tstg): -40\u00b0C to +85\u00b0C.
• Junction Temperature (Tj): 110 \u00b0C (maximum).
• Soldering Temperature (Tsld): Reflow soldering at 230\u00b0C or 260\u00b0C for 10 seconds is specified.

It is critical that operation does not exceed these ratings, as LED properties may degrade outside the specified parameter range.

3. Binning and Grading System

3.1 Wavelength / Color Grading

The LEDs are graded into specific wavelength bins at IF=350mA and Tj=25\u00b0C, with a measurement tolerance of \u00b11nm.

• Blue: 455-460 nm, 460-465 nm, 465-470 nm.
• Green: 520-525 nm, 525-530 nm, 530-535 nm.
• Red: 615-620 nm, 620-625 nm, 625-630 nm.
• Yellow: 585-590 nm, 590-595 nm, 595-600 nm.

3.2 Luminous Flux Binning

Flux output is categorized into ranks identified by letter codes. Measurements are at IF=350mA, Tj=25\u00b0C, with a \u00b17% tolerance.

• Blue: AH (18-22 lm), AJ (22-26 lm), AK (26-30 lm).
• Green: AS (72-80 lm), AT (80-88 lm), AW (88-96 lm), AX (96-104 lm).
• Red/Yellow: AM (37-44 lm), AN (44-51 lm), AP (51-58 lm).

3.3 Forward Voltage Binning

Forward voltage is also binned to ensure consistency in electrical characteristics, with a tolerance of \u00b10.1V.

• Blue/Green: H3 (2.8-3.0V), J3 (3.0-3.2V), K3 (3.2-3.4V), L3 (3.4-3.6V).
• Red/Yellow: C3 (1.8-2.0V), D3 (2.0-2.2V), E3 (2.2-2.4V), F3 (2.4-2.6V).

4. Performance Curve Analysis

The datasheet includes several graphical representations of LED performance. These curves are essential for understanding device behavior under different operating conditions.

• Color Spectrum: Shows the spectral power distribution for each LED color, which defines its purity and dominant wavelength.
• Forward Current vs. Relative Intensity: Illustrates how light output scales with increasing drive current, typically showing a sub-linear relationship at higher currents due to efficiency droop.
• Forward Current vs. Forward Voltage (IV Curve): Depicts the exponential relationship between current and voltage, crucial for designing the correct driver circuitry.
• Viewing Angle Distribution: A polar plot showing the spatial intensity pattern, confirming the 120-degree viewing angle.
• Ambient Temperature vs. Relative Luminous Flux: Demonstrates the thermal quenching effect, where light output decreases as the ambient (and thus junction) temperature rises.
• Ambient Temperature vs. Relative Forward Voltage: Shows how the forward voltage drops with increasing temperature, a characteristic of the semiconductor junction.
• Maximum Forward Current vs. Ambient Temperature: A derating curve that specifies the maximum allowable continuous current at a given ambient temperature to prevent exceeding the maximum junction temperature.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED utilizes a 3030 surface-mount device (SMD) package. Key dimensions include a body size of 3.00 mm x 3.00 mm. The package height is approximately 1.43 mm from the board surface. The soldering pads (land pattern) are designed for reliable mounting, with specific dimensions for the anode and cathode pads to ensure proper solder fillet formation. The polarity is clearly marked, typically with a cathode indicator on the package bottom. Unless otherwise stated, dimensional tolerances are \u00b10.1 mm.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The LED is compatible with standard Pb-free reflow soldering processes. A detailed profile is provided:

• Preheat: Ramp from 150\u00b0C to 200\u00b0C over 60-120 seconds.
• Ramp-up Rate: Maximum 3\u00b0C per second from liquidous temperature to peak.
• Liquidous Temperature (TL): 217\u00b0C.
• Time Above Liquidous (tL): 60-150 seconds.
• Peak Package Body Temperature (Tp): Maximum 260\u00b0C.
• Time within 5\u00b0C of Peak (tp): Maximum 30 seconds.
• Ramp-down Rate: Maximum 6\u00b0C per second from peak to liquidous.
• Total Cycle Time: Maximum 8 minutes from 25\u00b0C to peak temperature.

Adherence to this profile is critical to prevent thermal shock, solder joint issues, or damage to the LED package and internal die attach.

7. Application Notes and Design Considerations

7.1 Typical Application Scenarios

These monochromatic LEDs are suited for applications requiring specific color points without the need for phosphor conversion.

• Interior Lighting: Can be used in accent lighting, signage, or color-specific ambient lighting.
• Retrofits: Direct replacement for older monochromatic light sources in existing fixtures.
• General Lighting: When combined with other colors or used in arrays for colored lighting effects.
• Architectural/Decorative Lighting: Facade lighting, channel letters, and artistic installations where precise color control is needed.

