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Photointerrupter LTH-872-N55H Datasheet - Slot Type - Dimensions 4.0mm - Voltage 5V - English Technical Document

Technical datasheet for the LTH-872-N55H photointerrupter, a slot-type optoelectronic switch. Includes absolute maximum ratings, electrical/optical characteristics, and outline dimensions.
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PDF Document Cover - Photointerrupter LTH-872-N55H Datasheet - Slot Type - Dimensions 4.0mm - Voltage 5V - English Technical Document

1. Product Overview

The LTH-872-N55H is a slot-type photointerrupter, a fundamental optoelectronic component used for non-contact sensing and switching applications. It integrates an infrared light-emitting diode (LED) and a phototransistor within a single housing, separated by a physical gap or slot. The core principle of operation is straightforward: when an object passes through this slot, it interrupts the infrared light beam traveling from the emitter to the detector, causing a corresponding change in the phototransistor's output state. This simple yet reliable mechanism makes it an ideal solution for detecting the presence, absence, position, or speed of objects without physical contact.

The device is designed for direct PCB (Printed Circuit Board) mounting or insertion into a standard dual-in-line socket, offering flexibility in assembly and prototyping. Its primary advantages include high reliability, fast switching speed, and long operational life due to the absence of mechanical contacts that can wear out. Typical applications span a wide range of office automation and industrial equipment, including but not limited to printers, photocopiers, scanners, facsimile machines, and various automated systems where precise object detection is required.

1.1 Core Features

2. Technical Parameters: In-Depth Objective Interpretation

The datasheet provides critical parameters that define the device's operational limits and performance under standard conditions. Understanding these parameters is essential for proper circuit design and ensuring long-term reliability.

2.1 Absolute Maximum Ratings

These ratings specify the stress limits that, if exceeded, may cause permanent damage to the device. They are not conditions for normal operation.

2.2 Electrical and Optical Characteristics

These parameters define the device's performance under typical operating conditions at an ambient temperature (TA) of 25°C.

3. Mechanical and Package Information

The LTH-872-N55H features a standard through-hole package designed for easy PCB integration.

3.1 Outline Dimensions

The datasheet provides a detailed mechanical drawing. Key dimensions include the overall slot width, which defines the size of the object that can be detected, and the pin spacing for PCB layout. All dimensions are specified in millimeters (mm) with a standard tolerance of ±0.25 mm unless otherwise noted. The drawing typically shows the top view, side view, and pin identification (emitter anode, emitter cathode, collector, emitter).

3.2 Polarity Identification and Pinout

Correct polarity is essential for device operation. The package has a marking or a specific pin shape (often a flat side or a notch) to identify Pin 1. The standard pinout for a 4-pin photointerrupter is: Pin 1 - Anode of IR LED, Pin 2 - Cathode of IR LED, Pin 3 - Emitter of Phototransistor, Pin 4 - Collector of Phototransistor. Always refer to the datasheet diagram to confirm the exact pin assignment for the LTH-872-N55H before designing the PCB footprint.

4. Soldering and Assembly Guidelines

4.1 Soldering Process

The device is rated for a maximum lead soldering temperature of 260°C for 5 seconds. This specification is critical for wave soldering or reflow processes. Exceeding this temperature or time can damage the internal semiconductor junctions or the plastic housing. It is recommended to follow standard IPC guidelines for through-hole component soldering.

4.2 Handling and Storage

While not explicitly detailed in the provided excerpt, general best practices apply: store components in a dry, anti-static environment within the specified storage temperature range (-40°C to +100°C). Avoid exposing the device to excessive moisture before soldering to prevent \"popcorning\" during reflow, although this is more critical for surface-mount devices.

5. Application Suggestions and Design Considerations

5.1 Typical Application Circuits

The most common configuration is to use the photointerrupter as a digital switch. A simple circuit involves:
1. LED Driver: Connect a current-limiting resistor in series with the infrared LED to a voltage source (e.g., 5V). Set the resistor value to achieve the desired IF (e.g., 20 mA). Example: Rlimit = (5V - 1.2V) / 0.02A = 190Ω (use a standard 200Ω resistor).
2. Phototransistor Output: Connect a pull-up resistor (RL) from the phototransistor's collector to a voltage source (e.g., 5V). The emitter is connected to ground. When the light path is clear, the phototransistor conducts, pulling the collector voltage (output) low. When the beam is blocked, the phototransistor turns off, and the pull-up resistor pulls the output high. The value of RL affects switching speed and current consumption; a lower value gives faster speed but higher power dissipation. The test condition in the datasheet uses RL = 100Ω.

