Oval Green LED 5484BN Specification - Dimensions 5.0mm - Voltage 2.8-3.6V - Power 100mW - English Technical Document

1. Product Overview

This document details the specifications for a precision optical performance oval LED. The device is engineered specifically for applications requiring high visibility and consistent color mixing, such as in passenger information systems and large-format signage.

1.1 Core Advantages and Target Market

The primary advantages of this LED include its high luminous intensity output and its unique oval shape, which creates a well-defined spatial radiation pattern. This pattern is characterized by a wide, asymmetrical viewing angle of 110 degrees in one axis and 40 degrees in the perpendicular axis. This feature is crucial for ensuring readability from various angles in signage applications. The device is constructed with UV-resistant epoxy, enhancing its durability for long-term outdoor use. It is designed for the commercial outdoor advertising and transportation signage markets, including color graphic signs, message boards, and variable message signs (VMS).

2. In-Depth Technical Parameter Analysis

The following sections provide a detailed breakdown of the device's electrical, optical, and thermal characteristics.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Forward Current (I_F): 30 mA (DC)
• Pulse Forward Current (I_FP): 100 mA (Duty Cycle 1/10 @ 1 kHz)
• Reverse Voltage (V_R): 5 V
• Power Dissipation (P_d): 100 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Soldering Temperature (T_sol): 260°C for a maximum of 5 seconds
• Electrostatic Discharge (ESD): Withstands 1000V (Human Body Model)

2.2 Electro-Optical Characteristics

These parameters are measured at a junction temperature (T_a) of 25°C and a standard test current of 20 mA, unless otherwise specified.

• Luminous Intensity (I_V): Ranges from 2880 mcd to 4970 mcd, categorized into specific bins (M1, M2, N1).
• Viewing Angle (2θ_1/2): 110° (X-axis) / 40° (Y-axis). This oval pattern is ideal for horizontal signage.
• Peak Wavelength (λ_p): Typically 522 nm.
• Dominant Wavelength (λ_d): Ranges from 525 nm to 535 nm, divided into fine bins (1a, 1b, 2a, 2b) for precise color matching.
• Spectral Half Width (Δλ): Typically 35 nm.
• Forward Voltage (V_F): Ranges from 2.8 V to 3.6 V at 20 mA, categorized into bins (0, 1, 2, 3).
• Reverse Current (I_R): Maximum 50 μA at a reverse voltage of 5V.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key parameters. This allows designers to select parts that meet specific application requirements for brightness and color.

3.1 Luminous Intensity Binning

Intensity is categorized into three primary ranks:

• M1: 2880 ~ 3450 mcd
• M2: 3450 ~ 4140 mcd
• N1: 4140 ~ 4970 mcd

The measurement uncertainty is ±10%.

3.2 Dominant Wavelength Binning

Color (wavelength) is finely binned into four categories to enable precise color mixing, especially with other colored LEDs:

• 1a: 525.0 ~ 527.5 nm
• 1b: 527.5 ~ 530.0 nm
• 2a: 530.0 ~ 532.5 nm
• 2b: 532.5 ~ 535.0 nm

The measurement uncertainty is ±1.0 nm.

3.3 Forward Voltage Binning

Forward voltage is binned to aid in circuit design for current regulation:

• 0: 2.8 ~ 3.0 V
• 1: 3.0 ~ 3.2 V
• 2: 3.2 ~ 3.4 V
• 3: 3.4 ~ 3.6 V

The measurement uncertainty is ±0.1 V.

4. Performance Curve Analysis

While specific graphical data is not provided in the excerpt, typical performance curves for such a device would include:

• Relative Luminous Intensity vs. Forward Current (I_V-I_F): Shows how light output increases with current, up to the maximum rating.
• Relative Luminous Intensity vs. Ambient Temperature: Illustrates the decrease in light output as temperature rises, which is critical for thermal management in enclosed signs.
• Forward Voltage vs. Forward Current (V_F-I_F): Important for designing the driving circuitry.
• Spectral Distribution: A graph showing the intensity of light emitted across different wavelengths, centered around the dominant wavelength.

Designers should consult the full datasheet for these graphs to optimize performance and reliability.

5. Mechanical and Package Information

The LED features a through-hole package with an oval lens. Key dimensional notes include:

• All dimensions are in millimeters with a standard tolerance of ±0.25 mm unless otherwise noted.
• The maximum protrusion of resin under the flange is 1.5 mm.
• The leadframe bowl geometry is defined to ensure proper light extraction and mechanical stability.

Precise mechanical drawings are essential for PCB footprint design and ensuring proper fit within the final assembly.

6. Soldering and Assembly Guidelines

Proper handling is crucial to prevent damage to the LED.

6.1 Lead Forming

• Bending must occur at least 3 mm from the base of the epoxy bulb.
• Form leads before soldering.
• Avoid applying stress to the package during forming or when inserting into PCB holes.
• Cut leads at room temperature.

6.2 Soldering Process

Maintain a minimum distance of 3 mm from the solder joint to the epoxy bulb.

• Hand Soldering: Iron tip temperature max 300°C (30W max), soldering time max 3 seconds.
• Wave/DIP Soldering: Preheat max 100°C for 60 sec max; solder bath max 260°C for 5 sec max.

Avoid multiple soldering cycles and mechanical shock while the LED is hot. Allow it to cool gradually to room temperature.

6.3 Storage Conditions

• Store at ≤30°C and ≤70% Relative Humidity after receipt.
• Shelf life under these conditions is 3 months.
• For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

7. Packaging and Ordering Information

The device is packaged to prevent electrostatic discharge (ESD) and physical damage during shipping.

