PLCC-2 LED 67-11-IB0100L-AM Datasheet - Ice Blue - 120\u00b0 Viewing Angle - 3.1V - 10mA - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness Ice Blue LED in a PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package. The device is engineered for reliability and performance in demanding environments, featuring a wide 120-degree viewing angle and qualified to the stringent AEC-Q101 standard for automotive components. Its primary design purpose is to provide consistent, vibrant illumination for interior automotive applications while ensuring longevity and stability under varying electrical and thermal conditions.

1.1 Core Advantages

• High Luminance Efficiency: Delivers a typical luminous intensity of 300 millicandelas (mcd) at a standard forward current of 10mA, ensuring bright and visible output.
• Wide-Angle Illumination: The 120\u00b0 viewing angle provides broad, even light distribution, ideal for backlighting panels and indicators.
• Automotive Grade Reliability: AEC-Q101 qualification confirms its suitability for the harsh environmental conditions found in automotive electronics, including wide temperature swings and vibration.
• Robust ESD Protection: Withstands Electrostatic Discharge (ESD) up to 8kV (Human Body Model), enhancing handling and assembly robustness.
• Environmental Compliance: The product is compliant with RoHS (Restriction of Hazardous Substances) and REACH regulations, supporting global environmental standards.

1.2 Target Market & Applications

The LED is specifically targeted at the automotive electronics market. Its key application areas include:

• Automotive Interior Lighting: Illumination for footwells, door handles, cup holders, and general cabin ambient lighting.
• Switch Backlighting: Providing clear visibility for buttons and controls on the dashboard, center console, and steering wheel.
• Instrument Cluster Indicators: Used for warning lights, status indicators, and gauge backlighting within the driver's instrument panel.

2. In-Depth Technical Parameter Analysis

2.1 Photometric & Electrical Characteristics

The operational parameters define the LED's performance under standard test conditions (Ts=25\u00b0C).

• Forward Current (I_F): The recommended operating current is 10mA, with an absolute maximum rating of 20mA. A minimum current of 2mA is required for operation.
• Luminous Intensity (I_V): At 10mA, the intensity typically reaches 355 mcd, with a guaranteed minimum of 140 mcd and a maximum of 560 mcd for standard bins. Measurement tolerance is \u00b18%.
• Forward Voltage (V_F): Typically 3.1V at 10mA, ranging from a minimum of 2.75V to a maximum of 3.75V. The forward voltage has a negative temperature coefficient, decreasing as junction temperature rises.
• Viewing Angle (\u03c6): Defined as the full angle where intensity drops to half its peak value. This LED offers a wide 120\u00b0 \u00b1 5\u00b0 viewing angle.
• Chromaticity Coordinates (CIE x, y): The typical color point is (0.18, 0.23), defining its Ice Blue hue. The tolerance for these coordinates is \u00b10.005.

2.2 Thermal Characteristics

Thermal management is critical for LED longevity and performance stability.

• Thermal Resistance (R_{th JS}): The junction-to-solder point thermal resistance is specified with two values: 130 K/W (real, measured) and 100 K/W (electrical, calculated). This parameter indicates how effectively heat is transferred from the LED chip to the PCB.
• Junction Temperature (T_J): The maximum allowable junction temperature is 125\u00b0C. Exceeding this limit can cause permanent degradation.
• Operating & Storage Temperature: The device is rated for continuous operation from -40\u00b0C to +110\u00b0C, making it suitable for global automotive applications.

2.3 Absolute Maximum Ratings

These are stress limits that must not be exceeded under any conditions to prevent permanent damage.

• Power Dissipation (P_d): 75 mW maximum.
• Surge Current (I_FM): Can withstand 300mA pulses for durations \u2264 10\u03bcs with a low duty cycle (D=0.005).
• Reverse Voltage (V_R): This LED is not designed for reverse bias operation. Applying reverse voltage can cause immediate failure.
• Soldering Temperature: Can endure reflow soldering with a peak temperature of 260\u00b0C for up to 30 seconds, compatible with standard lead-free soldering processes.