5.2 Design Considerations

6. Performance Curve Analysis

The datasheet mentions \"Typical Electrical / Optical Characteristics Curves.\" While the specific curves are not provided in the excerpt, typical plots for such devices include:

7. Technical Comparison and Differentiation

Compared to mechanical micro-switches, the LTH-872-N55H offers superior life expectancy and reliability due to non-contact operation. It is immune to contact bounce. Compared to reflective sensors, slot-type photointerrupters provide more precise and consistent detection as they are less sensitive to the color, texture, or reflectivity of the target object; they simply detect the physical interruption of a beam. The key differentiator among photointerrupters themselves is often the slot dimensions, sensitivity (CTR), response speed, and package type (through-hole vs. surface-mount).

8. Frequently Asked Questions (Based on Technical Parameters)

Q: What happens if I drive the LED with more than 50 mA?
A: Exceeding the Absolute Maximum Rating for continuous forward current can cause excessive heating, leading to accelerated degradation of the LED's light output or catastrophic failure. Always use a current-limiting resistor.

Q: My output signal is noisy. What could be the cause?
A: Potential causes include electrical noise on the power supply lines, interference from ambient light (especially fluorescent lights operating at 50/60 Hz), or a load resistor value that is too high, making the node high-impedance and susceptible to noise. Ensure stable power, consider shielding, use a lower pull-up resistor, or implement signal modulation/demodulation.

Q: The device works at room temperature but fails when my system heats up. Why?
A: The phototransistor's sensitivity (CTR) decreases with increasing temperature. You may be operating with minimal margin at 25°C. Re-evaluate your design using the minimum IC(ON) specification and consider the typical CTR vs. Temperature curve. You may need to increase the LED drive current (within limits) or use a phototransistor with higher guaranteed CTR at elevated temperatures.

Q: Can I use this to detect a transparent object?
A: Generally, no. Standard infrared photointerrupters require the object to be opaque to the infrared wavelength emitted (typically around 940 nm). Transparent plastics or glass may allow enough IR light to pass, preventing reliable detection. Special sensors with different wavelengths or detection principles are needed for transparent materials.

9. Practical Use Case Example

Application: Paper Jam Detection in a Desktop Printer.
Implementation: The LTH-872-N55H is mounted along the paper path with the paper feeding through its slot. A microcontroller GPIO pin drives the LED via a current-limiting resistor. Another GPIO pin, configured with an internal pull-up resistor, reads the state of the phototransistor's collector. During normal operation, the paper interrupts the beam, and the output is in one logic state (e.g., HIGH). If a paper jam occurs, the paper either remains stuck (keeping the beam interrupted) or fails to reach the sensor (leaving the beam unbroken), causing the output to be in an unexpected state for too long. The microcontroller firmware monitors this signal and triggers a \"Paper Jam\" error message if the expected timing sequence is violated. The fast response time of the sensor ensures even small gaps between sheets of paper can be detected for precise paper feed monitoring.

10. Operating Principle Introduction

A photointerrupter operates on the principle of optoelectronic conversion and interruption. Internally, it houses two discrete components in alignment: an infrared light-emitting diode (IR LED) and a silicon phototransistor. The IR LED acts as the light source. When forward-biased by an external current, it emits invisible infrared photons. The phototransistor acts as the light detector. Its base region is sensitive to light. When photons from the LED strike the base, they generate electron-hole pairs, which act as base current, turning the transistor on and allowing a much larger collector current to flow. This collector current is proportional to the intensity of the incident light. The slot physically separates these two elements. An object placed in the slot blocks the light path, drastically reducing the light incident on the phototransistor, which in turn switches it off (or reduces its current). This change in output current/voltage is detected by external circuitry to register an \"interruption.\"

11. Industry Trends and Developments

The trend in optoelectronic sensors, including photointerrupters, is towards miniaturization, higher integration, and surface-mount technology (SMT) packages to accommodate smaller and denser PCB designs. There is also a move towards digital output sensors with built-in signal conditioning, which provide a clean, buffered logic-level output, simplifying interface with microcontrollers. Some advanced versions incorporate Schmitt triggers for hysteresis to improve noise immunity. Furthermore, the demand for higher precision and speed in automation drives the development of devices with narrower slots, faster response times, and improved temperature stability. The fundamental slot-type photointerrupter, as represented by the LTH-872-N55H, remains a cost-effective and highly reliable solution for a vast array of standard detection applications where its simplicity and robustness are key advantages.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.