7.2 Design Considerations

• Thermal Management: Despite the thermally enhanced package, proper heat sinking is essential, especially when operating near maximum ratings. The thermal resistance values should be used to calculate the necessary heatsinking to keep the junction temperature below 110\u00b0C.
• Current Driving: Use a constant current driver appropriate for the forward voltage bin and desired brightness. The derating curve for maximum current vs. ambient temperature must be followed.
• Optical Design: The wide 120-degree viewing angle may require secondary optics (lenses, reflectors) if a more focused beam is desired.
• ESD Precautions: Standard ESD handling procedures should be followed during assembly, as the 1000V HBM rating is a basic level of protection.

8. Technical Comparison and Differentiation

While a direct comparison with other products is not provided in the source document, key differentiating features of this T3C 3030 series can be inferred from its specifications:

• High Current Capability: A 400mA continuous rating for a 3030 package is competitive, enabling higher luminous flux density.
• Thermally Enhanced Design: Explicit mention of this feature suggests optimization for better heat extraction compared to standard packages, potentially leading to longer lifetime and maintained performance.
• Comprehensive Binning: Detailed binning for wavelength, flux, and voltage allows for tight color and brightness matching in multi-LED applications, reducing the need for complex calibration.
• High-Temperature Operation: An operating temperature range up to +105\u00b0C and a junction temperature of 110\u00b0C indicate robustness for demanding environments.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the primary cause of luminous flux degradation over time?
A: While not explicitly stated in this datasheet, the primary causes are typically high junction temperature and drive current. Operating within the specified absolute maximum ratings (especially Tj and IF) and implementing effective thermal management are crucial for maximizing LED lifespan.

Q: Can I drive this LED with a constant voltage source?
A: It is not recommended. LEDs are current-driven devices. Their forward voltage has a negative temperature coefficient and varies from bin to bin. A constant voltage source could lead to thermal runaway or inconsistent brightness. Always use a constant current driver.

Q: How do I interpret the luminous flux "Typ" and "Min" values?
A: The "Typ" (Typical) value is the expected average output under test conditions. The "Min" value is the guaranteed minimum for that flux bin. Designers should use the "Min" value for worst-case scenario calculations to ensure sufficient light output in their application.

Q: Why is the power dissipation different for each color?
A> Power dissipation (PD) is calculated as Forward Current (IF) multiplied by Forward Voltage (VF). Since the typical VF differs significantly between colors (e.g., ~3.4V for Blue vs. ~2.2V for Red at 350mA), the resulting power (and thus heat generated) is also different.

10. Design and Usage Case Study

Scenario: Designing a colored architectural facade lighting strip.

1. Color Selection: The designer chooses the Green LED from the T3C series for a specific hue, selecting the 525-530 nm wavelength bin for consistency.
2. Brightness Calculation: Targeting a specific illuminance, the designer uses the "Min" luminous flux value from the AS bin (72 lm at 350mA) for a conservative design. They calculate the number of LEDs needed per meter.
3. Thermal Design: The strip will be enclosed. Using the thermal resistance (Rth j-sp) of 15 \u00b0C/W for Green and the ambient temperature estimate, the designer calculates the required thermal pad or heatsink area on the PCB to keep Tj below 100\u00b0C for long life.
4. Electrical Design: A constant current driver is selected to deliver 350mA. The forward voltage bin (e.g., J3: 3.0-3.2V) determines the minimum driver output voltage requirement. LEDs are arranged in series/parallel combinations suitable for the driver.
5. Manufacturing: The assembly line follows the specified reflow soldering profile (260\u00b0C peak) to ensure reliable solder joints without damaging the LEDs.

11. Operational Principle

Light emission in these monochromatic LEDs is based on electroluminescence in a semiconductor chip. When a forward voltage exceeding the chip's bandgap energy is applied, electrons and holes are injected into the active region where they recombine. The energy released during this recombination is emitted as a photon (light). The specific wavelength (color) of the emitted light--blue, green, red, or yellow--is determined by the bandgap energy of the semiconductor materials used in the chip's construction (e.g., InGaN for blue/green, AlInGaP for red/yellow). The 3030 package houses this semiconductor die, provides electrical connections via the anode and cathode, and includes a primary optic (typically a silicone lens) that shapes the light output and provides the wide viewing angle.

12. Technology Trends

The development of monochromatic LEDs like those in the T3C series is influenced by several ongoing industry trends:

• Increased Efficiency (lm/W): Continuous improvements in internal quantum efficiency (IQE) and light extraction efficiency drive higher luminous output for the same electrical input, reducing energy consumption.
• Improved Color Purity and Consistency: Advances in epitaxial growth and manufacturing controls lead to tighter wavelength bins and more consistent color points from batch to batch.
• Enhanced Reliability and Lifetime: Research into materials (e.g., more robust encapsulants) and packaging techniques aims to reduce lumen depreciation and increase operational lifespan, especially under high-temperature and high-current conditions.
• Miniaturization with High Power: The trend of packing more light output into smaller packages continues, demanding ever-better thermal management solutions like the "thermally enhanced package" mentioned here.
• Expanded Color Gamut: While this datasheet covers standard colors, the broader market sees development of LEDs with novel wavelengths (e.g., deeper reds, cyan) for applications in horticultural lighting, display backlights, and specialized sensing.