3. Performance Curve Analysis

3.1 Forward Current vs. Forward Voltage (I-V Curve)

The graph shows a non-linear relationship. The forward voltage increases with current but exhibits a negative temperature coefficient. Designers must account for this when designing current-limiting circuits, as V_F will drop as the LED heats up during operation.

3.2 Relative Luminous Intensity vs. Forward Current

Light output is approximately linear with current in the lower range but may show signs of efficiency droop (reduced efficacy) at currents approaching the maximum rating (20mA). Operating at or below the typical 10mA is recommended for optimal efficiency and lifetime.

3.3 Relative Luminous Intensity vs. Junction Temperature

Luminous intensity decreases as junction temperature increases. The graph shows output can drop to around 40% of its room-temperature value when T_J approaches 140\u00b0C. This underscores the importance of effective thermal PCB design (using thermal vias, adequate copper area) to maintain brightness.

3.4 Chromaticity Shift

Both forward current and junction temperature affect the LED's color coordinates. The graphs for \u0394CIE-x and \u0394CIE-y show minor shifts. While the shifts are within a small range, they should be considered for applications requiring strict color consistency across different operating conditions or in arrays of multiple LEDs.

3.5 Forward Current Derating Curve

This crucial graph defines the maximum allowable continuous forward current based on the solder pad temperature (T_S). As T_S increases, the maximum permissible I_F must be reduced to keep the junction temperature below 125\u00b0C. For example, at a T_S of 110\u00b0C, the maximum I_F is 20mA. This curve is essential for determining safe operating conditions in the final application.

3.6 Permissible Pulse Handling Capability

The graph shows the relationship between pulse width (t_p), duty cycle (D), and permissible peak pulse current (I_FA). For very short pulses (e.g., 10\u03bcs) at a low duty cycle (0.005), the LED can handle currents up to 300mA. This is useful for designing strobe or pulsed signaling functions.

3.7 Spectral Distribution

The relative spectral distribution graph shows a peak wavelength characteristic of an Ice Blue LED. The narrow, dominant peak ensures color purity. The absence of significant secondary peaks in the red or green regions confirms the intended color output.

4. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key parameters.

4.1 Luminous Intensity Binning

The LED is classified into numerous bins (L1 through GA) based on measured luminous intensity at 10mA. Each bin covers a specific range on a logarithmic scale (e.g., T1: 280-355 mcd, T2: 355-450 mcd). The datasheet highlights the \"possible output bins\" for this specific product variant. Designers must specify the required bin when ordering to guarantee brightness uniformity in an assembly using multiple LEDs.

4.2 Color Binning

The standard Ice Blue color bin structure is defined within the CIE 1931 chromaticity diagram. The provided table lists specific bin codes (e.g., CM0, CL3) with their corresponding CIE x and y coordinate boundaries. This allows selection of LEDs with nearly identical color points, which is critical for applications like backlighting where color mismatch between adjacent LEDs would be visually unacceptable.

5. Mechanical & Package Information

5.1 Mechanical Dimensions

The PLCC-2 package is a standard surface-mount design. The dimensional drawing (referenced in the PDF) provides critical measurements including body length, width, height, lead spacing, and pad positions. Adherence to these dimensions is vital for PCB footprint design and automated pick-and-place assembly.

5.2 Recommended Soldering Pad Layout

A suggested PCB land pattern (solder pad) design is provided. This pattern is optimized for reliable solder joint formation during reflow soldering, ensuring proper mechanical attachment and thermal conduction to the PCB. Following this recommendation helps prevent tombstoning or poor solder connections.

