PLCC-2 Cool White LED Datasheet - Package 3.2x2.8x1.9mm - Voltage 3.1V - Power 0.062W - English Technical Document

1. Product Overview

This document details the specifications for a surface-mount LED component utilizing the PLCC-2 (Plastic Leaded Chip Carrier) package. The device emits a Cool White light and is engineered for reliability and performance in demanding environments. Its primary design target is automotive interior lighting systems, where consistent color, brightness, and long-term stability are critical.

The core advantages of this LED include its compact form factor, wide 120-degree viewing angle suitable for diffuse illumination, and robust construction qualified to the AEC-Q101 standard for automotive components. It is also compliant with RoHS and REACH environmental directives. The typical luminous intensity is 1800 millicandelas (mcd) when driven at a standard current of 20 milliamperes (mA).

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The key operational parameters are defined under standard test conditions. The forward current (I_F) has a recommended operating point of 20 mA, with a minimum of 2 mA and an absolute maximum of 30 mA. At 20 mA, the typical forward voltage (V_F) is 3.10 Volts, with a range from 2.75V to 3.75V. This results in a typical power dissipation of approximately 62 milliwatts (0.062 Watts).

The primary photometric output is characterized by luminous intensity. The typical value is 1800 mcd, with a minimum of 1120 mcd and a maximum of 2800 mcd at 20 mA. The color is defined by CIE 1931 chromaticity coordinates, with a typical target of (0.3, 0.3). The tolerance for these coordinates is ±0.005, ensuring color consistency. The viewing angle, where luminous intensity is half of the peak value, is 120 degrees with a tolerance of ±5 degrees.

2.2 Absolute Maximum Ratings and Thermal Management

To ensure device longevity, operating conditions must never exceed the absolute maximum ratings. The maximum permissible continuous forward current is 30 mA. The device can withstand a short-duration surge current (I_FM) of 250 mA for pulses ≤ 10 microseconds. The maximum junction temperature (T_J) is 125°C. The recommended operating ambient temperature range is from -40°C to +110°C.

Thermal performance is quantified by thermal resistance. The real thermal resistance from the junction to the solder point (R_th_JS_real) is a maximum of 180 K/W. The electrical thermal resistance (R_th_JS_el), derived from the forward voltage method, is a maximum of 120 K/W. Proper PCB thermal design is essential to maintain the junction temperature within safe limits, especially at higher drive currents or elevated ambient temperatures.

3. Performance Curve Analysis

3.1 Spectral Distribution and Radiation Pattern

The relative spectral distribution graph shows the emission profile of the Cool White phosphor-converted LED. It features a broad peak in the blue region from the primary die and a broader secondary peak in the yellow/green region from the phosphor, combining to produce white light. The typical radiation pattern diagram confirms the Lambertian-like distribution with the specified 120-degree viewing angle.

3.2 Forward Current vs. Forward Voltage (IV Curve)

The graph plotting forward current against forward voltage exhibits the characteristic exponential relationship of a diode. It is crucial for circuit design to ensure the driver can provide the necessary voltage, especially considering the V_F variation over temperature and between individual units.

3.3 Temperature Dependence

Several graphs illustrate the device's behavior across temperature. The relative luminous intensity decreases as junction temperature increases, a phenomenon common to all LEDs. The forward voltage has a negative temperature coefficient, decreasing linearly with rising temperature. The chromaticity coordinates (CIE x, y) also shift with both forward current and junction temperature, which is an important consideration for color-critical applications.

3.4 Derating and Pulsed Operation

The forward current derating curve dictates the maximum allowable continuous current based on the solder pad temperature (T_S). For example, at a pad temperature of 110°C, the maximum current is 22 mA. The permissible pulse handling capability chart provides guidance for pulsed drive schemes, showing the peak pulse current (I_FP) allowable for a given pulse width (t_p) and duty cycle (D).

4. Binning System Explanation

The product is sorted into bins based on luminous intensity and chromaticity coordinates to guarantee performance consistency within a production lot.

4.1 Luminous Intensity Binning

The luminous intensity is categorized into alphanumeric bin codes ranging from L1 (11.2-14 mcd) up to GA (18000-22400 mcd). For this specific product, the typical output falls within the AB (1400-1800 mcd) and BA (1800-2240 mcd) bins, as highlighted in the datasheet. The luminous flux measurement tolerance is ±8%.

4.2 Chromaticity Binning (Cool White)

The Cool White color is defined within specific regions on the CIE 1931 chromaticity diagram. The datasheet provides the corner coordinates for several bin codes (e.g., FK0, GK0, HK0, IK0, NK0, PK0, FL0, GL0). This allows designers to select a bin that meets their precise color temperature and tint requirements. The typical target is bin NK0 with coordinates (0.3339, 0.3336).