7.1 Packaging Specification

• LEDs are placed in anti-static bags.
• Packing Quantity: 500 pieces per bag. 5 bags (2500 pcs) per inner carton. 10 inner cartons (25,000 pcs) per master (outside) carton.

7.2 Label Information

Labels on the packaging contain critical information for traceability and correct application:

• CPN (Customer Part Number)
• P/N (Manufacturer Part Number)
• QTY (Quantity)
• CAT (Binning code for Luminous Intensity and Forward Voltage, e.g., M2-2)
• HUE (Binning code for Dominant Wavelength, e.g., 1a)
• REF (Reference code)
• LOT No. (Production Lot Number)

8. Application Recommendations

8.1 Typical Application Scenarios

• Passenger Information Signs: In buses, trains, and airports, where the oval beam pattern provides wide horizontal visibility.
• Variable Message Signs (VMS) and Message Boards: For traffic management and outdoor advertising.
• Color Graphic Signs: Where this green LED is mixed with red and blue LEDs to create full-color images or specific color tones.

8.2 Design Considerations

• Current Driving: Always use a constant current driver or a current-limiting resistor. Do not exceed the absolute maximum forward current of 30 mA DC.
• Thermal Management: Although power dissipation is low, ensure adequate ventilation in enclosed signs, especially in high ambient temperatures, to maintain light output and longevity.
• Optical Design: The asymmetric viewing angle should be aligned with the intended viewing direction of the sign (typically with the 110° axis horizontal).
• ESD Protection Implement standard ESD handling procedures during assembly.

9. Technical Comparison and Differentiation

This LED differentiates itself through its combination of features:

• Oval Radiation Pattern: Unlike standard round LEDs, this shape is purpose-built for signage, eliminating the need for secondary optics to spread light horizontally.
• High Intensity in a Through-Hole Package: Offers a simple, robust mounting solution compared to some surface-mount alternatives, while still delivering high brightness suitable for daylight-readable signs.
• Fine Color and Intensity Binning: Enables superior color consistency across a large display, which is critical for graphic quality.
• UV-Resistant Package: Specifically designed for long-term reliability in outdoor, sun-exposed environments.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the purpose of the oval beam pattern?
A: The 110°/40° viewing angle provides a very wide horizontal coverage and a narrower vertical coverage. This is ideal for signs intended to be read by people standing or sitting over a wide area, concentrating the light where viewers are likely to be.

Q: How do I select the right bin for my application?
A: For monochromatic signs, choose a luminous intensity bin (M1, M2, N1) based on required brightness. For color-mixing applications, you must also specify the dominant wavelength bin (1a, 1b, etc.) to ensure the green color matches perfectly between different LEDs and production batches.

Q: Can I drive this LED at higher than 20 mA for more brightness?
A: You may operate it up to the Absolute Maximum Rating of 30 mA DC. However, this will increase forward voltage, power dissipation, and junction temperature, which can reduce lifespan and luminous efficiency. Always refer to the derating curves (if available) and ensure proper thermal management.

Q: Why is the storage condition and shelf life important?
A: The epoxy material and internal components can absorb moisture from the air. If a "wet" device is subjected to high-temperature soldering, the rapid vaporization of this moisture can cause internal delamination or cracking ("popcorning"), leading to failure.

11. Practical Design and Usage Case

Scenario: Designing a Full-Color Outdoor Bus Stop Display
A designer is creating an LED matrix display for real-time bus information. The display must be readable in direct sunlight and have a consistent white balance.

• LED Selection: This oval green LED is chosen alongside equivalent red and blue LEDs. The oval beam ensures good horizontal viewing for passengers waiting on a platform.
• Binning Strategy: To achieve a consistent white point, the designer orders all green LEDs from a single, narrow dominant wavelength bin (e.g., 1b) and a specific intensity bin (e.g., M2). The red and blue LEDs are sourced with matching intensity bins relative to the green to maintain the desired white balance formula.
• Circuit Design: A constant current driver is designed for each color channel. The forward voltage bin information (e.g., bin 1 for 3.0-3.2V) is used to calculate the minimum required driver voltage, ensuring it can handle the worst-case (highest V_F) LED in the batch.
• Assembly: During PCB assembly, the wave soldering profile is strictly controlled to the recommended 260°C for 5 seconds to prevent thermal damage. The 3mm lead bending rule is followed to avoid stress on the epoxy.

12. Technical Principle Introduction

This LED is based on an Indium Gallium Nitride (InGaN) semiconductor chip. When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light—in this case, green (~530 nm). The oval-shaped epoxy lens is a primary optic that molds the raw light from the chip into the desired asymmetric radiation pattern, enhancing optical efficiency for the target application.

13. Technology Trends

The development of LEDs for signage follows several key trends:

• Increased Efficiency and Luminous Intensity: Ongoing improvements in epitaxial growth and chip design yield more light output per unit of electrical input, allowing for brighter displays or lower power consumption.
• Enhanced Color Gamut and Consistency: Advances in phosphor technology (for white LEDs) and epitaxial precision (for colored LEDs like this one) enable displays with richer, more accurate, and more consistent colors.
• Improved Reliability and Lifetime: Better packaging materials, such as high-performance, UV-stable epoxies or silicones, and robust die-attach methods extend operational life, especially critical for 24/7 outdoor installations.
• Integration with Smart Drivers: LEDs are increasingly paired with intelligent driver ICs that can individually adjust brightness and perform diagnostics, enabling more dynamic and reliable display systems.

While surface-mount device (SMD) packages are prevalent for high-density displays, through-hole packages like this one remain relevant for applications requiring mechanical robustness, simpler thermal paths to a metal-core PCB, or easier field replacement.