5.3 Polarity Identification

The PLCC-2 package typically has a molded notch or a marked cathode on one corner of the device body. Correct polarity orientation is essential during PCB assembly to ensure the LED functions. Applying reverse voltage is prohibited.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

The component is compatible with standard lead-free (SnAgCu) reflow soldering processes. The profile includes preheat, thermal soak, reflow, and cooling stages, with a peak temperature not exceeding 260\u00b0C for a maximum of 30 seconds. The time above 217\u00b0C (liquidus temperature) should be controlled to ensure proper solder joint formation without damaging the LED package.

6.2 Precautions for Use

• ESD Precautions: Although rated for 8kV HBM, standard ESD handling procedures (using grounded wrist straps, workstations, and conductive containers) should be followed during assembly.
• Current Limiting: Always drive the LED with a constant current source or a current-limiting resistor in series with a voltage source. Direct connection to a voltage source exceeding V_F will cause excessive current and failure.
• Thermal Management: Implement proper PCB thermal design. Use the derating curve to determine safe operating currents for the expected maximum ambient temperature and PCB thermal performance.
• Cleaning: If cleaning is required after soldering, use compatible solvents that will not damage the plastic lens or epoxy.
• Storage Conditions: Store in a dry, anti-static environment within the specified -40\u00b0C to +110\u00b0C temperature range.

7. Packaging & Ordering Information

7.1 Packaging Information

The LEDs are supplied on tape and reel, which is the standard packaging for automated surface-mount assembly equipment. The reel specifications (tape width, pocket spacing, reel diameter) are provided to ensure compatibility with assembly line feeders.

7.2 Part Number & Ordering Information

The base part number is 67-11-IB0100L-AM. This number encodes key attributes:

• 67-11: Likely indicates the package type (PLCC-2) and/or series.
• IB: Denotes Ice Blue color.
• 0100L: May relate to brightness bin or product code.
• AM: Possibly indicates automotive grade or a specific revision.

When ordering, specific bin codes for luminous intensity and color should be specified to obtain the desired performance characteristics.

8. Application Design Considerations

8.1 Driver Circuit Design

For stable operation, a constant current driver is preferred over a simple resistor-limited voltage source, especially in automotive environments where the supply voltage (e.g., 12V battery) can vary significantly. The driver should be designed to provide the desired current (e.g., 10mA) across the expected input voltage range and temperature.

8.2 Thermal Design on PCB

To maintain performance and lifespan:

• Use a PCB with sufficient copper thickness.
• Incorporate thermal relief pads connected to a larger copper plane or internal ground plane via multiple thermal vias.
• Follow the derating curve. If the PCB temperature at the solder point is expected to reach 80\u00b0C, the maximum continuous current must be reduced accordingly from the absolute maximum of 20mA.

8.3 Optical Integration

The 120\u00b0 viewing angle is suitable for wide-area illumination. For applications requiring more focused light, secondary optics (lenses, light guides) may be needed. The Ice Blue color coordinates should be considered when designing light guides or diffusers to achieve the desired final color effect.

9. Technical Comparison & Differentiation

Compared to generic PLCC-2 LEDs, this device offers distinct advantages for automotive use:

• Reliability: AEC-Q101 qualification involves rigorous stress testing (high temp storage, temperature cycling, humidity, etc.) not required for commercial-grade parts.
• Extended Temperature Range: Operating up to +110\u00b0C ambient exceeds the typical +85\u00b0C limit of commercial LEDs, which is necessary for locations near heat sources in a vehicle.
• Controlled Binning: Detailed intensity and color binning ensure consistency, which is less stringent or non-existent in lower-cost alternatives.
• ESD Robustness: 8kV HBM ESD rating provides a higher margin of safety against electrostatic damage during manufacturing and handling.

10. Frequently Asked Questions (FAQs)

10.1 What is the recommended operating current?

The typical operating current is 10mA. It can be operated from the minimum 2mA up to the absolute maximum of 20mA, but operation at 10mA provides the best balance of brightness, efficiency, and long-term reliability.