5. Mechanical and Package Information

5.1 Mechanical Dimensions

The LED uses a standard PLCC-2 surface-mount package. The mechanical drawing specifies the critical dimensions including overall length, width, height, lead spacing, and pad positions. Adherence to these dimensions is vital for PCB footprint design and automated assembly.

5.2 Recommended Soldering Pad Layout & Polarity

A recommended solder pad land pattern is provided to ensure reliable solder joint formation and proper thermal relief. The diagram clearly indicates the anode and cathode pads. Correct polarity orientation during assembly is mandatory for the device to function.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The component is suitable for reflow soldering processes. The datasheet specifies a profile with a peak temperature of 260°C, which should not be exceeded for more than 30 seconds. The preheat, soak, reflow, and cooling rates should be controlled according to standard IPC/JEDEC guidelines for moisture-sensitive devices (MSL 2).

6.2 Precautions for Use

General handling precautions include avoiding mechanical stress on the lens, protecting the device from electrostatic discharge (ESD rated to 8 kV HBM), and storing in appropriate conditions to maintain the MSL 2 rating. The LED is not designed for reverse voltage operation.

7. Packaging and Ordering Information

The part number is 57-11-C70200H-AM. Ordering information typically includes the base part number and may involve specifying desired bins for luminous intensity and color. Packaging is usually on tape and reel for compatibility with high-speed pick-and-place assembly equipment. The exact reel dimensions and component orientation are detailed in the packaging information section.

8. Application Notes and Design Considerations

8.1 Typical Applications

The primary application is automotive interior lighting, such as illumination for dashboard switches, control panels, ambient lighting, and indicator lights. Its reliability and qualification make it suitable for other demanding environments as well.

8.2 Circuit Design Considerations

Designers must implement a constant-current driver circuit to ensure stable light output and prevent thermal runaway. The current should be set at or below 20 mA for typical operation, considering the derating requirements based on the application's thermal environment. A current-limiting resistor is insufficient for precision applications due to the V_F variation. The wide viewing angle eliminates the need for secondary optics in many diffuse lighting scenarios.

9. Technical Comparison and Differentiation

Compared to generic PLCC-2 LEDs, this device's key differentiators are its AEC-Q101 automotive qualification, which involves rigorous stress testing for humidity, temperature cycling, and operational life, and its tighter binning structure for luminous intensity and color. The 8 kV ESD rating also exceeds typical commercial-grade offerings, providing enhanced robustness against electrostatic events during handling and assembly.

10. Frequently Asked Questions (FAQ)

Q: What is the minimum current required for the LED to turn on?

A: The forward current can be as low as 2 mA, but the luminous intensity will be significantly lower than the rated value at 20 mA.

Q: How does temperature affect the light output?

A: Luminous intensity decreases as junction temperature increases. The graph in section 3.3 quantifies this relationship, showing a reduction to about 40% of its room-temperature value at 140°C junction temperature.

Q: Can I drive this LED with a 5V supply and a resistor?

A: Yes, but carefully. With a typical V_F of 3.1V, a series resistor would need to drop 1.9V at 20 mA, requiring a 95-ohm resistor. This method is sensitive to V_F and supply voltage variations, leading to changes in brightness. A constant-current driver is recommended for stable performance.

Q: What does MSL 2 mean for storage?

A: Moisture Sensitivity Level 2 indicates the package can be stored in a factory environment (

11. Design-in Case Study

Consider an automotive center console backlighting application. Multiple LEDs are placed behind a translucent plastic panel. Using the 120-degree viewing angle, fewer LEDs may be needed to achieve uniform illumination compared to a narrower-angle device. The designer selects the BA intensity bin and NK0 color bin to ensure consistent brightness and color across all units. A dedicated LED driver IC provides a constant 18 mA current to each string, slightly below the 20 mA typical to extend lifetime and account for local heating. Thermal vias are placed under the solder pads on the PCB to conduct heat away to an internal ground plane, keeping the solder pad temperature below 85°C to allow full current operation per the derating curve.

12. Operational Principle

This is a phosphor-converted white LED. The core is a semiconductor chip (typically based on InGaN) that emits blue light when forward biased (electroluminescence). This blue light is partially absorbed by a layer of yttrium aluminum garnet (YAG) phosphor coating the chip. The phosphor re-emits this energy as a broad spectrum of yellow light. The combination of the remaining blue light and the converted yellow light is perceived by the human eye as white light, specifically in the "cool white" color temperature range.

13. Technology Trends

The trend in SMD LEDs for automotive and general lighting continues towards higher efficacy (more lumens per watt), improved color rendering index (CRI), and greater reliability at higher operating temperatures. Package technology is evolving to allow for higher power density and better thermal management from the chip to the board. There is also a focus on tighter color and flux binning to reduce system cost by minimizing the need for electronic color correction. The underlying semiconductor and phosphor materials are constantly being refined for efficiency and longevity.