10.2 How do I select the right current-limiting resistor?

Use Ohm's Law: R = (V_supply - V_F) / I_F. Use the maximum V_F from the datasheet (3.75V) for a worst-case design to ensure the current never exceeds the desired value. For a 12V supply and 10mA target: R = (12V - 3.75V) / 0.01A = 825\u03a9. Use the next higher standard value (e.g., 820\u03a9 or 1k\u03a9) and calculate the resulting power dissipation in the resistor (P = I²R).

10.3 Why is thermal management so important?

High junction temperature directly causes three issues: 1) Luminous Output Drop: Light output decreases. 2) Color Shift: The emitted color can change. 3) Accelerated Degradation: The LED's lifespan is exponentially reduced. Proper heat sinking via the PCB is non-negotiable for maintaining specified performance.

10.4 Can multiple LEDs be connected in series or parallel?

Series connection is generally preferred because all LEDs carry the same current, ensuring uniform brightness. The supply voltage must be higher than the sum of all V_F values. Parallel connection is not recommended without individual current-limiting resistors for each LED, as small variations in V_F can cause significant current imbalance, leading to uneven brightness and potential overstress of one LED.

11. Practical Design Case Study

11.1 Automotive Dashboard Switch Backlighting

Scenario: Designing backlighting for a row of 5 identical push-button switches on a dashboard.

• Design Goal: Uniform, cool blue illumination across all buttons.
• Implementation:
  1. LED Selection: Specify part number 67-11-IB0100L-AM with a tight color bin (e.g., CM2) and a specific luminous intensity bin (e.g., T1: 280-355 mcd) to ensure consistency.
  2. Circuit: Connect all 5 LEDs in series with a single constant current driver set to 10mA. Assuming a typical V_F of 3.1V, the driver needs an output compliance voltage > 15.5V (5 * 3.1V). A 12V automotive supply is insufficient, so a boost converter or a driver operating from a regulated higher voltage (e.g., 18V) is needed.
  3. PCB Layout: Place each LED directly behind its respective switch diffuser. Design the PCB footprint exactly as per the recommended pad layout. Connect the thermal pad of each LED to a dedicated copper pour on the board with multiple thermal vias to an internal ground plane for heat dissipation.
  4. Validation: After assembly, measure the solder pad temperature near one LED during operation in a high ambient temperature chamber (e.g., +85\u00b0C). Use the derating curve to verify the 10mA current is still safe at the measured T_S.

This approach guarantees reliable, uniform, and long-lasting illumination.

12. Operating Principle

This is a semiconductor light-emitting diode (LED). When a forward voltage exceeding its bandgap energy is applied across the anode and cathode, electrons and holes recombine in the active region of the semiconductor chip (typically based on InGaN materials for blue/white/ice blue colors). This recombination process releases energy in the form of photons (light). The specific composition of the semiconductor layers determines the wavelength (color) of the emitted light. The plastic PLCC package encapsulates the chip, provides mechanical protection, and incorporates a molded lens that shapes the light output to achieve the 120\u00b0 viewing angle.

13. Technology Trends

The evolution of LEDs like this one is driven by several key trends in the automotive and general lighting industries:

• Increased Efficiency (lm/W): Ongoing material science improvements aim to produce more light output (lumens) per unit of electrical input power (watts), reducing energy consumption and thermal load.
• Higher Reliability & Lifetime: Advancements in packaging materials, die attach techniques, and phosphor technology (for white LEDs) continue to push mean time between failure (MTBF) figures higher, exceeding 50,000 hours.
• Miniaturization: The drive for smaller, denser electronic assemblies leads to the development of LEDs in even smaller package formats (e.g., chip-scale packages) while maintaining or improving light output.
• Smart & Adaptive Lighting: Integration with control systems for dynamic lighting effects, dimming, and color temperature adjustment is becoming more prevalent, though this often involves more complex LED driver ICs rather than the LED element itself.
• Stringent Quality Standards: The adoption of standards like AEC-Q102 (a more specific standard for discrete optoelectronic semiconductors in automotive applications) represents a trend towards even more specialized and rigorously tested components for automotive use.